GB2524248A

GB2524248A - Portable apparatus and docking station

Info

Publication number: GB2524248A
Application number: GB1404730.2A
Authority: GB
Inventors: Stephen Andrew Humphries
Original assignee: Sony Computer Entertainment Europe Ltd
Current assignee: Sony Interactive Entertainment Europe Ltd
Priority date: 2014-03-17
Filing date: 2014-03-17
Publication date: 2015-09-23
Also published as: GB201404730D0

Abstract

Portable device comprising a heat generating electronic device such as a processor and a heat dissipation arrangement movable between a first, non-deployed configuration and a second, deployed, configuration so as to provide enhanced dissipation of heat generated by the device. A movable heat sink structure can be provided behind a cover within the apparatus and may deploy so it protrudes from the apparatus, an actuator such as a bimetallic strip maybe provided to deploy the heat dissipation arrangement in response to the temperature of the device. The cover may provide access to the heat generating element to allow contact between the element and an external heat sink such as a peltier element or fan for forced air cooling which may be provided in a docking station which activates the cover. The device may also comprise of a detector configured to cause the device to operate in a higher power mode in response to the heat dissipation arrangement being deployed.

Description

PORTABLE APPARATUS AND DOCKING STATION

This invention relates to portable apparatuses and docking stations.

Portable electronic apparatuses or devices such as mobile telephones, media players, personal digital assistants and the like generally have an internal processor such as a central processing unit (CPU) and/or a graphics processing unit (GPU). Such processors are subject to various constraints on their operation.

Amongst the constraints, there is generally a design limitation on the maximum possible speed of processing operations. However, this maximum speed may be greater than the speed obtained in normal use for two main reasons. Firstly, a higher processing speed generally leads to a greater consumption of electrical power, so that it is desirable for a portable device to limit or throftle the processor speed when a high speed is not specifically required, so as to conserve battery life. Secondly, a higher processing speed generally leads to a greater production of heat; it is desirable that a portable device should remain comfortable for the user to hold or to keep in a pocket close to the skin.

However, there are situations, such as those involving the playing of computer games using the portable device, when a higher processing speed is desirable.

Various aspects and features of the present invention are defined in the appended claims and within the text of the accompanying description and include at least a portable apparatus, a docking station, a system of a portable apparatus and a docking station and methods of operation as well as a computer program.

Embodiments of the invention will now be described, by way of example only, with reference to the accompanying drawings, in which: Figure 1 is a schematic rear elevation of a portable device; Figure 2 is a schematic cross-sectional side view of the device of Figure 1; Figure 3 schematically illustrates a movable heatsink in a deployed position; Figures 4 and 5 schematically illustrate heatsink covers in an open position; Figures 6 and 7 schematically illustrate cover opening mechanisms; Figures 8A and SB schematically illustrate the operation of a bimetallic strip; Figure 9 schematically illustrates a portable device and a docking station; Figure 10 schematically illustrates a portable device which is docked with a docking station; Figure 11 schematically illustrates a docking station with an electrical cooling element; Figure 12 schematically illustrates a docking station with forced air cooling; Figure 13 is a schematic flowchart illustrating operations carried out by a docking station; and Figures 14 to 17 are schematic flowcharts illustrating operations carried out by a

portable device.

Referring now to the drawings, Figure 1 is a schematic rear elevation of a portable device or apparatus such as a mobile telephone (which will be used as a main example in the discussion which follows), a media player, a personal digital assistant or the like.

The present disclosure relates in part to heat dissipation arrangements for portable devices. Within this general disclosure, portable devices may have a surface of a heat-generating portion such as a CPU or GPU exposed directly to the outside of the portable device.

However, in normal use this could lead to discomfort for the user because even under normal operating conditions, such an exposed surface may feel quite warm or even uncomfortably warm. Accordingly, the embodiments to be described below incorporate a cover which, in normal use, protects the user from direct contact with such a heat generating portion. However, it will be appreciated that in the broader context of the present disclosure such a cover is not necessarily required.

In Figure 1, such a cover 10 is provided on the rear surface 20 of the portable device.

