GB2581998B - Thermal management of display device - Google Patents
Thermal management of display device Download PDFInfo
- Publication number
- GB2581998B GB2581998B GB1903050.1A GB201903050A GB2581998B GB 2581998 B GB2581998 B GB 2581998B GB 201903050 A GB201903050 A GB 201903050A GB 2581998 B GB2581998 B GB 2581998B
- Authority
- GB
- United Kingdom
- Prior art keywords
- display device
- thermal management
- management
- thermal
- display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H10W40/00—
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H10W40/10—
-
- H10W40/60—
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1903050.1A GB2581998B (en) | 2019-03-07 | 2019-03-07 | Thermal management of display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1903050.1A GB2581998B (en) | 2019-03-07 | 2019-03-07 | Thermal management of display device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB201903050D0 GB201903050D0 (en) | 2019-04-24 |
| GB2581998A GB2581998A (en) | 2020-09-09 |
| GB2581998B true GB2581998B (en) | 2021-07-28 |
Family
ID=66380458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1903050.1A Active GB2581998B (en) | 2019-03-07 | 2019-03-07 | Thermal management of display device |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2581998B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019123908A1 (en) | 2019-09-05 | 2021-03-11 | Karl Storz Se & Co. Kg | Device for heat dissipation and use of such a device |
| CN111628110A (en) * | 2020-06-24 | 2020-09-04 | 京东方科技集团股份有限公司 | Display module and display device |
| US11388812B1 (en) * | 2020-12-22 | 2022-07-12 | Hamilton Sundstrand Corporation | Thermal active heat sink |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030076565A1 (en) * | 2001-10-02 | 2003-04-24 | Takatoshi Noda | Optical communication module |
| US20050074666A1 (en) * | 2002-08-29 | 2005-04-07 | Hirokazu Kimiya | Heat control device for battery |
| US20070205473A1 (en) * | 2006-03-03 | 2007-09-06 | Honeywell International Inc. | Passive analog thermal isolation structure |
| WO2013113221A1 (en) * | 2012-01-31 | 2013-08-08 | 华为终端有限公司 | Heat sensitive device and heat dissipation system thereof |
| US20130314202A1 (en) * | 2012-05-22 | 2013-11-28 | Douglas Aaron Bolton | Heat Dissipation Switch |
| US20150362791A1 (en) * | 2014-06-13 | 2015-12-17 | Apple Inc. | Electronic Device With Heat Spreading Film |
| EP3509099A1 (en) * | 2018-01-04 | 2019-07-10 | Juniper Networks, Inc. | Thermal heatsink |
-
2019
- 2019-03-07 GB GB1903050.1A patent/GB2581998B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030076565A1 (en) * | 2001-10-02 | 2003-04-24 | Takatoshi Noda | Optical communication module |
| US20050074666A1 (en) * | 2002-08-29 | 2005-04-07 | Hirokazu Kimiya | Heat control device for battery |
| US20070205473A1 (en) * | 2006-03-03 | 2007-09-06 | Honeywell International Inc. | Passive analog thermal isolation structure |
| WO2013113221A1 (en) * | 2012-01-31 | 2013-08-08 | 华为终端有限公司 | Heat sensitive device and heat dissipation system thereof |
| US20130314202A1 (en) * | 2012-05-22 | 2013-11-28 | Douglas Aaron Bolton | Heat Dissipation Switch |
| US20150362791A1 (en) * | 2014-06-13 | 2015-12-17 | Apple Inc. | Electronic Device With Heat Spreading Film |
| EP3509099A1 (en) * | 2018-01-04 | 2019-07-10 | Juniper Networks, Inc. | Thermal heatsink |
Also Published As
| Publication number | Publication date |
|---|---|
| GB201903050D0 (en) | 2019-04-24 |
| GB2581998A (en) | 2020-09-09 |
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