GB2534418A - Solder mask and method of manufacturing thereof - Google Patents
Solder mask and method of manufacturing thereof Download PDFInfo
- Publication number
- GB2534418A GB2534418A GB1501211.5A GB201501211A GB2534418A GB 2534418 A GB2534418 A GB 2534418A GB 201501211 A GB201501211 A GB 201501211A GB 2534418 A GB2534418 A GB 2534418A
- Authority
- GB
- United Kingdom
- Prior art keywords
- solder mask
- dispersant
- total content
- solder
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 120
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 239000002270 dispersing agent Substances 0.000 claims abstract description 44
- 239000000853 adhesive Substances 0.000 claims abstract description 29
- 230000001070 adhesive effect Effects 0.000 claims abstract description 29
- 239000000843 powder Substances 0.000 claims abstract description 20
- 238000002156 mixing Methods 0.000 claims abstract description 18
- 239000002904 solvent Substances 0.000 claims abstract description 15
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 30
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 20
- MZMNEDXVUJLQAF-UHFFFAOYSA-N 1-o-tert-butyl 2-o-methyl 4-hydroxypyrrolidine-1,2-dicarboxylate Chemical compound COC(=O)C1CC(O)CN1C(=O)OC(C)(C)C MZMNEDXVUJLQAF-UHFFFAOYSA-N 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 18
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 claims description 17
- 229920001464 poly(sodium 4-styrenesulfonate) Polymers 0.000 claims description 17
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 15
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 15
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 15
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 10
- 229920002134 Carboxymethyl cellulose Polymers 0.000 claims description 10
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 10
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 10
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 claims description 10
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 10
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 10
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 10
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 10
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 claims description 10
- UMCMPZBLKLEWAF-BCTGSCMUSA-N 3-[(3-cholamidopropyl)dimethylammonio]propane-1-sulfonate Chemical compound C([C@H]1C[C@H]2O)[C@H](O)CC[C@]1(C)[C@@H]1[C@@H]2[C@@H]2CC[C@H]([C@@H](CCC(=O)NCCC[N+](C)(C)CCCS([O-])(=O)=O)C)[C@@]2(C)[C@@H](O)C1 UMCMPZBLKLEWAF-BCTGSCMUSA-N 0.000 claims description 9
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 9
- 229940045946 sodium taurodeoxycholate Drugs 0.000 claims description 9
- YXHRQQJFKOHLAP-FVCKGWAHSA-M sodium;2-[[(4r)-4-[(3r,5r,8r,9s,10s,12s,13r,14s,17r)-3,12-dihydroxy-10,13-dimethyl-2,3,4,5,6,7,8,9,11,12,14,15,16,17-tetradecahydro-1h-cyclopenta[a]phenanthren-17-yl]pentanoyl]amino]ethanesulfonate Chemical compound [Na+].C([C@H]1CC2)[C@H](O)CC[C@]1(C)[C@@H]1[C@@H]2[C@@H]2CC[C@H]([C@@H](CCC(=O)NCCS([O-])(=O)=O)C)[C@@]2(C)[C@@H](O)C1 YXHRQQJFKOHLAP-FVCKGWAHSA-M 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- -1 poly(sodium 4 -styrenes ulfonate) Polymers 0.000 claims description 8
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 5
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 5
- 229920002415 Pluronic P-123 Polymers 0.000 claims description 5
- 229920001213 Polysorbate 20 Polymers 0.000 claims description 5
- 229920002125 Sokalan® Polymers 0.000 claims description 5
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 5
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 5
- 229910021389 graphene Inorganic materials 0.000 claims description 5
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 claims description 5
- 239000002060 nanoflake Substances 0.000 claims description 5
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 claims description 5
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 claims description 5
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 5
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 5
- 229920001897 terpolymer Polymers 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000000230 xanthan gum Substances 0.000 claims description 5
- 229940082509 xanthan gum Drugs 0.000 claims description 5
- 229920001285 xanthan gum Polymers 0.000 claims description 5
- 235000010493 xanthan gum Nutrition 0.000 claims description 5
- 229920004890 Triton X-100 Polymers 0.000 claims 4
- 239000013504 Triton X-100 Substances 0.000 claims 4
- 239000001294 propane Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 12
- 238000004020 luminiscence type Methods 0.000 abstract description 6
- 230000002708 enhancing effect Effects 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 239000000976 ink Substances 0.000 description 16
- 229910002804 graphite Inorganic materials 0.000 description 5
- 239000010439 graphite Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000010296 bead milling Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 229940105329 carboxymethylcellulose Drugs 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- GPRLSGONYQIRFK-MNYXATJNSA-N triton Chemical compound [3H+] GPRLSGONYQIRFK-MNYXATJNSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A solder mask contains: a dispersant added at 0.1 to 1 wt% of a total content in the solder mask, an adhesive added at 0 to 20 wt% of the total content in the solder mask, solder powders added at 1 to 60 wt% of the total content in the solder mask, and a solvent added at 20 to 99 wt% of the total content in the solder mask. Also disclosed is a method of manufacturing a solder mask contains steps of: providing a first solution in which a dispersant and an ink solvent are mixed; mixing the first solution with an adhesive to form a second solution; and mixing solder powders with the second solution evenly to form the solder mask. The solder mask may be coated on a printed circuit board (PCB) and a substrate of a LED element to form a conductive heat dissipation layer on the printed circuit board (PCB) and the substrate of the LED element, thus dissipating heat, prolonging lifespan, and enhancing luminescence of the LED element, such as a LED chip.