The operation of the cover 10 will be discussed further below.

Figure 2 is a schematic cross-sectional side view of the device of Figure 1.

Various components are shown schematically in Figure 2. Other components may be present, and the skilled person will be fully aware of typical components in a portable device even if they are not explicitly shown in Figure 2. The components which are illustrated comprise a display portion 30, a battery 40, a processor 50 such as a CPU and/or a GPU (as a generic example of a heat-generating portion of the portable device), a wireless interface 60 and memory 70. A bus 80 is illustrated to indicate a schematic connection between these various components. In operation, the processor 50 carries out processing operations in accordance with appropriate software which may, for example, be stored in the memory 70.

The present description relates in particular to dealing with heat generated by the processor 50. Note that in normal operation with the cover 10 closed, the portable device of Figure 2 operates conventionally, in that heat dissipation is simply through the case of the device and the cover 10. Various options will however be discussed below for providing enhanced heat dissipation in certain circumstances.

Note that the cover 10 is shown, for the purposes of the diagram, as protruding from the rear surface 20 of the portable device, but this need not be the situation. For example, the cover could be flush with the rear surface 20 when the cover 10 is in a closed or non-deployed position.

Accordingly, Figure 2 provides an example of a portable electronic apparatus comprising a heat generating electronic device (50) and a heat dissipation arrangement (the cover and/or the heatsink to be described with reference to Figure 3 below) disposed with respect to the heat generating device and movable between a first, non-deployed configuration (closed) and a second, deployed, configuration (open) so as to provide enhanced dissipation of heat generated by the heat generating electronic device in the deployed configuration compared to the dissipation of heat generated by the heat generating electronic device when the heat dissipation arrangement is in the non-deployed configuration.

Accordingly, in some examples the heat dissipation arrangement comprises a cover which: in the non-deployed configuration inhibits thermal communication between the heat generating device and the exterior of the portable apparatus; and in the deployed configuration allows thermal communication between the heat generating device and the exterior of the

portable apparatus.

In some examples, a movable heatsink structure is provided beneath the cover 10 and in thermal communication with the heat generating electronic device such that the heatsink structure is movable between a non-deployed position (corresponding to a situation in which the cover 10 is closed and, for example, the heatsink is stowed within the device) and a deployed position in which the cover 10 is open and, for example, the heatsink protrudes from the device.

Figure 3 schematically illustrates a movable heatsink in a deployed position.

Referring to Figure 3, a heatsink structure 100 is formed of one or more metallic arms or members 110 which are in thermal communication with the processor 50 and are movable (pivotable in this example) so as to extend from the heat generating element (the processor 50 in this example) into the air surrounding the portable device so as to allow enhanced heat dissipation into the ambient air (that is to say, enhanced with respect to operation in the closed or non-deployed configuration).

In the particular example shown, the metallic arms 110 are pivoted at the cover 10 (by pivots 120) and at the rear of the portable device (by pivots 130). However, other configurations are of course possible to provide a heatsink structure movable between a non-deployed configuration in which the heatsink structure is inside the case of the portable device and the cover 10 is in place, and a deployed configuration in which the cover 10 is open and the heatsink structure extends outside the case of the portable device. For example, the cover 10 could be pivoted at one end of the cover and the heatsink arrangement could fold out when the cover 10 is pivoted outwards. In other examples, instead of a pivoted set of heatsink arms 110, telescopic or helical heatsink members could be used.

An advantage of the arrangement described with respect to Figure 3 is that the additional cooling is provided by a heatsink arrangement which is part of the portable device itself, which is to say that additional cooling can be obtained without needing a further external device.

In other arrangements, the opening of the cover 10 provides access to a heat generating element such as the processor 50 but does not, of itself, lead to the deployment of a heatsink.

Instead, it allows contact between the heat generating element and an external heatsink. An advantage of this arrangement is there is no need for the portable device to comprise extra weight (of an internal deployable heatsink arrangement) in normal use.

