GB2545035A

GB2545035A - Low thickness biometric card

Info

Publication number: GB2545035A
Application number: GB1600892.2A
Authority: GB
Inventors: Robert Lowe Peter; Ignacio Wintergerst Lavin Jose
Original assignee: Zwipe AS
Current assignee: Zwipe AS
Priority date: 2015-12-04
Filing date: 2016-01-18
Publication date: 2017-06-07
Also published as: GB201600892D0; WO2017093516A1

Abstract

A low thickness biometric card 20 (e.g. a smartcard) comprises a card body 28 having a circuit substrate 26 embedded therein and a cavity exposing one or more contacts 24 of a circuit on the circuit substrate 26. A biometric sensor 22 is mounted within the cavity with its rear face orientated towards the circuit substrate 26. A transition member 30 is also mounted within the cavity adjacent the biometric sensor 22. The biometric sensor 22 has one or more contacts formed on its front face or one of its side faces, and the transition member connects the contacts of the biometric sensor to the contacts of the circuit. The biometric sensor could be a fingerprint sensor. The card could also contain a reinforcement member (42) to protect the transition member from damage caused by bending the card. The reinforcement member could also act as an electrode that imparts a voltage to a finger being sensed.

Description

Low Thickness Biometric Oard

The present invention relates to an electronic card including a biometric sensor, particularly a fingerprint sensor, and to a method of manufacturing such an electronic card. US 2015/049925 describes an example of a prior art technique for manufacturing an electronic “smart” card 2 including a fingerprint sensor 10. In that method, the electronic card 2 is manufactured by first forming a card body 4 with an embedded circuit 6 that includes connection pads 8 for connexion to a fingerprint sensor 1and then removing material from the card body 4 to form a cavity that exposes the pads 8. The walls of the cavity are coated with an adhesive epoxy, and contacts 12 on the underside of the fingerprint sensor 10 are connected to the connection pads 8 of the circuit 6 using a conductive epoxy. An electronic card 2 manufactured in accordance with this technique is illustrated in Figures 1A and 1B. it is desirable to manufacture smart cards having a thickness of 0.76 mm ± 0.08 mm, which is the thickness defined by the ISO 7816 specification for a smart card. However, if has been found that manufacturing a smart card in accordance with the method described above often results in a total thickness that is greater than the upper limit of 0.84 mm.

The present invention provides, in a first aspect, an electronic card comprising: a card body having a cavity formed therein; a circuit substrafe embedded within the card body, the circuit substrate having a circuit with one or more contacts that are exposed by the cavity; a biometric sensor module mounted within the cavity with its rear face orientated towards the circuit substrate, the biometric sensor module having one or more Contacts formed on a front face or a side face thereof; and a transition member mounted within the cavity adjacent the biometric sensor module and electrically connecting the contacts of the biometric sensor module to the confects of the circuit.

In accordance with this configuration^ the contacts for connection of the sensor module to the circuit are formed on a transition member adjacent the sensor module, i.e. with the sensor module and transition member preferably side-by-side. These contacts, and the material bonding them together feuch as a conductive epoxy), have a significant thickness relative to the thickness of the overail card, in the proposed configuration, the contact pads are no longer between the sensor module and the substrate, allowing the rear of the sensor module to be positioned physically closer to the circuit substrate. The thickness of the sensor module typically dictates the thickness of the card as a whole; thus this configuration allows the card to be made thinner.

For the avoidance of doubt, the terms “front” and “rear", as used herein; refer to the orientation of components with respect to the card , when assembled. The front face of the card refers to the face of the card into which the cavity is formed, and from which the biometric sensor module is exposed;

In one embodiment, the rear face of the biometric sensor module is in contact with or (directly) bonded to the circuit substrate. For example, it may include a thin layer of adhesive (0:¾. ah epoxy or the like) bonding the circuit to the substrate, this configuration achieves minimal thickness.

Preferably, the contacts of the transition member are formed on a rear face of the transition member, that is to say, towards the rear with respect to the orientation of the biometric sensor module. Preferably, the rear surface of the transition member is offset away from the circuit substrate with respect to the rear surface of the biometric sensor module. This arrangement allows space for the contacts to engage without causing unnecessary thickness at the sensor module. ©he or more electronic components may also be embedded within the card body and connected to the circuit for processing biometric data received from the biometric sensor. The card body may be formed integrally about the embedded components, for example by lamination. in one embodiment, the electronic Components include a memory and processor connected to the circuit, the memory storing reference data and the processor being configured to compare biometric data received from the sensor with the stored reference data.

