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GB2433649B - Semiconductor-on-insulator structures - Google Patents

Semiconductor-on-insulator structures

Info

Publication number
GB2433649B
GB2433649B GB0526117A GB0526117A GB2433649B GB 2433649 B GB2433649 B GB 2433649B GB 0526117 A GB0526117 A GB 0526117A GB 0526117 A GB0526117 A GB 0526117A GB 2433649 B GB2433649 B GB 2433649B
Authority
GB
United Kingdom
Prior art keywords
semiconductor
insulator structures
insulator
structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0526117A
Other versions
GB0526117D0 (en
GB2433649A (en
Inventor
Marek Izmajlowicz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cambridge Semiconductor Ltd
Original Assignee
Cambridge Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cambridge Semiconductor Ltd filed Critical Cambridge Semiconductor Ltd
Priority to GB0526117A priority Critical patent/GB2433649B/en
Publication of GB0526117D0 publication Critical patent/GB0526117D0/en
Publication of GB2433649A publication Critical patent/GB2433649A/en
Application granted granted Critical
Publication of GB2433649B publication Critical patent/GB2433649B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/911Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using passive elements as protective elements
    • H01L27/0288
    • H01L29/8605
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/40Resistors
    • H10D1/43Resistors having PN junctions
    • H01L27/0251
    • H01L27/1203
    • H01L29/78603
    • H01L29/78606
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6704Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6758Thin-film transistors [TFT] characterised by the insulating substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/811Combinations of field-effect devices and one or more diodes, capacitors or resistors
    • H10D84/817Combinations of field-effect devices and resistors only
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/201Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
GB0526117A 2005-12-22 2005-12-22 Semiconductor-on-insulator structures Expired - Fee Related GB2433649B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0526117A GB2433649B (en) 2005-12-22 2005-12-22 Semiconductor-on-insulator structures

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0526117A GB2433649B (en) 2005-12-22 2005-12-22 Semiconductor-on-insulator structures

Publications (3)

Publication Number Publication Date
GB0526117D0 GB0526117D0 (en) 2006-02-01
GB2433649A GB2433649A (en) 2007-06-27
GB2433649B true GB2433649B (en) 2011-01-19

Family

ID=35840963

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0526117A Expired - Fee Related GB2433649B (en) 2005-12-22 2005-12-22 Semiconductor-on-insulator structures

Country Status (1)

Country Link
GB (1) GB2433649B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009081381A (en) * 2007-09-27 2009-04-16 Panasonic Corp Semiconductor device
TW201140798A (en) * 2009-12-30 2011-11-16 Intersil Inc Current sensor for a semiconductor device and system

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5786616A (en) * 1994-09-19 1998-07-28 Nippondenso, Co., Ltd. Semiconductor integrated circuit having an SOI structure, provided with a protective circuit
US6074899A (en) * 1997-04-04 2000-06-13 International Business Machines Corporation 3-D CMOS-on-SOI ESD structure and method
US20010010964A1 (en) * 1999-07-01 2001-08-02 International Business Machines Corporation Method and structure for SOI wafers to avoid electrostatic discharge
EP1174923A1 (en) * 2000-07-17 2002-01-23 Agere Systems Guardian Corporation Electrostatic discharge protection device with monolithically formed resistor-capacitor portion
WO2004040656A1 (en) * 2002-10-31 2004-05-13 Infineon Technologies Ag Mos transistor on an soi substrate with a source through-connection
US20070040236A1 (en) * 2005-08-22 2007-02-22 International Business Machines Corporation Discrete on-chip soi resistors
US20080247101A1 (en) * 2007-04-09 2008-10-09 Advanced Micro Devices, Inc. Electronic device and method
US20100052100A1 (en) * 2008-08-29 2010-03-04 International Business Machines Corporation Deep trench electrostatic discharge (esd) protect diode for silicon-on-insulator (soi) devices

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5786616A (en) * 1994-09-19 1998-07-28 Nippondenso, Co., Ltd. Semiconductor integrated circuit having an SOI structure, provided with a protective circuit
US6074899A (en) * 1997-04-04 2000-06-13 International Business Machines Corporation 3-D CMOS-on-SOI ESD structure and method
US20010010964A1 (en) * 1999-07-01 2001-08-02 International Business Machines Corporation Method and structure for SOI wafers to avoid electrostatic discharge
EP1174923A1 (en) * 2000-07-17 2002-01-23 Agere Systems Guardian Corporation Electrostatic discharge protection device with monolithically formed resistor-capacitor portion
WO2004040656A1 (en) * 2002-10-31 2004-05-13 Infineon Technologies Ag Mos transistor on an soi substrate with a source through-connection
US20070040236A1 (en) * 2005-08-22 2007-02-22 International Business Machines Corporation Discrete on-chip soi resistors
US20080247101A1 (en) * 2007-04-09 2008-10-09 Advanced Micro Devices, Inc. Electronic device and method
US20100052100A1 (en) * 2008-08-29 2010-03-04 International Business Machines Corporation Deep trench electrostatic discharge (esd) protect diode for silicon-on-insulator (soi) devices

Also Published As

Publication number Publication date
GB0526117D0 (en) 2006-02-01
GB2433649A (en) 2007-06-27

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20150402 AND 20150408

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20151222