GB2524334A

GB2524334A - Adjustable headset

Info

Publication number: GB2524334A
Application number: GB1405128.8A
Authority: GB
Inventors: James Clarke
Original assignee: Individual
Current assignee: Individual
Priority date: 2014-03-21
Filing date: 2014-03-21
Publication date: 2015-09-23
Anticipated expiration: 2034-03-21
Also published as: GB201405128D0; GB2524334B

Abstract

The headset kit comprises modularly separable elements to facilitate the conversion of the headset from a monaural to a binaural configuration, and vice versa. The headset kit has a single microphone and speaker unit 100 that is able to be interchangeably and reversibly attached to and detached from an exchangeable headband 200, 400 by a user. This allows either a monaural headset configuration or binaural headset configuration, based on varying user preference.

Description

ADJUSTABLE HEADSET

Field of the Invention

The present invention relates to a headset for use in telecommunications.

Background of the Invention

As is known in the art, there are typically two broad categories of telecommunications headset: those which have a headband with two speakers positioned over either ear, and those which have a headband with a single speaker over one ear and a head-support positioned above the other ear. Different users of such headsets will each have different preferred headset setups, and even a single user may change preference over time. The provision of these different headsets, as dictated by varying preferences. is expensive, especially for a large user group such as a cal-ccntre.

Statement of the Invention

It would be beneficial in the field, if a headset design were envisaged in which the most expensive elements of the headset common to both designs, namely the microphone and a sing'e speaker, were moduarly separable from the other elements.

In this way the expensive elements need only be purchased once, thus allowing the user to change preference at a subsequent time by purchasing the relatively inexpensive other desired configuration.

The aspects of the present invention are defined by the accompanying claims.

Preferred embodiments of the invention are now described, by way of example only, with reference to the accompanying drawings.

Brief Description of the Drawings

There now follows, by way of example only, a detailed description of preferred embodiments of the present invention, with reference to the figures identified below.

S

Fig. 1 is a perspective view of the integrated microphone and speaker assembly.

Fig. 2 is a perspective view of a binaural headset part.

Fig. 3 is a perspective view of a complete binaural headset configuration.

Fig. 4 is a perspective view of a monaural headset part.

Fig. S is a perspective view of a complete monaural headset configuration.

Fig. 6 is a perspective view of a microphone and speaker assembly housing.

Fig. 7 is a front view of a microphone and speaker assembly housing.

Fig. S is a perspective view of a microphone and speaker assembly.

Fig. 9 is a front view of a microphone and speaker assembly.

Fig. 10 is a front view of a microphone and speaker assembly housing.

Detailed Description

In the foflowing description, functionally similar parts carry the same reference numerals between the figures.

RefelTing to Fig. 1. an integrated microphone and speaker assembly 100 is shown.

The microphone and speaker assembly 100 comprises a microphone housing 102 attached at one end of a support arm 104. At the opposite end to the microphone housing 102, the support arm 104 is attached to a connecting portion 106. The connecting portion 106 physically connects the support arm 104 to the speaker housing 108. The connecting portion 106 is interfaced with the speaker housing 108 to allow the relative independent rotation of the connecting portion 106 to the speaker housing 108. The speaker housing 108 has an electrical wire 110 entering from below.

The microphone and speaker assembly 100 houses electrical wiring internally so as to electrically connect the microphone and the speaker to the wire 110 leading to further electrical components not shown here. The microphone housing 102 and the speaker housing 108 contain a microphone and speaker respectively, both of which are typical in the field of headphone design and are not discussed further here. Herein, the microphone housing 102 and the speaker housing 108 will be referred to simply as the "microphone" and "speaker" respectively.

In operation, the microphone and speaker assembly IOU has an electrica' signal applied to it through wire 110, thereby electrically activating the microphone 102 and the speaker 108 by means of the internal wiring of the microphone and speaker assembly IOU. The microphone 102 receives audible sound and transmits this as an electrical signal through the wire 110 for further processing on external means in a manner typical in the field. Similarly, the speaker 108 receives an electrical signal through the wire 110 from external means and converts this into audible sound in a manner typica' in die fidd.

The connecting portion 106, as well as the support aim 104 and the microphone 102 rotate relative to the speaker housing 108, to be orientated in a direction of preference of the user. The connecting portion 106 is able to rotate through a maximum angular range of 330° to maintain the integrity of the electrical wiring internal to the speaker and microphone assembly 100. The angular range of rotation is illustrative only, and other embodiments could be envisaged (e.g. between 30° and 120°) which still fall within the scope of this disclosure. The relative rotation of the connecting portion 106, support arm 104 and microphone 102 is advantageous in that it allows the user to position the microphone in a preferential orientation whilst ensuring the location of the wire 110 does not interfere with the use of the device. This advantage will be further emphasised in later embodiments of the full setup.

