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GB2569497B - A power MOSFET with an integrated Schottky diode - Google Patents

A power MOSFET with an integrated Schottky diode Download PDF

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Publication number
GB2569497B
GB2569497B GB1905012.9A GB201905012A GB2569497B GB 2569497 B GB2569497 B GB 2569497B GB 201905012 A GB201905012 A GB 201905012A GB 2569497 B GB2569497 B GB 2569497B
Authority
GB
United Kingdom
Prior art keywords
schottky diode
power mosfet
integrated schottky
integrated
mosfet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1905012.9A
Other versions
GB201905012D0 (en
GB2569497A (en
Inventor
Jiang Huaping
Ke Maolong
Deviny Ian
Wei Jin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhuzhou CRRC Times Electric Co Ltd
Dynex Semiconductor Ltd
Original Assignee
Zhuzhou CRRC Times Electric Co Ltd
Dynex Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhuzhou CRRC Times Electric Co Ltd, Dynex Semiconductor Ltd filed Critical Zhuzhou CRRC Times Electric Co Ltd
Publication of GB201905012D0 publication Critical patent/GB201905012D0/en
Publication of GB2569497A publication Critical patent/GB2569497A/en
Application granted granted Critical
Publication of GB2569497B publication Critical patent/GB2569497B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/028Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
    • H10D30/0291Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs
    • H10D30/0295Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs using recessing of the source electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/028Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
    • H10D30/0291Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs
    • H10D30/0297Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs using recessing of the gate electrodes, e.g. to form trench gate electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/662Vertical DMOS [VDMOS] FETs having a drift region having a doping concentration that is higher between adjacent body regions relative to other parts of the drift region
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/668Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117Shapes of semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251Source or drain electrodes for field-effect devices
    • H10D64/252Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices
    • H10D64/2527Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices for vertical devices wherein the source or drain electrodes are recessed in semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/512Disposition of the gate electrodes, e.g. buried gates
    • H10D64/513Disposition of the gate electrodes, e.g. buried gates within recesses in the substrate, e.g. trench gates, groove gates or buried gates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/101Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
    • H10D84/141VDMOS having built-in components
    • H10D84/146VDMOS having built-in components the built-in components being Schottky barrier diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149Source or drain regions of field-effect devices
    • H10D62/151Source or drain regions of field-effect devices of IGFETs 
    • H10D62/156Drain regions of DMOS transistors
    • H10D62/157Impurity concentrations or distributions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/60Impurity distributions or concentrations
GB1905012.9A 2016-09-23 2016-09-23 A power MOSFET with an integrated Schottky diode Active GB2569497B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/GB2016/052966 WO2018055318A1 (en) 2016-09-23 2016-09-23 A Power MOSFET with an Integrated Schottky Diode

Publications (3)

Publication Number Publication Date
GB201905012D0 GB201905012D0 (en) 2019-05-22
GB2569497A GB2569497A (en) 2019-06-19
GB2569497B true GB2569497B (en) 2021-09-29

Family

ID=57068150

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1905012.9A Active GB2569497B (en) 2016-09-23 2016-09-23 A power MOSFET with an integrated Schottky diode

Country Status (2)