Figures 4 and 5 schematically illustrate heatsink covers in an open position. In Figure 4, the cover 10 is pivoted at one end so that it can be opened by rotation about the pivot 140. In Figure 5 the cover 10 is laterally slidable with respect to the rear surface 20 of the portable device. In this example, comparing Figure 2 and Figure 5, it can be seen that the cover 10 in Figure 5 has been slid in a lateral direction to an open configuration.

Figures 6 and 7 schematically illustrate example cover opening mechanisms or actuators configured to move the heat dissipation arrangement between the non-deployed configuration and the deployed configuration. In particular, Figure 6 schematically illustrates the use of a mechanical opening mechanism such as a so-called bimetallic strip 200 arranged to be in thermal contact or thermal communication with a heat generating element such as the processor 50 within the portable device. The operation of such a bimetallic strip 200 will be discussed further with reference to Figures BA and 8B below. In Figure 7, an electronic actuator 210 such as an electromagnetic or electromechanical solenoid or other actuator engages a pushrod 220 with the cover 10 so that longitudinal movement of the pushrod 220 causes the cover to move between a closed and an open configuration.

Figures SA and 89 schematically illustrate the operation of the bimetallic strip 200 mechanically linked to a movable portion of the heat dissipation arrangement, as an example of a mechanical actuator responsive to the temperature of the heat generating electronic device. In these drawings, the bimetallic strip 200 is shown schematically as being in thermal contact with the processor 50. Figure 8A schematically illustrates the cover 10 in a closed position, which is arranged (by suitable choice, by the skilled person, of materials and configuration for the bimetallic strip 200) to occur during a normal operation mode, which is to say while the portable device is either not operational or while the portable device is operational but the operating temperature of the processor 50 is below a threshold temperature. When the temperature of the processor 50 rises above the threshold temperature, the bimetallic strip exhibits a bending which, by virtue of one or more linkages between the bimetallic strip 200 and the cover 10 (a simple linkage being shown schematically for the purposes of this description) causes the cover to move about the pivot 140 towards an open configuration. Subsequently, as the processor cools down, the cover 10 would be caused to return to its closed configuration.

Note that the mechanisms discussed with respect to Figures 6 to 89 are applicable to other embodiments, and in particular may be used to deploy a movable heatsink (such as a heatsink of the type shown Figure 3 or the alternatives described with respect to Figure 3) into and out of its deployed position in response to processor temperature, or may be used to open a cover in respect of docking a portable apparatus to a docking station (such as that described below).

The opening of the cover 10, assuming a heatsink arrangement of the type shown in Figure 3 is not provided, can of itself assist in the cooling of the heat generating elements of the portable device, simply by providing direct access to ambient air. However, in further examples, the open cover can provide mechanical access for additional heat dissipation arrangements.

One way in which such arrangements can be embodied is in a so-called docking station. Here, the term "docking station" is used generically to indicate a further device with which the portable device is mechanically (and, optionally, electrically) associated by means of placing the portable device into or onto the docking station.

Figure 9 schematically illustrates a portable device 300 and a docking station 310. As discussed, the portable device 300 may be used in a stand-alone mode, which is to say separately from the docking station 310. However, it is also possible to "dock" (removably place into and/or onto) the portable device with the docking station so as to allow mechanical and optionally electrical interaction between the portable device and the docking station. In Figure 9, this docking operation is schematically illustrated by the portable device 300 being placed vertically into a slot 320 in the docking station 310.

The present disclosure therefore encompasses a system of a portable apparatus and a docking station to which the portable apparatus may be docked, the docking station comprising a docking station heat dissipation arrangement so that docking the portable apparatus to the docking station and moving the heat dissipation arrangement of the portable apparatus to the deployed configuration allows the docking station heat dissipation arrangement to dissipate heat generated by the heat generating electronic device.

Figure 10 schematically illustrates the portable device 300 in a configuration in which it is docked with the docking station 310. In particular, the lower portion (as illustrated) of the portable device 300 has been inserted into the slot 320. In this example, this forms electrical connections between connectors 330 in the docking station 310 and complimentary connectors 340 on the underside (as drawn) of the portable device 300. The electrical connections can provide electrical power to the portable device and, optionally, can also allow for the exchange of data or other signals between the portable device and the docking station.