RefeiTing to Fig. 2, a binaural headset part 200 is shown. Microphone and speaker assembly housing 202 is constructed to receive the microphone and speaker assembly of Fig. 1 into the cavity 204 in a male to female connection, the details of which are described further below. A wire recess 206 is optimally located to receive the wire 110 of Fig. 1. Headband portion 208 interfaces with each of the headband housings 210 and 212 to collectivdy form the headband portion of the binaural headset part 200. Headband portion 208 and headband housings 210 and 212 collectively contain electrical wiring to connect the microphone and speaker assembly housing 202 to the speaker housing 214, in which there is a speaker typical in the field of headphone design and which is not discussed further here. Speaker housing 214 has a cushion 216. Similarly, microphone and speaker assembly housing 202 has a cushion 218. Cushions 216 and 218 are preferably formed of soft plastics material S such as polyurethane, injection moulded integral with the headband, hut may be formed of foam or sponge.

In operation, headband portion 208 is extendahle and retractable in a telescopic manner, with a flexible ribbon wire extending in a concertina or S-shape to allow for extension without tension on the wire, wherein headband portion 208 extends in a telescopic manner into the headband housings 210 and 212 (or vice-versa), and can be slid into and out of one or both of the headband housings 210 and 212 independently up to a certain defined limit, thereby ensuring the headband portion 208 and the headband housings 210 and 212 do not completely separate. This var able length IS accommodates the differing preferences of users, as the headband portion 208 and the headband housings 210 and 212 rest against the head of the user.

The cushions 216 and 218 facilitate comfortable use of the headset and rest against the ears of the user. There is no electrical operation of the binaural headset part 200 alone, as there is no electrical input or output without the integration of the microphone and speaker assembly 100 of Fig. 1. As such. further operational details of the headset will be described following Fig. 3 below.

Relerring to Fig. 3, a complete binaural headset conliguration 300 is shown, which consists of the integration of the microphone and speaker assembly 100 from Fig. 1 with the binaural headset part 200 of Fig. 2. A specific method of physical integration of the microphone and speaker assembly 100 with the binaural headset part 200 will be described in further detail below.

In operation, upon application of an electrical current along wire 110, the microphone 102 receives audible sound and transmits this as an electrical signal through the wire for further processing on external means in a manner typical in the field. Speaker 108 receives an electrical signal through the wire 110 from external means and converts this into audible sound in a manner typical in the field. Similarly, speaker 214 receives an electrical signal originating from the wire 110, which is carried across the headband portion 208 by electrical wiring internal to the headband portion 208, and converts this into audible sound in a manner typical in the field. The microphone 102 and both of the speakers 108 and 204 can operate simultaneously. hi a manner similar to that described with reference to Fig. I above, the microphone support arm 104 and each component fixed to it rotates relative to the entire binaural headset part 200.

RefelTing to Fig. 4, a monaural headset part 400 is shown. Microphone and speaker assembly housing 202 is constructed to receive the microphone and speaker assembly of Fig. 1 into the cavity 204 in a male to female connection, the details of which are described further hdow. The wire recess 206 is optimally located to receive the wire 110 of Fig. 1. Headband portion 208 interfaces with the headband housing 210 to collectively form the headband portion of the binaural headset part 200. Head support 402 is attached at the end of headband portion 208 and projects inwards.

Head support 402 is formed from a material typical in the field of headphone design, such as rubber. Microphone and speaker assembly housing 202 has a cushion 218.

Cushion 218 is preferably soft plastics material such as polyurethane, injection moulded integral with the headband, but may be formed of foam or sponge.

hi operation, headband portion 208 is extendable and retractable in a telescopic manner typical in the field of headphone design, wherein headband portion 208 extends in a telescopic manner into the headband housing 210 (or vice-versa), and can he slid into and out of the headband housing 210 up to a certain delined limit, thereby ensuring the headband portion 208 and the headband housing 210 do not completely separate. This variable length accommodates the differing preferences of users, as the headband portion 208 and the headband housing 210 rests against the head of the user.

Similarly, the cushion 218 facilitates comfortable use of the headset and rests against the ear of the user. The head support 402 rests above the ear of the user ensuring that the monaural headset part 400 remains stable upon the user's head.

There is no electrical operation of the monaural headset part 400 as there is no electrical input or output without the integration of the microphone and speaker assembly 100 of Fig. 1.

RefelTing to Fig. 5, a complete monaural headset configuration 500 is shown, which consists of the integration of the microphone and speaker assembly 100 from Fig. 1 with the monaural headset part 400 of Fig. 4. A specific method of physical S integration of the microphone and speaker assembly 100 with the monaural headset put 400 will be described in further detail below.

