GB2412010B - Method of processing diamond - Google Patents
Method of processing diamondInfo
- Publication number
- GB2412010B GB2412010B GB0405542A GB0405542A GB2412010B GB 2412010 B GB2412010 B GB 2412010B GB 0405542 A GB0405542 A GB 0405542A GB 0405542 A GB0405542 A GB 0405542A GB 2412010 B GB2412010 B GB 2412010B
- Authority
- GB
- United Kingdom
- Prior art keywords
- processing diamond
- diamond
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H10P90/1914—
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/04—Diamond
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
- H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
- H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
-
- H01L21/8206—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/032—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using diamond technology
-
- H10P10/128—
-
- H10P90/00—
-
- H10P90/1922—
-
- H10W10/181—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0405542A GB2412010B (en) | 2004-03-10 | 2004-03-10 | Method of processing diamond |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0405542A GB2412010B (en) | 2004-03-10 | 2004-03-10 | Method of processing diamond |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB0405542D0 GB0405542D0 (en) | 2004-04-21 |
| GB2412010A GB2412010A (en) | 2005-09-14 |
| GB2412010B true GB2412010B (en) | 2008-02-13 |
Family
ID=32117510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0405542A Expired - Fee Related GB2412010B (en) | 2004-03-10 | 2004-03-10 | Method of processing diamond |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2412010B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5650639A (en) * | 1993-03-11 | 1997-07-22 | Harris Corporation | Integrated circuit with diamond insulator |
| US6562127B1 (en) * | 2002-01-16 | 2003-05-13 | The United States Of America As Represented By The Secretary Of The Navy | Method of making mosaic array of thin semiconductor material of large substrates |
-
2004
- 2004-03-10 GB GB0405542A patent/GB2412010B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5650639A (en) * | 1993-03-11 | 1997-07-22 | Harris Corporation | Integrated circuit with diamond insulator |
| US6562127B1 (en) * | 2002-01-16 | 2003-05-13 | The United States Of America As Represented By The Secretary Of The Navy | Method of making mosaic array of thin semiconductor material of large substrates |
Non-Patent Citations (1)
| Title |
|---|
| Wolter S D et al. , "Direct fusion bonding of silicon to polycrystalline diamond", Diamond and Related Materials vol 11 pp482-486, 2002 * |
Also Published As
| Publication number | Publication date |
|---|---|
| GB0405542D0 (en) | 2004-04-21 |
| GB2412010A (en) | 2005-09-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| PL2302097T3 (en) | Method of surface treatment | |
| TWI366493B (en) | Laser processing method | |
| ZA200801952B (en) | Method of processing materials | |
| IL180742A0 (en) | Method of manufacture | |
| ZA200701639B (en) | Method of centerless grinding | |
| ZA200805297B (en) | Method of using ß-hydroxy-ß-methylbutyrate | |
| GB0325192D0 (en) | Method of use | |
| SG118403A1 (en) | Wafer dividing method | |
| GB0422004D0 (en) | Method of deprotection | |
| EP1734334A4 (en) | Blasting method | |
| AP1986A (en) | Detection of diamonds | |
| PL1685926T3 (en) | Grinding method | |
| HUP0401134A2 (en) | Method for processing of polymer wasts like matrixmatherial | |
| GB0418633D0 (en) | Method of making abrasive article | |
| EP1809276A4 (en) | Treatment method | |
| GB0400840D0 (en) | Method of processing oscillatory data | |
| GB2412010B (en) | Method of processing diamond | |
| SG120323A1 (en) | Polishing method | |
| GB2410872B (en) | Signal processing method | |
| GB0409416D0 (en) | Method of filtering | |
| SG122020A1 (en) | Polishing method | |
| GB0409178D0 (en) | Method of cleaning | |
| GB0402794D0 (en) | Signal processing method | |
| GB0415170D0 (en) | Method of determination | |
| GB0419826D0 (en) | Method of determination |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20100310 |