Figure 10 also illustrates a further aspect of the insertion of the portable device 300 into the docking station 310, which is that the cover 10 engages with a lip 350 at the edge of the slot 320 so as to cause the cover tend to slide laterally upwards (as drawn) as the portable device 300 is inserted into the slot 320. In this example, the cover 10 is resiliently biased towards a closed position so that as the portable device 300 is later withdrawn from the slot 320, the cover returns to the closed configuration. This arrangement has several advantageous features.

Firstly, no additional operation is required on the part of the user to open the cover 10, but nor is a cover-opening mechanism required as part of the portable device. Secondly, the cover 10 is opened only when the device is inserted into the slot 320, and is opened in such a way that access to the internal parts of the portable device 300 is not provided to the user, because as the device 300 is progressively inserted into the slot 320, the only open portion uncovered by the moving cover 10 is that portion within the docking station 310 itself. Optionally, a lock or latch may be provided (not shown) to inhibit the user opening the cover 10 when the portable device 300 is not engaged with the docking station. For example, a magnetic latch may be provided which is normally latched so as to prevent movement of the cover 10, but is released (for example by a complimentary magnet within the docking station slot 320) when the portable device 300 is properly inserted into the docking station 310.

These are all examples of the docking station and the portable electronic apparatus comprising cooperating mechanisms to cause the heat dissipation arrangement to move to the deployed configuration upon docking of the apparatus to the docking station.

Once the portable device 300 has been inserted into the docking station 310, and the cover 10 has been moved to its open position, the now-open cover provides access within the docking station to heat generating elements within the portable device 300. This allows the docking station to provide enhanced heat dissipation to those heat generating elements.

Various techniques may be used to provide such heat dissipation. In some examples, a heatsink arrangement is used. In other examples, forced air (or indeed, other fluid) cooling may be used. In further examples, both of these techniques may be used. Two such examples will now be described with reference to Figures 11 and 12.

Figure 11 schematically illustrates a docking station with an electrical cooling element 400 such as a so-called Peltier element operating under the control of a controller 410. The controller 410 may be a general purpose microprocessor acting under software control.

The Peltier element 400 acts to transfer heat from an inside surface 420, arranged in operation to contact, or to be in thermal communication with, the heat generating elements within the portable device 300 which are exposed by the opening of the cover 10, to an outside surface 430 which, in this example, is connected to a mechanical heatsink 440 such as a vaned metallic structure. So, it is transferred from the heat generating elements, through the Peltier element 400, to the heatsink 440, from which it is dissipated to the ambient air. Accordingly, the heat dissipation from the heat generating elements of the portable device 300 is enhanced relative to the situation in which the portable device 300 is not docked with the docking station 310 and in which the cover lOis closed.

The controller 410 operates to turn on or activate the Peltier element, for example in response to a detection that the portable device 300 has been inserted into the docking station, so as to avoid wasting electrical power operating the Peltier element when there is no portable device inserted. Optionally, a temperature sensor 450 may be provided, for example at the inner surface 420 of the Peltier element, to detect the temperature at the inner surface 420. In this case, rather than activating the Peltier element when the device has been inserted, the controller 410 could instead operate to activate the Peltier element when both of the following conditions are met: (a) a device 300 is present in the docking station 310; and (b) the temperature at the inner surface 420 exceeds a threshold temperature. Of course, the activation of the Peltier elements need not be a simple binary on-off, but instead the electrical power provided to the Peltier element, which in turn determines the amount of heat transfer provided by the Peltier element, could be varied by the controller 410 in response to the temperature sensed by the sensor 450 so as to provide, for example, a greater heat transfer in response to a higher detected temperature.

As a variation of the arrangement of Figure 11, instead of providing a Peltier element or the like, a simple mechanical heatsink (such as a laterally extended version of the heatsink 440) could be provided so as to be in thermal medication with the heat generating elements of the portable device 300 when the portable device 300 is inserted into the docking station 310.