The circuit may include an antenna for wireless communication with a card reader, for example using RF communication. Thus, the card may be an RFID card. The card may or may not include a battery for powering the RF communication.

The biometric sensor module is preferably a fingerprint sensor module. In various embodiments, the fingerprint sensor module may apply a voltage to the finger to detect a fingerprint; for example; it may incfude an active capacitance fingerprint sensor.

The electronic card preferably has a thickness less than Θ J1 mm, and preferably of about 0.76 mm (e.g. ± 0 08 mm), which are the thickness of a norma! smart card. These thicknesses have been difficult to achieve using prior art techniques. The electronic card preferably also has a width of between 85.47 mm and 85.72 mm, and a height of between 53.92 mm and 54.03 mm. More generally, the electronic card preferably complies with IS© 7815, which is the specification for a smart card.

In various embodiments, the card body is formed from PVC. The circuit substrate is preferably a flexible! circuit substrate, and may be flexible printed circuit board circuit, for example the circuit may be etched on the flexible substrate. Flexible is intended to mean at least sufficiently flexible such that the card can comply with the bending requirements Of IS© 7816.

In some embodiments^ the contacts of the transition member are connected to the contacts of the circuit using an anisotropic conductive adhesive, which is preferably epoxy-based. An anisotropic conductive adhesive conducts only in one direction, i.e. the thickness dlieclion. This means that the anisotropic conductive adhesive does not conduct between adjacent contacts, even if connected by the adhesive. This is particularly important when using a transition member because the transition member desirably has a relatively narrow width, compared to the sensor module, and so may have a higher density of contacts than if the contacts were arranged across the underside of the sensor module.

The card may further comprise a reinforcement member configured to protect the biometric sensor module, preferably against bending moments. The biometric sensor is relatively weak compared to the main body of the card, and bending In particular can damage a biometric sensor. The addition of a reinforcement member can reduce the risk of damage to the sensor when bending by increasing the stiffness of the card at the location of the sensor module, and hence reducing the bending forces applied to the module.

The reinforcement member preferably also reinforces the transition member, and particularly the electrical connection between the transition member and the biometric sensor module. The connection means (e.g. fine wires or the like) will typically extend length-ways along the card and between the biometric sensor module and the transition module, and may be close to the face of the card. Thus, length-ways bending of the card could put high strain on these connections. The reinforcement member reduces such forces, by stiffening the card at this location, reducing the bending effect that could pul! the biometric sensor away from the transition member,

The reinforcement member is preferably made of metal, such as steel (e.g. stainless steel) or copper. Metal has much higher resistance to bending than typical materials used to make such cards, e;g. PVC or other plastics materials.

In one embodiment, where biometric sensor is an active capacitance fingerprint sensor, the reinforcement member may be configured to operate as an electrode of the sensor. For example, the reinforcement member may comprise a conductive surface oh the front face of the card for contact with the finger. Compared to normal electrodes, the reinforcement member may be thicker in cross-section, or may surround a greater amount of the sensor in order to provide the reinforcement effect, in preferred embodiments, the reinforcement member completely surrounds the sensor module (and the transition member).

The reinforcement member may comprise a planar portion adjacent a front face of the biometric sensor module and surrounding adjacent a sensing area of the biometric sensor module. The planar portion may form a rectangular plate, an in one configuration has a central hole for the sensing area to be exposed, for example a rectangular hole.

The reinforcement member may comprise an edge portion adjacent the sides of the biometric sensor module and the transition member. The edge portion may form a closed shape around all sides of the biometric sensor module and transition member. For eXample, a tubular, rectangular shape.

In one embodiment the reinforcement member comprises both the planar portion and the edge portion, with the edge portion extending away from the plane df the planar portion. These portions may be integrally connected such that the reinforcement member has an open; box-like structure;

The reinforcement member, in one example takes the form of an Open frame with one or mote sides of the frame having an inverted, L-shape section (i.e. with the bottom of the L-shape at the front of the card), preferably with the planar portion forming a horizontal of the inverted L-shape and the edge portion forming a vertical of the inverted L-shape. This shape has been found to be highly effective at protecting the biometric sensor and transition member against damage.

The thickness of the, or each, of the planar portion and/or the edge portion may be at least 0.05 mm.

The electronic card may be any one ff: an access card; a credit card; a debit card; a pre-pay card; a loyalty card; an identity card; and a cryptographic card.

The electronic card is preferably arranged to be inoperable if the biometric sensor dies nol provile an indication of an authorised user.

