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GB2520817B - High-temperature environment electronic chassis - Google Patents

High-temperature environment electronic chassis

Info

Publication number
GB2520817B
GB2520817B GB1417526.9A GB201417526A GB2520817B GB 2520817 B GB2520817 B GB 2520817B GB 201417526 A GB201417526 A GB 201417526A GB 2520817 B GB2520817 B GB 2520817B
Authority
GB
United Kingdom
Prior art keywords
temperature environment
electronic chassis
environment electronic
chassis
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1417526.9A
Other versions
GB2520817A (en
GB201417526D0 (en
Inventor
J Veilleux Leo Jr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamilton Sundstrand Corp
Original Assignee
Hamilton Sundstrand Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/192,096 external-priority patent/US9386712B2/en
Application filed by Hamilton Sundstrand Corp filed Critical Hamilton Sundstrand Corp
Publication of GB201417526D0 publication Critical patent/GB201417526D0/en
Publication of GB2520817A publication Critical patent/GB2520817A/en
Application granted granted Critical
Publication of GB2520817B publication Critical patent/GB2520817B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0213—Venting apertures; Constructional details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB1417526.9A 2013-11-06 2014-10-03 High-temperature environment electronic chassis Active GB2520817B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361900734P 2013-11-06 2013-11-06
US14/192,096 US9386712B2 (en) 2013-11-06 2014-02-27 High-temperature environment electronic chassis

Publications (3)

Publication Number Publication Date
GB201417526D0 GB201417526D0 (en) 2014-11-19
GB2520817A GB2520817A (en) 2015-06-03
GB2520817B true GB2520817B (en) 2017-10-04

Family

ID=51946814

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1417526.9A Active GB2520817B (en) 2013-11-06 2014-10-03 High-temperature environment electronic chassis

Country Status (1)

Country Link
GB (1) GB2520817B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11202396B2 (en) * 2017-05-19 2021-12-14 Rolls-Royce Corporation Additive manufacturing of engine control component

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0080156A1 (en) * 1981-11-24 1983-06-01 Siemens Aktiengesellschaft Cooling arrangement for high dissipation modules
DE3243495A1 (en) * 1982-11-24 1984-05-24 Šamil Alekseevič Leningrad Čurakov Temperature-resistant and impact-resistant capsule
GB2279364A (en) * 1993-06-29 1995-01-04 Hitech Pop Limited Shielding of polymer casings involving sensitising with infra-red radiation
US5913552A (en) * 1993-06-09 1999-06-22 Dallas Semiconductor Corporation Method of providing thermal protection of electrical elements
US20030042045A1 (en) * 2001-08-28 2003-03-06 Koskenmaki David C. Embedded electrical traces and method for making
US20030117776A1 (en) * 2001-12-26 2003-06-26 Hajime Katsuro Electronic control unit
WO2004110951A1 (en) * 2003-06-06 2004-12-23 Goodrich Corporation Multi-layer fire-barrier systems
US20130258583A1 (en) * 2012-03-28 2013-10-03 Safran Composite material fadec box support

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0080156A1 (en) * 1981-11-24 1983-06-01 Siemens Aktiengesellschaft Cooling arrangement for high dissipation modules
DE3243495A1 (en) * 1982-11-24 1984-05-24 Šamil Alekseevič Leningrad Čurakov Temperature-resistant and impact-resistant capsule
US5913552A (en) * 1993-06-09 1999-06-22 Dallas Semiconductor Corporation Method of providing thermal protection of electrical elements
GB2279364A (en) * 1993-06-29 1995-01-04 Hitech Pop Limited Shielding of polymer casings involving sensitising with infra-red radiation
US20030042045A1 (en) * 2001-08-28 2003-03-06 Koskenmaki David C. Embedded electrical traces and method for making
US20030117776A1 (en) * 2001-12-26 2003-06-26 Hajime Katsuro Electronic control unit
WO2004110951A1 (en) * 2003-06-06 2004-12-23 Goodrich Corporation Multi-layer fire-barrier systems
US20130258583A1 (en) * 2012-03-28 2013-10-03 Safran Composite material fadec box support

Also Published As

Publication number Publication date
GB2520817A (en) 2015-06-03
GB201417526D0 (en) 2014-11-19

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