In operation, the features of the complete monaural headset configuration 500 correspond to those descr bed with reference to Fig. 3 above. The features of difference are the replacement of the second speaker 214 with the head support 402, and the removal of the electrical wiring passing through the headband portion 208 as discussed in relation to Fig. 2.

RefelTing to Figs. 6 to 9, the figures and description are appropriate to both monaural IS headset configuration 500 of Fig. 5 as well as the binaural headset configuration 300 of Fig. 3, with (he exception (hat when the components are used in the monaural headset configuration 500 of Fig. 5, there are no electrical contacts 602 on the speaker housing 108.

Referring to Fig. 6 and Fig. 7. detafled views of the microphone and speaker assembly housing 202 of Fig. 2 are shown from a perspective view and a front view respectively. Speaker assembly housing 202 forms part of a complete headset configuration, which can be either the binaural headset part 200 of Fig. 2 or the monaural headset part 400 of Fig. 4. Electrical contacts 602 are located on the top of the inner surface of the cavity 204. Guides 604 are located on both the top and the bottom of the inner surface of the cavity 204. Snap-fit locks 606 are located in four places on the inner surface of the cavity 204, two in the upper portion, two in the lower portion. Each snap-fit lock 606 is equidistant from the two other snap-fit locks 606 on either side of itself. The electrical contacts 602 are preferably sprung to ensure reliable electrical connections with their respective female counterparts. The guides 604 are preferably asymmetrically located within the inner cavity 204 such that there is only a single allowable orientation in which they will combine with their respective counterparts. The snap-fit locks 606 are preferably equidistant and symmetrically located around the inner surface of the cavity 204 to ensure a uniform and secure retention when combined with their respective counterparts. The electrical contacts 602 are made from an electrically conductive material. The guides 604 and the snap-fit locks 606 are made of plastics. Alternative snap-fit lock mechanisms 606 can be envisaged which achieve (he same functional result. Alternative embodiments S in which the number and location of the electrical contacts 602, the guides 604 and the snap-fit locks 606 can be envisaged. The wire recess 206 from earlier figures is not shown here for simplicity, but may still be incorporated in alternative embodiments.

The operation of the features of Fig. 6 and Fig. 7 will be described following the

description of Fig. 8 and Fig. 9.

Referring to Fig. 8 and Fig. 9, detailed views of the microphone and speaker assembly of Fig. 1 are shown from a perspective view and a front view respectively.

Electrical contacts 802 are located on the top of the speaker housing 108. Guides 804 are located on both the (op and (he bottom of the speaker housing 108. Snap-fit locks 806 are located in four places on the speaker housing 108, two in the upper portion, two in the lower portion. Each snap-fit lock 806 is equidistant from the two other snap-fit locks 806 on either side of itself. The electrical contacts 802 form reliable electrical connections with their respective sprung electrical contacts 602. The guides 804 are preferably asymmetrically located on the speaker housing 108 such that there is only a single allowable orientation in which they will combine with their respective guides 604. The snap-fit locks 806 are preferably equidistant and symmetrically located on the speaker housing 108 to ensure a uniform and secure retention when combined with the snap-fit locks 606. Thc guides 804 and the snap-fit locks 806 are made of plastics material. Alternative snap-fit lock mechanisms 806 can be envisaged which achieve the same functional result. Alternative embodiments in which the number and location of the electrical contacts 802, the guides 804 and the snap-fit locks 806 can be envisaged. Alternative embodiments in which the components 802, 804 and 806 are present on the microphone and speaker assembly housing 202. and in which the components 602, 604 and 606 are located on the speaker housing 108. or any compatible permutation of these features, can he envisaged. The electrical wire from earlier figures is not shown here for simplicity, but may still be incorporated in alternative embodiments.

lii operation, the microphone and speaker assembly 108 of Fig. 8 and Fig. 9 is inserted into the microphone and speaker assembly housing 202 of Fig. 6 and Fig. 7 by the user. The asymmetrical location of the guides 604 and 804 ensures that there is only a single allowable alignment in which the speaker housing 108 can he inserted into the microphone and speaker assembly housing 202. The interlocking alignment of the guides 604 and 804 allows the insertion of the speaker housing 108 into the microphone and speaker assembly housing 202. This insertion encounters resistance at the point at which the snap-fit locks 606 and 806 come into contact before interlocking. Upon application of a typical finger-strength force applied laterally to speaker housing 108, in the direction of the insertion, this resistance is overcome ensuring the secure interlocking comhination of snap-fit locks 606 and 806. The electrical contacts 602 and 802 combine, and through cooperating spring mechanisms come into sufficient electrical contact to allow electrical current to pass between them.