Description
SOLDER MASK AND METHOD OF MANUFACTURING
THEREOF
FIELD OF THE INVENTION
The present invention relates to a method of manufacturing thereof which coats the solder mask on a printed circuit board (PCB) and a substrate of a LED element to form a conductive heat dissipation layer on the printed circuit board (PCB) and the substrate of the LED element, thus dissipating heat, prolonging lifespan, and enhancing luminescence of the LED element, such as a LED chip
BACKGROUND OF THE INVENTION
A conventional solder mask is coated on a printed circuit board (PCB) to avoid solders attaching on welding points of the printed circuit board. Solder mask is a thin lacquer-like layer of polymer that is usually applied to the copper traces of the printed circuit board (PCB) for protection against oxidation and to prevent solder bridges from forming between closely spaced solder pads.
However, the solder mask cannot conduct heat efficiently and cannot dissipate heat effectively.
The solder mask is coated on a LED element, such as LED chip, but luminescence of the LED element, on which the solder mask is coated, cannot obtain great luminescence.
A conventional dielectric composition is disclosed in TW Publication No. 200938036 and contains carbon material (e.g. nanometer and micron level of the carbon tubes, carbon spheres, carbon powder and carbon fiber, etc.), a carbon composite material (Carbon Matrix Composites), graphite (Graphite) or the like as a filler (Filler), and polymer (Polymer). The dielectric composition is heated to form a heat conductive dielectric layer (i.e., an insulation layer), and then a dissipating substrate and an electrode foil are pressed on a top surface and a bottom surface of the heat conductive dielectric layer. A conventional heat conductive substrate is disclosed in TW Patent No. M385199 and contains: a graphite layer, a qualitative layer, a thermal insulation layer, a conductive layer and a solder mask layer, wherein the graphite layer is made of graphite materials, the qualitative layer is made of inks and covers the graphite layer, the thermal insulation layer is configured on a top surface of the qualitative layer, the conductive layer is arranged on a top surface of the thermal insulation layer and has at least one welding points electrically connected with an electronic element. The solder mask layer is formed on the other areas of a top surface of the conductive layer besides the at least one welding points.
Nevertheless, the conventional heat conductive substrate cannot decrease heat quickly.
The present invention has arisen to mitigate and/or obviate the afore-described disadvantages.
SUMMARY OF THE INVENTION
The primary objective of the present invention is to provide a solder mask and a method of manufacturing thereof which coats the solder mask on a printed circuit board (PCB) and a substrate of a LED element to form a conductive heat dissipation layer on the printed circuit board (PCB) and the substrate of the LED element, thus dissipating heat, prolonging lifespan, and enhancing luminescence of the LED element, such as a LED chip. To obtain above objective, a solder mask provided by the present invention contains: a dispersant added at 0.1 to 1 wt% of a total content in the solder mask, an adhesive added at 0 to 20 wt% 15 of the total content in the solder mask, solder powders added at 1 to 60 wt% of the total content in the solder mask, and a solvent added at 20 to 99 wt% of the total content in the solder mask.