The present invention also provides, in a second aspect, a method of manufacturing an electronic card, the method comprising: providing a biometric sensor having one or more contacts formed on a front face or a side face thereof; providing a card body including an embedded circuit substrate, a cavity in the card body exposing contacts of a circuit on the substrate; and mounting the biometric sensor and a transition member adjacent one another in the cavity such that the transition member electrically connects the contacts of the biometric sensor module to the contacts of the circuit.

This method of manufacture results m a card having a reduced thickness compared to prior artstechniques. In various embodiments, the card being manufactured is a card according to the first aspect, Thus, the card being manufactured may optionaily include any or ail of the optionai features above, and the method may include providing such features.

In the method, the transition member is preferably electrically connected to the contacts of the biometric sensor before installing the biometric sensor and the transition member into the cavity. Alternatively! however, tie transition member may be electrically connected to the contacts of the biometric sensor after installing the biometric sensor and the transition member into the cavity.

Preferably Wails of the cavity are coated with an adhesive (such as an epoxy) prior to the biometric sensor and transition member being inserted. The adhesive seals the sensor and transition member in place to prevent them becoming dislodged and being disconnected from the circuit.

The transition member may be bonded or otherwise joined to the biometric sensor before instaHatidn into the cavity, This provides a single unit to be installed into the card body: Furthermore, the transition member may provide some protection to the reiatively-fragile sensor module against bending*

In Other embodiments, the transition member may be bonded to the biometric sensor at the same time as the biometric sensor is bonded to the card body, e.g. when curing an epoxy holding the sensor module within the cavity.

Preferably! the transition member is connected to the contacts using a conductive adhesive (e:|| a conductive epoxy). This ensures a good ohmic contact between the sensor and the contacts within the cavity. The conductive adhesive should be selected so that its curing temperature is low enough not to damage the biometric sensor. For example, the conductive adhesive may have a curing temperature of less than 100°C, more preferably less than SOX, this being a typical maximum designed operating temperature for many biometric sensors. An adhesive that cures at room temperature may be used;

The conductive adhesive may be an anisotropic conductive adhesive; As above, the use of anisotropic conductive adhesive means that substantia! conduction does not occur between the contacts, even if some of the adhesive spills over between the contacts. This allows more freedom in selecting the technique/apparatus that applies the conductive a, since less accuracy is required.

The method may comprise forming the cavity, preferably if removing material from a preformed card body to form the cavity. Particularly, the cavity may be milled using a precision end mill or, more preferably, a laser mill, A laser milling machine is very precise and can be adjusted to remove just the plastic and not the contact material, which is more difficult with conventional mechanical milling.

The depth of the milling is preferably designed to end just at the level of the circuit within the card body such that the contacts are exposed.

The card body may be formed by a method comprising; providing a first plastic layer; providing the circuit substrate on the first plastic layer; providing a second plastic layer on the first plastic layer with the circuit substrate interposed between the first plastic iayer and the second plastic layer; and laminating the first plastic layer and the second plastic iayer to form the card. The laminating may be performed at a temperature of at least 135°C and/or a pressure of at least 5 MPa, and is preferably performed at a temperature of at least 150°C and a pressure of at least 6.5 MPa. In some embodiments, additional layers may be provided above and/or below the first and second layers prior to lamination.

The present method is particularly advantageous when the above manufacturing method is used to produce the card body. Particularly, the lamination process above allows for materials such PVC to be used for the card body. With the method of the present aspect, it is possible for such: a lamination technique to be used to provide an. electronic card including heat sensitive parts. Additionally, by pre-forming the card body in this manner; known card forming techniques may be used to manufacture the card body allowing the manufacturing method of the present aspect to be compatible with existing techniques.

The method of the above aspect may be used to manufacture electronic cards for a number of purposes where it is necessary for the identity of the hearer of the electronic card to be verified. For example, the electronic card manufactured in accordance with the above aspect may be any one of: an access card; a credit card; a debit card, a pre-pay card; a loyalty card; an identify card; and a cryptographic card. As discussed above, the electronic card is preferably arranged to be inoperable if the biometric sensor does not provide an indication of an authorised user. Thus, the electronic card may provide its desiredfunction only when the biometric information confirms that the user is authorised. For example, where the electronic card is an access Card, the access card may provide access only when the user is authorised. Further, the method of the above aspect may be used to manufacture electronic cards which use any one or more of: an RFID circuit and/or an electrical contact pad.