Referring to Fig. 10, a detailed view of a preferred microphone and speaker assembly housing 202 of Fig. 2 is shown from a front view. Speaker assembly housing 202 forms part of a complete headset configuration, which can be used in the binaural headset part 200 of Fig. 2. The features of Fig. 10 are similar to those of the Fig. 6 embodiment, differing in the arrangement of the dectrical contacts 602. In this alternate embodiment, the electrical contacts 602 are located at positions diametrically opposed to each other on the inner surface of the cavity 204. The respective electrical contacts 802 of the microphone and speaker assembly 100 of Figs. 8 and 9 are correspondingly located.

lii this arrangement, the output of both of the speakers when used in the binaural headset configuration 300 of Fig. 3 will be monophonic sound. If there are two input channels, they arc both output through both speakers, monophonically.

lii an alternative arrangement., monophonic sound is output in the monaural configuration and stereophonic sound is output. in the binaural arrangement. This can he achieved by means of a stereo-to-mono connection which is dosed in the monaural configuration and open in the binaural configuration.

For example. a third electrical contact can be provided in the niicrophone and speaker assembly 100, e.g. located above one of the electrical contacts 602, such that there are two electrical contacts on one side of the inner surface of the cavity 204, and one electrical contact diametrically opposed to these on the opposite side of the inner S surface of the cavity 204. One of these adjacent connections connects to the input jack and the other to the speaker. These can be shorted in the monaural configuration by a conductor element on the inside of speaker housing 202, thereby combining the left and right channels into one speaker. In the binaural configuration, such a conductor element is omitted and only the input channel (from the input jack) connects to the speaker housing 202 of the binaural headband.

In this arrangement the output of both the speakers. when used in the binaural headset configuration 300 of Fig. 3 can be stereophonic sound.

As an alternative to a stereo-to-mono connection, a switch may serve the same purpose, e.g. a magnetic switch that is closed by a magnet that is present on the speaker assembly housing 202 of the monaural headset part 400 hut absent on the binaural headset 300.

In simple. inexpensive embodiment, the output of speaker 108 is just one of the stereo channels (e.g. the right channel) and the other channel connects to the other speaker 214 of the binaural headband only when it is connected.

In (his present disclosure, the combination, by (he user. ol (lie microphone and speaker assembly 108 of Fig. 8 and Fig. 9 and the microphone and speaker assembly housing 202 of Fig. 6 and Fig. 7 results in the formation of either the complete binaural headset configuration 300 of Fig. 3 or the complete monaural headset configuration 500 of Fig. 5. Upon application of a typical finger-strength force applied in the opposite direction to insertion, the resistance from the snap-fit locks 606 and 806 is overcome and the microphone and speaker assembly 100 separates from the microphone and speaker assembly housing 202.

The cmboclimcnts described above arc illustrative of, rather than limiting to, the present invention. Alternative embodiments apparent on reading the above description may nevertheless fall within the scope of the invention.

Claims

Claims L A kit of parts compi-ising: a microphone and speaker assembly, and a headband to which the microphone and speaker assembly can be manually and reversibly attached and detached, such that the headband can be replaced with an alternative headband to suit the user.
2. The kit of claim 1, wherein the microphone and speaker assembly comprises electrical connections for connection to the headband.
3. The kit of claim 1 or 2. wherein the headband is a first headband that has no speaker such that, when the microphone and speaker assembly is attached, the combination form a monaural headset.
4. The kit of claim 1 or 2, wherein the headband is a second headband that comprises a second speaker such that, when the microphone and speaker assembly is attached, the combination form a binaural headset.
5. The kit of parts of any of claims 1 to 4, wherein the headband has an annular portion into which the microphone and speaker assembly fits, and can be manually and reversibly attached and separated.
6. The kit of parts of claim 5, wherein there are plural mutually cooperadve guiding elements located on both the annular portion and the microphone and speaker assembly.
7. The kit of parts of claim 5 or 6, wherein there are plural mutually cooperative retention means located on both the annular portion and the microphone and speaker assembly.
8. The kit of parts of claim 5, 6 or 7, whercin there is at least one pair of mutually coopcradng electrical connections located on both the annular pordon and the microphone and speaker assembly.
9. The kit of parts of any one of the preceding claims, wherein headband is telescopic. 1.1
10. The kit of parts of claim 4. wherein the headband telescopically connects the first and second speakers.
11. The kit of parts of ally one of the preceding claims. wherein the microphone is adapted to rotate relative to the speaker.
12. The kit of parts of claim 1, further comprising a second headband, wherein the first headband has no speaker and the second headband has a second speaker.such that when the first headband is attached the combination form a monaural headset, hut when the second headband is attached, the combination form a binaural headset.
13. The kit of parts of claim 12, wherein the maximum extent of the first headband is shorter than the niaxiniurn extent of the second headband.
14. A headset substantially as herein before described with reference to Figures 2 and 3 or Figures 4 and 5 of the accompanying drawings.
15. The kit of parts of any one of the preceding claims, wherein the parts are packaged together as a unitary packaging in a kit.