In one embodiment, a method of manufacturing a solder mask contains steps of providing a first solution in which a 20 dispersant and an ink solvent are mixed; mixing the first solution with an adhesive to form a second solution; and mixing solder powders with the second solution evenly to form the solder mask. In another embodiment, a method of manufacturing a solder mask contains steps of mixing a dispersant at 0.1 to 1 wt% of a total content in a solder mask, an adhesive at 0 to 20 wt% of the total content in the solder mask, and solder powders at 1 to 60 wt% of the total content in the solder mask evenly to form a first mixture; and mixing the first mixture at 50 to 100 wt5 of the total content in the solder mask and a solvent at 20 to 99 wt% of the total content in the solder mask, thus producing the solder mask Preferably, a method of manufacturing the solder mask also contains steps of: providing an ink liquid and an ink adhesive liquid, wherein the ink liquid includes a dispersant at 0.1 to 1 wt% of a total content in a solder mask and solder powders at 1 to 60 wt% of the total content in the solder mask, wherein the ink adhesive liquid ineludes an adhesive at 0 to 20 wt% of the total content in the solder mask and a solvent at 20 to 99 wt% of the total content in the solder mask; and mixing the ink liquid and the ink adhesive liquid evenly to form the solder mask.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG 1 is a flow chart of a method of manufacturing a solder mask according to a first embodiment of the present 20 invention.
FIG. 2 is a flow chart of a method of manufacturing a solder mask according to a second embodiment of the present invention.
FIG 3 is a flow chart of a method of manufacturing a solder mask according to a third embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT S
A solder mask according to a preferred embodiment of the present invention comprises: a dispersant added at 0.1 to 1 wt% of a total content in the solder mask, an adhesive added at 0 to 20 wt% of the total content in the solder mask, solder powders added at 1 to 60 wt% of the total content in the solder mask, and a solvent added at 20 to 99 wt% of the total content in the solder mask.
The solder powders are made of any one of graphitic nanoflake, graphene, carbon canotube (CNT), and boron nitride (BN). The dispersant, the adhesive, the solder powders, and the solvent are mixed homogeneously in any one of a stirring manner, a ball milling manner, a bead milling manner, a high shear stirring manner, an ultrasonic homogenizing manner, a centrifugal mixing manner, an emulsifying manner, and a high pressure cutting manner.
Preferably, the solder mask is in a batch production or in a continuous production.
With reference to FIG 1, a method of manufacturing a solder mask according to a first embodiment of the present invention comprises steps of: providing a first solution in which a 25 dispersant and an ink solvent are mixed; mixing the first solution with an adhesive to form a second solution; and mixing solder powders with the second solution evenly to form the solder mask. The dispersant is ionic dispersant or non-ionic dispersant, wherein the ionic dispersant is any one of P-123, Tween 20, 5 Xanthan gum, Carboxymethyl Cellulose (CMC), Triton X-10, Polyvinylpyrrolidone (PVP), and Brji 30. The non-ionic dispersant is any one of poly(sodium 4-styrenesulfonate) (PSS), 3[(3-Cholamidopropyl)dimethylammonio1-1-propanesufonate (CHAPS), Hexadecyltrimethylammonium bromide (HTAB), 10 Sodium taurodeoxycholate hydrate (SDS), and 1-Pyrenebutyric acid (PBA).
The ink solution is any one of water, anisole, Methyl-2-pyrrolidone (NMP), IPA (Isopropyl alcohol), ethanol, glycerol, ethylene glycol, butanol, propanol, propylene glycol monomethyl ether (PGME), and propylene glycol monomethyl ether acetate (PGMEA).
The adhesive is any one of epoxy, siloxane, poly(methyl methacrylate (PM:MA), styrene-butadiene rubber (SBR), carboxym ethyl cellul ose (C M C), polyvinyl alcohol (P VA), polyacrylic acid (PAA), ethylene-vinyl acetate (EVA), polyacrylic (LA) terpolymer, and polyvinylidene difluoride (PVDF).
Referring to FIG. 2, a method of manufacturing a solder mask according to a second embodiment of the present invention comprises steps of: mixing a dispersant at 0.1 to 1 wt% of a total 25 content in a solder mask, an adhesive at 0 to 20 wt% of the total content in the solder mask, and solder powders at 1 to 60 wt% of the total content in the solder mask evenly to form a first mixture; and mixing the first mixture at 50 to 100 wt5 of the total content in the solder mask and a solvent at 20 to 99 wt% of the total content in the solder mask, thus producing the solder mask.
