GB2569497B - A power MOSFET with an integrated Schottky diode - Google Patents
A power MOSFET with an integrated Schottky diode Download PDFInfo
- Publication number
- GB2569497B GB2569497B GB1905012.9A GB201905012A GB2569497B GB 2569497 B GB2569497 B GB 2569497B GB 201905012 A GB201905012 A GB 201905012A GB 2569497 B GB2569497 B GB 2569497B
- Authority
- GB
- United Kingdom
- Prior art keywords
- schottky diode
- power mosfet
- integrated schottky
- integrated
- mosfet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/028—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
- H10D30/0291—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs
- H10D30/0295—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs using recessing of the source electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/028—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
- H10D30/0291—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs
- H10D30/0297—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs using recessing of the gate electrodes, e.g. to form trench gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/662—Vertical DMOS [VDMOS] FETs having a drift region having a doping concentration that is higher between adjacent body regions relative to other parts of the drift region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/668—Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/252—Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices
- H10D64/2527—Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices for vertical devices wherein the source or drain electrodes are recessed in semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/512—Disposition of the gate electrodes, e.g. buried gates
- H10D64/513—Disposition of the gate electrodes, e.g. buried gates within recesses in the substrate, e.g. trench gates, groove gates or buried gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/101—Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
- H10D84/141—VDMOS having built-in components
- H10D84/146—VDMOS having built-in components the built-in components being Schottky barrier diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
- H10D62/156—Drain regions of DMOS transistors
- H10D62/157—Impurity concentrations or distributions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/60—Impurity distributions or concentrations
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/GB2016/052966 WO2018055318A1 (en) | 2016-09-23 | 2016-09-23 | A Power MOSFET with an Integrated Schottky Diode |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB201905012D0 GB201905012D0 (en) | 2019-05-22 |
| GB2569497A GB2569497A (en) | 2019-06-19 |
| GB2569497B true GB2569497B (en) | 2021-09-29 |
Family
ID=57068150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1905012.9A Active GB2569497B (en) | 2016-09-23 | 2016-09-23 | A power MOSFET with an integrated Schottky diode |
Country Status (2)
| Country | Link |
|---|---|
| GB (1) | GB2569497B (en) |
| WO (1) | WO2018055318A1 (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10679984B2 (en) * | 2018-07-10 | 2020-06-09 | Sanken Electric Co., Ltd. | Semiconductor device and method for forming the semiconductor device |
| CN111933711B (en) * | 2020-08-18 | 2022-08-23 | 电子科技大学 | SBD integrated super-junction MOSFET |
| CN116072732A (en) * | 2021-02-25 | 2023-05-05 | 湖南三安半导体有限责任公司 | SiC MOSFET device with integrated Schottky diode |
| CN113745316A (en) * | 2021-08-31 | 2021-12-03 | 深圳市威兆半导体有限公司 | Shielding gate MOSFET device, chip and terminal equipment |
| CN114843339B (en) * | 2022-03-01 | 2026-01-09 | 中国科学院微电子研究所 | An asymmetric trench gate IGBT device and its fabrication method |
| CN119547578A (en) * | 2022-07-11 | 2025-02-28 | 日立能源有限公司 | Power semiconductor device and method for manufacturing a power semiconductor device |
| WO2024183928A1 (en) * | 2023-03-09 | 2024-09-12 | Huawei Digital Power Technologies Co., Ltd. | Trench-gate planar-gate semiconductor device with monolithically integrated schottky barrier diode and junction schottky barrier diode |
| WO2024183912A1 (en) * | 2023-03-09 | 2024-09-12 | Huawei Digital Power Technologies Co., Ltd. | Monolithically integrated schottky barrier diode semiconductor device |
| CN117059672B (en) * | 2023-10-11 | 2024-01-23 | 通威微电子有限公司 | Semiconductor device integrated with SBD and manufacturing method thereof |
| CN117253923A (en) * | 2023-11-20 | 2023-12-19 | 深圳平创半导体有限公司 | Boss split gate silicon carbide MOSFET integrated with JBS and preparation process |
| CN118136672B (en) * | 2024-04-30 | 2024-08-23 | 河北博威集成电路有限公司 | Silicon carbide MOSFET device integrated with SBD and preparation method thereof |
| CN118693161B (en) * | 2024-08-27 | 2024-11-22 | 西安龙飞电气技术有限公司 | Multi-groove power device integrated with SiC diode |
| CN119300427B (en) * | 2024-12-12 | 2025-04-29 | 北京怀柔实验室 | MOSFET device and preparation method thereof |
| CN119855213B (en) * | 2025-03-20 | 2025-07-29 | 南京邮电大学 | Double-channel super-junction silicon carbide MOSFET |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5907169A (en) * | 1997-04-18 | 1999-05-25 | Megamos Corporation | Self-aligned and process-adjusted high density power transistor with gate sidewalls provided with punch through prevention and reduced JFET resistance |
| JP2000323488A (en) * | 1999-05-10 | 2000-11-24 | Fuji Electric Co Ltd | Diode and method of manufacturing the same |
| US20070045727A1 (en) * | 2005-08-25 | 2007-03-01 | Masaki Shiraishi | DMOSFET and planar type MOSFET |
| US20110227154A1 (en) * | 2010-03-19 | 2011-09-22 | Kabushiki Kaisha Toshiba | Semiconductor device and method of manufacturing the same |
| EP1204145B1 (en) * | 2000-10-23 | 2011-12-28 | Panasonic Corporation | Semiconductor element |
| US20120112266A1 (en) * | 2010-11-10 | 2012-05-10 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing the same |
| JP2015090883A (en) * | 2013-11-05 | 2015-05-11 | 住友電気工業株式会社 | Silicon carbide semiconductor device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6621107B2 (en) | 2001-08-23 | 2003-09-16 | General Semiconductor, Inc. | Trench DMOS transistor with embedded trench schottky rectifier |
| US6979863B2 (en) | 2003-04-24 | 2005-12-27 | Cree, Inc. | Silicon carbide MOSFETs with integrated antiparallel junction barrier Schottky free wheeling diodes and methods of fabricating the same |
-
2016
- 2016-09-23 WO PCT/GB2016/052966 patent/WO2018055318A1/en not_active Ceased
- 2016-09-23 GB GB1905012.9A patent/GB2569497B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5907169A (en) * | 1997-04-18 | 1999-05-25 | Megamos Corporation | Self-aligned and process-adjusted high density power transistor with gate sidewalls provided with punch through prevention and reduced JFET resistance |
| JP2000323488A (en) * | 1999-05-10 | 2000-11-24 | Fuji Electric Co Ltd | Diode and method of manufacturing the same |
| EP1204145B1 (en) * | 2000-10-23 | 2011-12-28 | Panasonic Corporation | Semiconductor element |
| US20070045727A1 (en) * | 2005-08-25 | 2007-03-01 | Masaki Shiraishi | DMOSFET and planar type MOSFET |
| US20110227154A1 (en) * | 2010-03-19 | 2011-09-22 | Kabushiki Kaisha Toshiba | Semiconductor device and method of manufacturing the same |
| US20120112266A1 (en) * | 2010-11-10 | 2012-05-10 | Mitsubishi Electric Corporation | Semiconductor device and method for manufacturing the same |
| JP2015090883A (en) * | 2013-11-05 | 2015-05-11 | 住友電気工業株式会社 | Silicon carbide semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| GB201905012D0 (en) | 2019-05-22 |
| GB2569497A (en) | 2019-06-19 |
| WO2018055318A1 (en) | 2018-03-29 |
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