In Figure 11, a mechanical or electrical actuator can be provided so as to operate in response to the complete insertion of the portable device 300 into the docking station 310, to move the Peltier element and/or the heatsink in a direction 460 so as to provide improved thermal contact between those elements and the heat generating elements of the portable device 300. A corresponding actuation mechanism can move the Peltier element and/or the heatsink in the opposite direction cells to release the portable device 300 from the docking station 310. In other embodiments, a resilient mechanism such as sprung members can be provided, for example on the inner surface 420 of the Peltier element, to provide thermal communication between the inner surface 420 and the heat generating elements of the portable device 300 when the portable device 300 is inserted into the docking station 310 and the cover opened.

Accordingly, in Figure lithe docking station heat dissipation arrangement comprises a heatsink arranged to be in thermal communication with the heat generating electronic device when the portable apparatus is docked to the docking station and the heat dissipation arrangement of the portable apparatus is in the deployed configuration.

Figure 12 schematically illustrates a docking station with forced air cooling. Here, a controller 500 operates to control a fan or similar device 510 which provides forced air cooling through one or more inlet channels 520, past the heat generating elements of the portable device 300, and towards one or more outlet channels 530. As before, the activation of the fan, and the operating speed of the fan, can be controlled by the controller 500 in response to the presence of a portable device 300 in the docking station and/or a measurement of temperature, for example by a temperature sensor 540 disposed in the outlet stream of air.

Either or both of the fan (as an example of a forced air cooling arrangement) or the Peltier element (as an example of a heat pump) may be considered as examples of the docking station heat dissipation arrangement comprising an active heat dissipator under the control of a controller responsive to one or both of the docking of the portable apparatus to the docking station; and a temperature detection of a temperature relative to the portable apparatus.

Figure 13 is a schematic flowchart illustrating operations carried out by a docking station, for example by the controller 410 or the controller 500 of Figure 11 or Figure 12.

At a step 600, the controller detects one or both of temperature (as discussed above) and the insertion of a portable device 300. In response to such a detection, at a step 610 the controller activates and/or controls the cooling provided by the docking station 310. Optionally, at a step 620, the controller may signal to the portable device 300 inserted into the docking station (for example, by means of the electrical contacts 330, 340) that enhanced cooling is being provided by the docking station 310. This provides an example of the heat generating electronic device being operable in at least a lower power mode and a higher power mode, and the apparatus comprising a detector configured to cause the heat generating electronic device to operate in the higher power mode in response to docking of the apparatus to the docking station.

Figures 14 to 16 are schematic flowcharts illustrating operations carried out by a

portable device.

Referring to Figure 14, at a step 630 the portable device 300 detects one or both of (a) the establishment of a connection with the docking station, for example a connection using the complementary contacts 330, 340, and (b) a signal from the docking station 310 to indicate that cooling has been activated (as discussed with reference to the step 620 above). In response to such a detection, at a step 640 the portable device 300 switches to a higher power mode, for example a mode in which the one or more processors of the portable device 300 operate at a faster processing speed.

An alternative arrangement is schematically provided by Figure 15, which applies not only to embodiments using a docking station but also to embodiments such as those described with reference to Figure 3 in which enhanced cooling is provided either by the opening of the cover 10 or by the cover opening and the deployment of additional heatsink elements, but in each case without necessarily requiring a docking station. In this arrangement, at a step 650 the portable device 300 detects movement of the cover 10 from a closed to an open or partially open configuration. If the deployment of the heatsink elements of Figure 3 is separate to the cover opening, this step can also detect the deployment of the heatsink elements. Again, in response to this detection, at a step 660 the portable device 300 moves to a higher power mode.

Figure 16 relates to a portable device 300 with a temperature sensor to detect the current operating temperature of the processor 50. At a step 670, the processor 50 of the portable device 300 detects a drop in the processor temperature, and in response to such a detection, at a step 680 the processor speed is increased.