As shown in FIG. 3, a method of manufacturing a double dosage solder mask according to a third embodiment of the present invention comprises steps of; providing an ink liquid and an ink adhesive liquid, wherein the ink liquid includes a dispersant at 0.1 to 1 wt% of a total content in a solder mask and solder powders at 1 to 60 wt% of the total content in the solder mask, wherein the ink adhesive liquid includes an adhesive at 0 to 20 wt% of the total content in the solder mask and a solvent at 20 to 99 wt% of the total content in the solder mask; and mixing the ink liquid and the ink adhesive liquid evenly to form the solder mask.
Thereby, the solder mask is coated on a printed circuit board (PCB) and a substrate of a LED element to form a conductive heat dissipation layer on the printed circuit board (PCB) and the substrate of the LED element, wherein the solder mask is coated on the printed circuit board (PCB) and the substrate in any one of a spray coating manner, a squeegee coating manner, a spin coating manner, a dip coating manner, and a screen printing manner, thus dissipating heat, prolonging lifespan, and enhancing luminescence of the LED element, such as a LED chip.
Preferably, after the solder mask is coated on an electronic product, the electronic product is dried in any one of a baking manner by using a baking furnace, a UV curing manner, and in an infrared (a) irradiating manner, wherein a baking temperature of the baking furnace is within 60 to 200 °C.
While the preferred embodiments of the invention have been set forth for the purpose of disclosure, modifications of the disclosed embodiments of the invention as well as other embodiments thereof may occur to those skilled in the art. Accordingly, the appended claims are intended to cover all embodiments which do not depart from the spirit and scope of the invention.
Claims (15)
- WHAT IS CLAIMED IS: 1. A solder mask comprising: a dispersant added at 0.1 to 1 wt% of a total content in the solder mask, an adhesive added at 0 to 20 wt% of the total content in the solder mask, solder powders added at 1 to 60 wt% of the total content in the solder mask, and a solvent added at 20 to 99 wt% of the total content in the solder mask.
- 2. The solder mask as claimed in claim 1, wherein the dispersant is ionic dispersant or non-ionic dispersant; the ionic 10 dispersant is any one of P-123, Tween 20, Xanthan gum, Carboxymethyl Cellulose (CMC), Triton X-100, Polyvinylpyrrolidone (PVP), and Brji 30; and the non-ionic dispersant is Poly (sodium 4-styrenesulfonate) (PSS), 3-[(3-Cholamidopropyl)dimethyl ammonio]-1-propanesufonate (CHAPS), Hexadecyltri methyl ammonium bromide (H TA B), Sodium taurodeoxycholate hydrate (SDS), and 1-Pyrenebutyric acid (PBA); the non-ionic dispersant is any one of poly(sodium 4 -styrenes ulfonate) (PS S), 34(3 -Cholamidopropyl)dimethylammonio] -1-propanesufonate (CHAPS), Hexadecyltrimethylammonium bromide (HTAB), Sodium taurodeoxycholate hydrate (SDS), and 1-Pyrenebutyric acid (PBA); the ink solution is any one of water, anisole, Methyl-2-pyrrolidone (NMP), IPA (Isopropyl alcohol), ethanol, glycerol, ethylene glycol, butanol, propanol, propylene glycol monomethyl ether (PGME), and propylene glycol monomethyl ether acetate (PGMEA); the adhesive is any one of epoxy, siloxane, poly(methyl methacrylate (PMIMA), styrene-butadiene rubber (SBR), carboxymethylcellulose (CMC), polyvinyl alcohol (PVA), polyacrylic acid (PAA), ethylene-vinyl acetate (EVA), polyacrylic (LA) terpolymer, and polyvinylidene difluoride (PVDF).
- 3. The solder mask as claimed in claim 1, wherein the solder powders are made of any one of graphitic nanoflake, 10 graphene, carbon canotube (CNT), and boron nitride (BN).
- 4. A method of manufacturing a solder mask comprising steps of providing a first solution in which a dispersant and an ink solvent are mixed; mixing the first solution with an adhesive to form a second solution; and mixing solder powders with the second solution evenly to form the solder mask.