Certain preferred embodiments of the present invention will now be described in greater detail, by way of examfie only, with reference to the accompanying drawings, in whilh:

Figures 1A and 1B illustrate a first electronic card manufactured in accordance with a prior art method;

Figures 2A and 2B illustrate a second electronic card having reduced thickness compaied ιο the cards shown in Figure 1;

Figures 3A and 3B shows a variation of the second electronic card including a reinforcement member;

Figure 4 shows a detail view of a first reinforcement member; and

Figure 5 shows a detail view of a second reinforcement member.

In the card 2 Illustrated in Figures 1A arid IB, the fingerprint sensor module 4 has rows of contacts 12 on the rear surface (the side opposite to the scanning side) designed to be connected to a circuit 6 embedded in the smartcard 2. This configuration results in two sets of contacts 8, 12 (One set on the card circuit 6 and one set on the sensor module 10) being present between the circuit layer 6 of the card 2 and the sensor 10. These contacts 8,12 have a considerable thickness, relative to the thickness Of the card body 4, and have been found to result in ah undesirable thick card 2, as a whole.

Figures 2A and 2B illustrate an alternative configuration fir a card 20 that reduces this problem. In this configuration, the sensor module 21 has contacts formed on the (font surface of the module 22, i.e. the side one on which the finger is to be placed to be scanned. In order to connect the contacts of the sensor module 22 to contacts 24 of the circuit 26 embedded within the body 28 of the card 20, a transition member 30 is provided. The transition member 30 is fitted into the cavity, adjacent the moduie 22. The transition member 31 connects to the contacts of the sensor moduie 22 by wire bonding, and provides contact pads 32 on its rear surface that correspond to contact pads 24 on the flex circuit 26·

The fear face of the transition member 30 is offset with respect to the rear face of the sensor module 22 such that the rear surface of the sensor moduie 22 just touches the circuit substrate 26 of the card 20 when the contact pads 32 of the transmission member 30 are in contact with the pads 24 of the circuit.

Thus, in Figures 2A and 2B, the bond pads 32 that connect to the circuit 26 are formed on the offset transition member 30, and therefore card thickness can be reduced compared to the configuration of Figures 1A and 1i.

In a preferred embodiment, the fingerprint sensor 22 applies a high frequency AC voltage signal to the skin when a measurement takes place. The individual pixels of the sensor 22 are excited by this signal and have a voltage impressed upon them that is a function of the closeness of the finger to the sensor 22. in other words the variable profile Of the fingerprint is impressed on the Sensor 22 and can be read out to form an image of the fingerprint. Such fingerprint sensors are known as active capacitance fingerprint sensors (sometimes also known as an AC or RF fingerprint sensors). An example of such fingerprint sensors include the FPC1025 and FPC1055 sensors manufactured by Fingerprint Cards AES. ft is necessary, for the correct function of this type of fingerprint sensor 22, to provide an electrode 42 at the periphery of the sensor face that is in contact with the finger. This electrode 42 carries the electrical signa! Which causes the voltage signal to be imparted to the finger.

In the card 40 shown in Figures 3A and 3B, this electrode 42 has been shaped to form an enclosure, whereby the whoie sensor face is surrounded (see Figure 3B). More specifically, the electrode 42 is shaped like a box and provides strength to the otherwise very vulnerable sensor moduie 22. As illustrated in Figure 3A, the box of the electrode 42 also encloses the transition member 30. A box-like shape is relatively harci to bend. The box-shape of the electrode 42 has a cross sectional thickness sufficient to provide the desired reinforcement. This configuration provides structural integrity for the fingerprint sensor 22 and transition member 30, which may be relatively weak and could be damaged or pulled apart when the card is bend, as well as a useful electrode for active capacitance fingerprint detection.

Figures 4 and I show details of two alternative, exemplary reinforcement members 42’ 42”.

The reinfofdim|n| members 42^, 42" each comprise an edge portion 44 that fits adjacent the sides Of the biometric sensor module 22 and the transition member 30. The edge portion 44 has a tubular, rectangular shape, although it is envisaged that, in some embodiment, it may not form a complete tube. For example, the edge portion 44 could be present only around the Comers Of the reinforcement member, or couid be only present along the sides and not at the comers.

The reinforcement members 42’, 42” further comprise a planar portion 46 that is formed integrally with the side portion 44, and fits adjacent a front face of the biometric sensor module 22.

In the first reinforcement member 42’, the planar portion 46’ is strip-shaped and serves as the electrode for the sensor module II, As can be seen from Figure 3A, the planar portion 46’ covers the transition member 30, protecting the delicate wire-bonding between the transition member 30 and the sensor module 22 from being damaged as the card 40 flexes.