Finally, Figure 17 relates to embodiments which vary the heat dissipation according to the processing requirements, rather than (or in addition to) varying the processor speed in response to the current heat dissipation. Here, at a step 690 the portable device 300 detects a requirement for higher power operation. An example of such requirement is the selection, by a user, of operating software such as a game application which requires a higher processor power than normal operation of the portable device. In response to such a detection, at a step 700 the portable device deploys additional heat dissipation. This could be, for example, the deployment of the heatsink arrangement of Figure 3 or similar, or it could be the opening of the cover 10, or it could be the display of an instruction to the user that the particular application cannot be executed until the user has docked the portable device 300 with an appropriate docking station 310.

Accordingly, a device operating according to any one or more of Figures 14 to 17 provides an example of a heat generating electronic device operable in at least a lower power mode and a higher power mode, the apparatus comprising a detector configured to cause the heat generating electronic device to operate in the higher power mode in response to movement of the heat dissipation arrangement to the deployed configuration, and/or a heat generating electronic device operable in at least a lower power mode and a higher power mode, the apparatus comprising a detector configured to cause the heat dissipation arrangement to move to the deployed configuration in response to the heat generating electronic device operating in the higher power mode.

It will be appreciated that the various techniques described above with respect to Figures 13 to 17 may be carried out using software, hardware, software programmable hardware or combinations of these. It will be appreciated that such software, and a providing medium by which such software is provided (such as a machine-readable non-transitory storage medium, for example a magnetic or optical disc or a non-volatile memory) are considered as embodiments of the present invention. Such techniques include a method of operation of a portable electronic apparatus having a heat generating electronic device operable in a lower power mode and a higher power mode and a heat dissipation arrangement disposed with respect to the heat generating device and movable between a first, non-deployed configuration and a second, deployed, configuration so as to provide enhanced dissipation of heat generated by the heat generating electronic device in the deployed configuration compared to the dissipation of heat generated by the heat generating electronic device when the heat dissipation arrangement is in the non-deployed configuration, the method comprising causing the heat generating electronic device to operate in the higher power mode in response to movement of the heat dissipation arrangement to the deployed configuration; and a method of operation of a portable electronic apparatus having a heat generating electronic device operable in a lower power mode and a higher power mode and a heat dissipation arrangement disposed with respect to the heat generating device and movable between a first, non-deployed configuration and a second, deployed, configuration so as to provide enhanced dissipation of heat generated by the heat generating electronic device in the deployed configuration compared to the dissipation of heat generated by the heat generating electronic device when the heat dissipation arrangement is in the non-deployed configuration, the method comprising causing the heat dissipation arrangement to move to the deployed configuration in response to the heat generating electronic device operating in the higher power mode.