Country Link
GB (1) GB2569497B (en)
WO (1) WO2018055318A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10679984B2 (en) * 2018-07-10 2020-06-09 Sanken Electric Co., Ltd. Semiconductor device and method for forming the semiconductor device
CN111933711B (en) * 2020-08-18 2022-08-23 电子科技大学 SBD integrated super-junction MOSFET
CN116072732A (en) * 2021-02-25 2023-05-05 湖南三安半导体有限责任公司 SiC MOSFET device with integrated Schottky diode
CN113745316A (en) * 2021-08-31 2021-12-03 深圳市威兆半导体有限公司 Shielding gate MOSFET device, chip and terminal equipment
CN114843339B (en) * 2022-03-01 2026-01-09 中国科学院微电子研究所 An asymmetric trench gate IGBT device and its fabrication method
CN119547578A (en) * 2022-07-11 2025-02-28 日立能源有限公司 Power semiconductor device and method for manufacturing a power semiconductor device
WO2024183928A1 (en) * 2023-03-09 2024-09-12 Huawei Digital Power Technologies Co., Ltd. Trench-gate planar-gate semiconductor device with monolithically integrated schottky barrier diode and junction schottky barrier diode
WO2024183912A1 (en) * 2023-03-09 2024-09-12 Huawei Digital Power Technologies Co., Ltd. Monolithically integrated schottky barrier diode semiconductor device
CN117059672B (en) * 2023-10-11 2024-01-23 通威微电子有限公司 Semiconductor device integrated with SBD and manufacturing method thereof
CN117253923A (en) * 2023-11-20 2023-12-19 深圳平创半导体有限公司 Boss split gate silicon carbide MOSFET integrated with JBS and preparation process
CN118136672B (en) * 2024-04-30 2024-08-23 河北博威集成电路有限公司 Silicon carbide MOSFET device integrated with SBD and preparation method thereof
CN118693161B (en) * 2024-08-27 2024-11-22 西安龙飞电气技术有限公司 Multi-groove power device integrated with SiC diode
CN119300427B (en) * 2024-12-12 2025-04-29 北京怀柔实验室 MOSFET device and preparation method thereof
CN119855213B (en) * 2025-03-20 2025-07-29 南京邮电大学 Double-channel super-junction silicon carbide MOSFET

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5907169A (en) * 1997-04-18 1999-05-25 Megamos Corporation Self-aligned and process-adjusted high density power transistor with gate sidewalls provided with punch through prevention and reduced JFET resistance
JP2000323488A (en) * 1999-05-10 2000-11-24 Fuji Electric Co Ltd Diode and method of manufacturing the same
US20070045727A1 (en) * 2005-08-25 2007-03-01 Masaki Shiraishi DMOSFET and planar type MOSFET
US20110227154A1 (en) * 2010-03-19 2011-09-22 Kabushiki Kaisha Toshiba Semiconductor device and method of manufacturing the same
EP1204145B1 (en) * 2000-10-23 2011-12-28 Panasonic Corporation Semiconductor element
US20120112266A1 (en) * 2010-11-10 2012-05-10 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing the same
JP2015090883A (en) * 2013-11-05 2015-05-11 住友電気工業株式会社 Silicon carbide semiconductor device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6621107B2 (en) 2001-08-23 2003-09-16 General Semiconductor, Inc. Trench DMOS transistor with embedded trench schottky rectifier
US6979863B2 (en) 2003-04-24 2005-12-27 Cree, Inc. Silicon carbide MOSFETs with integrated antiparallel junction barrier Schottky free wheeling diodes and methods of fabricating the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5907169A (en) * 1997-04-18 1999-05-25 Megamos Corporation Self-aligned and process-adjusted high density power transistor with gate sidewalls provided with punch through prevention and reduced JFET resistance
JP2000323488A (en) * 1999-05-10 2000-11-24 Fuji Electric Co Ltd Diode and method of manufacturing the same
EP1204145B1 (en) * 2000-10-23 2011-12-28 Panasonic Corporation Semiconductor element
US20070045727A1 (en) * 2005-08-25 2007-03-01 Masaki Shiraishi DMOSFET and planar type MOSFET
US20110227154A1 (en) * 2010-03-19 2011-09-22 Kabushiki Kaisha Toshiba Semiconductor device and method of manufacturing the same
US20120112266A1 (en) * 2010-11-10 2012-05-10 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing the same
JP2015090883A (en) * 2013-11-05 2015-05-11 住友電気工業株式会社 Silicon carbide semiconductor device

Also Published As

Publication number Publication date
GB201905012D0 (en) 2019-05-22
GB2569497A (en) 2019-06-19
WO2018055318A1 (en) 2018-03-29

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