- 5. The method of manufacturing the solder mask as claimed in claim 4, wherein the dispersant is ionic dispersant or non-ionic dispersant; the ionic dispersant is any one of P-123, Tween 20, Xanthan gum, Carboxymethyl Cellulose (CMC), Triton X-100, Polyvinylpyrrolidone (PVP), and Brji 30; and the non-ionic dispersant is Poly (sodium 4-styrenesulfonate) (PSS), 3 -[(3-Ch ol am i dopropyl)di methyl am m on i o] -1 -propane sufonate (CHAPS), Hexadecyltrimethylammonium bromide (HTAB), Sodium taurodeoxycholate hydrate (SDS), and 1-Pyrenebutyric acid (PBA); the non-ionic dispersant is any one of poly(sodium 4 -styren esul fon ate) (PSS), 34(3 -Cholamidopropyl)dimethylammonio] -1-propanesufonate (CHAPS), Hexadecyltrimethylammonium bromide (HTAB), Sodium taurodeoxycholate hydrate (SDS), and 1-Pyrenebutyric acid (PBA); the ink solution is any one of water, anisole, Methyl-2-pyrrolidone (NMP), IPA (Isopropyl alcohol), ethanol, glycerol, ethylene glycol, butanol, propanol, propylene glycol monomethyl ether (PGME), and propylene glycol monomethyl ether acetate (PGMEA); the adhesive is any one of epoxy, siloxane, poly(methyl methacrylate (PMMA), styrene-butadiene rubber (SBR), carboxymethylcellulose (CMC), polyvinyl alcohol (PVA), polyacrylic acid (PAA), ethylene-vinyl acetate (EVA), polyacrylic (LA) terpolymer, and polyvinylidene difluoride (PVDF).
- 6. The method of manufacturing the solder mask as claimed in claim 4, wherein the solder powders are made of any one of graphitic nanoflake, graphene, carbon canotube (CNT), and boron nitride (BN).
- 7. A method of manufacturing a solder mask comprising steps of mixing a dispersant at 0.1 to 1 wt% of a total content in a solder mask, an adhesive at 0 to 20 wt% of the total content in the solder mask, and solder powders at 1 to 60 wt% of the total content in the solder mask evenly to form a first mixture; and mixing the first mixture at 50 to 100 wt5 of the total content in the solder mask and a solvent at 20 to 99 wt% of the total content in the solder mask, thus producing the solder mask
- 8. The method of manufacturing the solder mask as claimed in claim 7, wherein the dispersant is ionic dispersant or non-ionic dispersant; the ionic dispersant is any one of P-123, Tween 20, Xanthan gum, Carboxymethyl Cellulose (CMC), Triton X-100, Polyvinylpyrrolidone (PVP), and Brji 30; and the non-ionic dispersant is Poly (sodium 4-styrenesulfonate) (PSS), 3-[(3-Cholamidopropyl)dimethyl ammonio]-1-propanesufonate (CHAPS), Hexadecyltrimethylammonium bromide (HTAB), Sodium taurodeoxycholate hydrate (SDS), and 1-Pyrenebutyric acid (PBA); the non-ionic dispersant is any one of poly(sodium 4-styrenesulfonate) (PSS), 34(3 -Cholamidopropyl)dimethylammonio] -1-propanesufonate (CHAPS), Hexadecyltrimethylammonium bromide (HTAB), Sodium taurodeoxycholate hydrate (SDS), and 1-Pyrenebutyric acid (PBA); the ink solution is any one of water, anisole, Methyl-2-pyrrolidone (NMP), IPA (Isopropyl alcohol), ethanol, glycerol, ethylene glycol, butanol, propanol, propylene glycol monomethyl ether (PGME), and propylene glycol monomethyl ether acetate (PGMEA); the adhesive is any one of epoxy, siloxane, poly(methyl methacrylate (PMMA), styrene-butadiene rubber (SBR), carboxymethylcellulose (CMC), polyvinyl alcohol (PVA), polyacrylic acid (PAA), ethylene-vinyl acetate (EVA), polyacrylic (LA) terpolymer, and polyvinylidene difluoride (PVDF).
- 9. The method of manufacturing the solder mask as claimed in claim 7, wherein the solder powders are made of any one of graphitic nanoflake, graphene, carbon canotube (CNT), and boron nitride (BN).