Claims

CLAIMS1. A portable electronic apparatus comprising: a heat generating electronic device; and a heat dissipation arrangement disposed with respect to the heat generating device and movable between a first, non-deployed configuration and a second, deployed, configuration so as to provide enhanced dissipation of heat generated by the heat generating electronic device in the deployed configuration compared to the dissipation of heat generated by the heat generating electronic device when the heat dissipation arrangement is in the non-deployed configuration.
2. Apparatus according to claim 1, in which the heat dissipation arrangement comprises a heatsink structure in thermal communication with the heat generating electronic device and which: in the non-deployed configuration is stowed within the apparatus; and in the deployed configuration protrudes from the apparatus.
3. Apparatus according to claim 2, in which the heatsink structure comprises one or more members connected so as to pivot between the non-deployed configuration and the deployed configuration.
4. Apparatus according to any one of claims 1 to 3, comprising an actuator configured to move the heat dissipation arrangement between the non-deployed configuration and the deployed configuration.
5. Apparatus according to claim 4, in which the actuator comprises a mechanical actuator responsive to the temperature of the heat generating electronic device.
6. Apparatus according to claim 5, in which the actuator comprises a bimetallic strip mechanically linked to a movable portion of the heat dissipation arrangement.
7. Apparatus according to claim 5, in which the actuator is an electromechanical actuator.
8. Apparatus according to any one of the preceding claims, in which the heat dissipation arrangement comprises a cover which: in the non-deployed configuration inhibits thermal communication between the heat generating device and the exterior of the portable apparatus; and in the deployed configuration allows thermal communication between the heat generating device and the exterior of the portable apparatus.
9. Apparatus according to any one of the preceding claims, in which the heat generating electronic device is operable in at least a lower power mode and a higher power mode, the apparatus comprising a detector configured to cause the heat generating electronic device to operate in the higher power mode in response to movement of the heat dissipation arrangement to the deployed configuration.
10. Apparatus according to any one of claims 1 to 8, in which the heat generating electronic device is operable in at least a lower power mode and a higher power mode, the apparatus comprising a detector configured to cause the heat dissipation arrangement to move to the deployed configuration in response to the heat generating electronic device operating in the higher power mode.
11. A system comprising: a portable apparatus according to any one of the preceding claims; and a docking station to which the portable apparatus may be docked; the docking station comprising a docking station heat dissipation arrangement so that docking the portable apparatus to the docking station and moving the heat dissipation arrangement of the portable apparatus to the deployed configuration allows the docking station heat dissipation arrangement to dissipate heat generated by the heat generating electronic device.
12. A system according to claim 11, in which the docking station heat dissipation arrangement comprises a heatsink arranged to be in thermal communication with the heat generating electronic device when the portable apparatus is docked to the docking station and the heat dissipation arrangement of the portable apparatus is in the deployed configuration.
13. A system according to claim 11 or claim 12, in which the docking station heat dissipation arrangement comprises an active heat dissipator under the control of a controller responsive to one or both of the docking of the portable apparatus to the docking station; and a temperature detection of a temperature relative to the portable apparatus.
14. A system according to claim 13, in which the docking station heat dissipation arrangement comprises a forced air cooling arrangement.
15. A system according to claim 13 or claim 14, in which the docking station heat dissipation arrangement comprises a heat pump.
16. A system according to claim 15, in which the heat pump comprises a Peltier element.
17. A system according to any one of claims 11 to 16, in which the heat generating electronic device is operable in at least a lower power mode and a higher power mode, the apparatus comprising a detector configured to cause the heat generating electronic device to operate in the higher power mode in response to docking of the apparatus to the docking station.
18. A system according to any one of claims 11 to 17, in which the docking station and the portable electronic apparatus comprise cooperating mechanisms to cause the heat dissipation arrangement to move to the deployed configuration upon docking of the apparatus to the docking station.
19. A portable electronic apparatus substantially as hereinbefore described with reference to the accompanying drawings.
20. A system of a portable electronic apparatus and a docking station, the system being substantially as hereinbefore described with reference to the accompanying drawings.
21. A method of operation of a portable electronic apparatus having a heat generating electronic device operable in a lower power mode and a higher power mode and a heat dissipation arrangement disposed with respect to the heat generating device and movable between a first, non-deployed configuration and a second, deployed, configuration so as to provide enhanced dissipation of heat generated by the heat generating electronic device in the deployed configuration compared to the dissipation of heat generated by the heat generating electronic device when the heat dissipation arrangement is in the non-deployed configuration, the method comprising: causing the heat generating electronic device to operate in the higher power mode in response to movement of the heat dissipation arrangement to the deployed configuration.
22. A method of operation of a portable electronic apparatus having a heat generating electronic device operable in a lower power mode and a higher power mode and a heat dissipation arrangement disposed with respect to the heat generating device and movable between a first, non-deployed configuration and a second, deployed, configuration so as to provide enhanced dissipation of heat generated by the heat generating electronic device in the deployed configuration compared to the dissipation of heat generated by the heat generating electronic device when the heat dissipation arrangement is in the non-deployed configuration, the method comprising: causing the heat dissipation arrangement to move to the deployed configuration in response to the heat generating electronic device operating in the higher power mode.
23. A method of operation of a portable electronic apparatus, the method being substantially as hereinbefore described with reference to the accompanying drawings.
24. Computer software which, when executed by a computer, causes the computer to carry out the method of any one of claims 21 to 23.
25. A non-transitory machine-readable storage medium which stores computer software according to claim 24.