In this example, the reinforcement member 42’ is in the shape of a rectangular frame having a generally inverted L-shape cross-section along one side, and a generally planar cross-section along the other sides.

In the second reinforcement member 42”, the planar portion 46" extends around the entire reinforcement member 42”. Thus, it surrounds a scanning area of the biometnc sensor module 22. The planar portion 46” is thus shaped as a rectangular plate with a reefengujar hole exposing the sensing area.

In this example, the reinforcement member 42’ is in the shape of a rectangular frame having a generally inverted L-shape cross-section along all of its sides.

These shapes have been found to be highly effective at protecting the biometric sensor module 22* and also the electrical connections to the transition member 30, against damage^

Further features of the cards 20, 40 are discussed below.

The smart card 20, 40 comprise the card body 28 and a circuit substrate 26 enclosed within the card body. The circuit substrate 26 is in the form of a flexible printed circuit board 26, which is preferably made from polyamide or FR-4 grade gtasssreinforced epoxy laminate, with an etched, copper circuit formed on the surface.

The circuit substrate 261s laminated between at least two layers of plastic The at least two layers of plastic include an first layer of plastic and a Second layer of plastic with the circuit 26 sandwiched between the first and second layers. The layers of plastic are made of Pf <|; however, other plastics may be used. Examples of other suitable plastics include polyester, acrylonitriie-butadiene-styrene (ABS), and any other suitable plastic. Additionally, plasticisers or dyes may be added to the plastic to achieve a desired look and feel.

An antenna 30 is connected to the circuit substrate 26 and is also embedded within the card body 28. The antenna 30 is used to communicate with a card reader, which is external to card 20, 40. The antenna 30 may be formed by etching a suitable pattern onto a copper cladding of the printed circuit board 2|. A number of additional components are also mounted to the circuit substrate 26. These include a processor and a memory. The memory is arranged to store biometric information relating to a bearer of the smart card 20, 40 arid the processor is arranged to compare the biometric information stored on the memory to biometric information acquired by the biometric sensor modufe 22 and communicated via the contacts 24 of the circuit substrate 26. The processor is therefore arranged to determine if the user is an authorised user based on an Indication provided by the biometric sensor.

Furtherm ore, subject to verification of the bearer of the smart card 20 ,41, the processor is arranged to communicate the data stored on the memory to a card reader, for example using the antenna 30,

The additional components 36 may, in some embodiments, also include a battery which is configured to power the memory and processor. Alternatively, or in addition to the battery, the card 20, 40 may be arranged to be powered via a contact pad (not shown) that couples to a power source, such as a contact card reader, or the card 20,40 may be arranged to draw power from the antenna 34 when it is energised by a contactless card reader.

The cards 20, 40 shown in Figures 2 and 3 may be manufactured using a suitably modified version of the method described in US 2015/049925*

For example^ an exemplary method of manufacturing the cards 20, 40 includes: forming a card body 28 including a circuit substrate 26 on which is formed a circuit having contacts 24 for connection to a biometric sensor 22, the contacts 24 being embedded within the card body 28; forming a cavity in the card body 28 to expose the contacts 24 and to receive the biometric sensor module 22 and transition member 30; connecting the contacts of the biometric sensor module 22 to the transition member 30; installing the biometric sensor module 22 and the transition member 30 into the cavity; and connecting the contacts 32 of the transition member 30 to the contacts 24 of the circuit 26 using a conductive epoxy.

The electrode 42, if desired, may be fitted to the biometric sensor 22 and transition member 30 before installation into the cavity, or may be installed around the biometric sensor 22 and transition member 30 after their installation into the cavity.

The card body 28 may be produced by a hot lamination method, for example as described in US 6,586,078 82. A suitable hot lamination method could comprise the following steps: forming a core; by providing first and second layers of plastic and positioning the circuit substrate 28 between the first and second layers of plastic to thus form the core; placing the core in a laminator; applying a heat cycle to the core in th| liminator to liquefying or partially liquefying the layers of plastic, the heat cycle operating at a temperature of between 135°C and 250°C; increasing a laminator ram pressure in combination: with the heat to a pressure of approximately 6.5 MPa; applying a cooling cycle to the core in the laminator with an associated increase In ram pressure of approximately 25% until the core has cooled to approximately 5C,C to 2Q°C; and removing the core from the laminator.