- 10. A method of manufacturing the solder mask as claimed in claim 1 comprising steps of: providing an ink liquid and an ink adhesive liquid, wherein the ink liquid includes a dispersant at 0.1 to 1 wt% of a total content in a solder mask and solder powders at 1 to 60 wt% of the total content in the solder mask, wherein the ink adhesive liquid includes an adhesive at 0 to 20 wt% of the total content in the solder mask and a solvent at 20 to 99 wt% of the total content in the solder mask; and mixing the ink liquid and the ink adhesive liquid evenly to form the solder mask.
- 11. The method of manufacturing the solder mask as claimed in claim 10, wherein the dispersant is ionic dispersant or non-ionic dispersant; the ionic dispersant is any one of P-123, Tween 20, Xanthan gum, Carboxymethyl Cellulose (CMC), Triton X-100, Polyvinylpyrrolidone (PVP), and BO 30; and the non-ionic dispersant is Poly (sodium 4-styrenesulfonate) (PSS), 34(3 -Cholamidopropyl)dimethyl ammonio]-I -propane s ufonate (CHAPS), Hexadecyltrimethylammonium bromide (HTAB), Sodium taurodeoxycholate hydrate (SDS), and 1-Pyrenebutyric acid (PBA); the non-ionic dispersant is any one of poly(sodium 4-styrenesulfonate) (PSS), 34(3 -Cholamidopropyl)dimethylammonio] -1 -propanesufonate (CHAPS), Hexadecyltrimethylammonium bromide (HTAB), Sodium taurodeoxycholate hydrate (SDS), and 1 -Pyrenebutyric acid (PBA); the ink solution is any one of water, anisole, Methyl-2-pyrrolidone (NMP), IPA (Isopropyl alcohol), ethanol, glycerol, ethylene glycol, butanol, propanol, propylene glycol monomethyl ether (PGME), and propylene glycol monomethyl ether acetate (PGMEA); the adhesive is any one of epoxy, siloxane, poly(methyl methacrylate (PMIMA), styrene-butadiene rubber (SBR), carboxymethylcellulose (CMC), polyvinyl alcohol (PVA), polyacrylic acid (PAA), ethylene-vinyl acetate (EVA), polyacrylic (LA) terpolymer, and polyvinylidene difluoride (PVDF).
- 12. The method of manufacturing the solder mask as claimed in claim 10, wherein the solder powders are made of any 20 one of graphitic nanoflake, graphene, carbon canotube (CNT), and boron nitride (BN).
- 13. A solder mask substantially as hereinbefore described, with reference to and as shown in the accompanying drawings.
- 14. A method of manufacturing a solder mask substantially as hereinbefore described.
- 15. A solder mask made by the method of claim 14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1501211.5A GB2534418A (en) | 2015-01-26 | 2015-01-26 | Solder mask and method of manufacturing thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1501211.5A GB2534418A (en) | 2015-01-26 | 2015-01-26 | Solder mask and method of manufacturing thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB201501211D0 GB201501211D0 (en) | 2015-03-11 |
| GB2534418A true GB2534418A (en) | 2016-07-27 |
Family
ID=52673895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1501211.5A Withdrawn GB2534418A (en) | 2015-01-26 | 2015-01-26 | Solder mask and method of manufacturing thereof |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2534418A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0271271A (en) * | 1988-09-07 | 1990-03-09 | Tokyo Ohka Kogyo Co Ltd | Formation of photosolder resist pattern |
| US6121358A (en) * | 1997-09-22 | 2000-09-19 | The Dexter Corporation | Hydrophobic vinyl monomers, formulations containing same, and uses therefor |
| CN103910976A (en) * | 2014-03-12 | 2014-07-09 | 广东普赛特电子科技股份有限公司 | A nano-modified solder resist |
-
2015
- 2015-01-26 GB GB1501211.5A patent/GB2534418A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0271271A (en) * | 1988-09-07 | 1990-03-09 | Tokyo Ohka Kogyo Co Ltd | Formation of photosolder resist pattern |
| US6121358A (en) * | 1997-09-22 | 2000-09-19 | The Dexter Corporation | Hydrophobic vinyl monomers, formulations containing same, and uses therefor |
| CN103910976A (en) * | 2014-03-12 | 2014-07-09 | 广东普赛特电子科技股份有限公司 | A nano-modified solder resist |
Also Published As
| Publication number | Publication date |
|---|---|
| GB201501211D0 (en) | 2015-03-11 |
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| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |