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GB2411771B - Heat dissipation method for electronic apparatus - Google Patents

Heat dissipation method for electronic apparatus

Info

Publication number
GB2411771B
GB2411771B GB0404447A GB0404447A GB2411771B GB 2411771 B GB2411771 B GB 2411771B GB 0404447 A GB0404447 A GB 0404447A GB 0404447 A GB0404447 A GB 0404447A GB 2411771 B GB2411771 B GB 2411771B
Authority
GB
United Kingdom
Prior art keywords
heat dissipation
electronic apparatus
dissipation method
electronic
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0404447A
Other versions
GB2411771A (en
GB0404447D0 (en
Inventor
Hsiang-Hsi Yang
Chia Ching Lin
Kuo Lung Shih
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giga Byte Technology Co Ltd
Original Assignee
Giga Byte Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giga Byte Technology Co Ltd filed Critical Giga Byte Technology Co Ltd
Priority to GB0404447A priority Critical patent/GB2411771B/en
Publication of GB0404447D0 publication Critical patent/GB0404447D0/en
Publication of GB2411771A publication Critical patent/GB2411771A/en
Application granted granted Critical
Publication of GB2411771B publication Critical patent/GB2411771B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB0404447A 2004-02-27 2004-02-27 Heat dissipation method for electronic apparatus Expired - Fee Related GB2411771B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0404447A GB2411771B (en) 2004-02-27 2004-02-27 Heat dissipation method for electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0404447A GB2411771B (en) 2004-02-27 2004-02-27 Heat dissipation method for electronic apparatus

Publications (3)

Publication Number Publication Date
GB0404447D0 GB0404447D0 (en) 2004-03-31
GB2411771A GB2411771A (en) 2005-09-07
GB2411771B true GB2411771B (en) 2006-01-18

Family

ID=32051034

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0404447A Expired - Fee Related GB2411771B (en) 2004-02-27 2004-02-27 Heat dissipation method for electronic apparatus

Country Status (1)

Country Link
GB (1) GB2411771B (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5276584A (en) * 1991-10-31 1994-01-04 Northern Telecom Limited Electronic unit
GB2295494A (en) * 1994-11-25 1996-05-29 Ming Der Chiou Power supplier of direct current with a heat dissipation case
JP2001044674A (en) * 1995-10-13 2001-02-16 Hitachi Ltd Electronic equipment
GB2358521A (en) * 2000-01-24 2001-07-25 Chen Yang Shiau Heat sink structure adapted for use in a computer housing
US6377462B1 (en) * 2001-01-09 2002-04-23 Deere & Company Circuit board assembly with heat sinking
US20030156386A1 (en) * 2002-02-20 2003-08-21 Summers Mark D. Thermal solution for a mezzanine card

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5276584A (en) * 1991-10-31 1994-01-04 Northern Telecom Limited Electronic unit
GB2295494A (en) * 1994-11-25 1996-05-29 Ming Der Chiou Power supplier of direct current with a heat dissipation case
JP2001044674A (en) * 1995-10-13 2001-02-16 Hitachi Ltd Electronic equipment
GB2358521A (en) * 2000-01-24 2001-07-25 Chen Yang Shiau Heat sink structure adapted for use in a computer housing
US6377462B1 (en) * 2001-01-09 2002-04-23 Deere & Company Circuit board assembly with heat sinking
US20030156386A1 (en) * 2002-02-20 2003-08-21 Summers Mark D. Thermal solution for a mezzanine card

Also Published As

Publication number Publication date
GB2411771A (en) 2005-09-07
GB0404447D0 (en) 2004-03-31

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20190227