Conventional processing techniques, that would be well known to the person skilled in the art, may then be applied to the cor® to form the card body 28. Such processing techniques may include inking, the formation of an overiaminate film, or the like.

The cavity is then misled into the surface Of the card body 28. This may be done using a precision end mill or, more preferably; a laser mill. The depth of the milling is set so that the base of the cavity is at the level of the circuit substrate 26 within the card body 28, such theft the contacts 24 are exposed, A Conductive epoxy is then applied to the surface of the contacts 24 of the circuit prior to the biometric sensor module 22 and transition member 30 being inserted. A suitable conductive epoxy is type SEC1222 epoxy, manufactured by Resinlab, LLC of Wisconsin USA, which cures at room temperatures (approx. 25°C). A conductive epoxy having a strongly anisotropic characteristic may be used. This is beneficial when the contacts 24 on the transition member 30 are very close together because it provides the required conductivity between the respective contacts 24; 32, whilst ensuring that the epoxy does not form any appreciable conductive path between adjacent contacts; even if the conductive epoxy flows between them. interior walls of the cavity are coated with an adhesive epoxy prior to the biometric sensor module 22 and transition member 30 being inserted. The adhesive epoxy seals the biometric sensor module 22 and transition member 30 in place to prevent them from becoming dislodged and becoming disconnected from the contacts 24 of the circuit substrate 26.

The biometric sensor 22 and transition member 30 are then electrically connected and bonded to One another, aligned with the cavity and pushed into cavity such that the contacts 32 on the transition member 30 and the contacts 24 in the circuit substrate 24 are brought into electrical contact through the conductive Ipoxy Preferably, the rear surface of the sensor module 22 is flush against the circuit substrate, thus minimising the projection of the module 22 from the card body m.

The conductive epoxy and adhesive epoxy preferably cure without heating^ However, alternatively, one or both of the conductive epoxy and adhesive epoxy may require heat curing where the curing temperature of the conductive epoxy and/or adhesive epoxy is below a safe temperature of the biometric sensor module 22, for example below 60°C. Higher temperatures may be possible for short time periods and/or for different sensor types.

Claims

CLAIMS;

1. An electronic card comprising: a card body having a cavity formed therein; a circuit substrate embedded within the card body, the circuit substrate having a circuit with one or more contacts that are exposed by the cavity; a biometric sensor mounted within the cavity with its rear face orientated towards the circuit substrate, the biometric sensor having one or more contacts formed on a front face or a side face thereof; and a transition member mounted within the cavity adjacent the biometric sensor module and electrically connecting the contacts of the biometric sensor to the contacts of the circuit.
2. An electronic card according to claim 1, wherein the rear face of the biometric sensor is in contact with or bonded to the circuit substrate.
3. An electronic card according to claim 1 or 2, wherein the contacts of the transition member are formed on a rear face of the transition member.
4. An electronic Card according to claim 1, 2 or 3, wherein the rear surface of the transition member is offset away from the circuit substrate with respect to the rear surface of the biometric sensor.
5. An electronic card according to any preceding claim, wherein the one or more electronic components are connected to the circuit for processing biometric data received from the biometric sensor and are embedded within the card body. Θ, An electronic card according to any preceding claim, wherein the biometric sensor module is a ftigerprint sensor module. Ψ. An electronic card according to any preceding claim, wherein the electronic card has a thickness less than 1:84 mm, and preferably of about 0.7| mm.
8. An eleetrenie card according to any preceding claim, wherein the contacts of the transition member are connected to the contacts of the circuit substrate usi ng a anisotropic conductive adhesive.
9. An electronic card according to any preceding claim, further comprising a reinforcement member configured to protect the biometric sensor module and transition member against damage caused by bending;
19, An electronic card according to ciaim 9, wherein tie reinforcement member has an open frame shape and encloses the sensor module and the transition member.
11. A method Of manufacturing an electronic card, the method Comprising: providing a biometric sensor having one or more contacts formed on a front face or a side face thereof; providing a card body including an embedded circuit substrate, a cavity in the card body exposing contacts of a circuit On the substrate; and mounting the biometric sensor and a transition member adjacent one another in the cavity such that the transition member eiectricaiiy connects the contacts pf the biometric sensor module to the contacts of the circuit.
12. A method according to claim 11, wherein the transition member is electrically connected to the contacts of the biometric sensor before mounting the biometric sensor and the transition member into the cavity.
13. A method according to ciaim 11 or 12, wherein the transition member Is joined to the biometric sensor before mounting the biometric sensor and the transition member into the cavity.