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GB2405532B - Open-back high speed package - Google Patents

Open-back high speed package

Info

Publication number
GB2405532B
GB2405532B GB0320089A GB0320089A GB2405532B GB 2405532 B GB2405532 B GB 2405532B GB 0320089 A GB0320089 A GB 0320089A GB 0320089 A GB0320089 A GB 0320089A GB 2405532 B GB2405532 B GB 2405532B
Authority
GB
United Kingdom
Prior art keywords
open
high speed
back high
speed package
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0320089A
Other versions
GB2405532A (en
GB0320089D0 (en
Inventor
Martyn Owen
Andrew Thompson
Jason Gregory
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Agilent Technologies Inc
Original Assignee
Avago Technologies Fiber IP Singapore Pte Ltd
Avago Technologies General IP Singapore Pte Ltd
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avago Technologies Fiber IP Singapore Pte Ltd, Avago Technologies General IP Singapore Pte Ltd, Agilent Technologies Inc filed Critical Avago Technologies Fiber IP Singapore Pte Ltd
Priority to GB0320089A priority Critical patent/GB2405532B/en
Publication of GB0320089D0 publication Critical patent/GB0320089D0/en
Publication of GB2405532A publication Critical patent/GB2405532A/en
Application granted granted Critical
Publication of GB2405532B publication Critical patent/GB2405532B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
GB0320089A 2003-08-28 2003-08-28 Open-back high speed package Expired - Fee Related GB2405532B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0320089A GB2405532B (en) 2003-08-28 2003-08-28 Open-back high speed package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0320089A GB2405532B (en) 2003-08-28 2003-08-28 Open-back high speed package

Publications (3)

Publication Number Publication Date
GB0320089D0 GB0320089D0 (en) 2003-10-01
GB2405532A GB2405532A (en) 2005-03-02
GB2405532B true GB2405532B (en) 2007-03-21

Family

ID=28686426

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0320089A Expired - Fee Related GB2405532B (en) 2003-08-28 2003-08-28 Open-back high speed package

Country Status (1)

Country Link
GB (1) GB2405532B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201012829D0 (en) 2010-07-30 2010-09-15 Oclaro Technology Ltd Enclosure for a laser package and laser package comprising same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987002833A1 (en) * 1985-10-28 1987-05-07 American Telephone & Telegraph Company Multilayer ceramic laser package
US5412748A (en) * 1992-12-04 1995-05-02 Kabushiki Kaisha Toshiba Optical semiconductor module
EP0750204A1 (en) * 1995-06-22 1996-12-27 Hitachi, Ltd. Optical semiconductor array module, method of fabricating the module, and external board mounting structure of the module
US6422766B1 (en) * 1998-05-27 2002-07-23 Siemens Aktiengesellschaft Ag Housing configuration for a laser module
EP1298473A1 (en) * 2001-09-27 2003-04-02 Agilent Technologies, Inc. (a Delaware corporation) A package for opto-electrical components

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987002833A1 (en) * 1985-10-28 1987-05-07 American Telephone & Telegraph Company Multilayer ceramic laser package
US5412748A (en) * 1992-12-04 1995-05-02 Kabushiki Kaisha Toshiba Optical semiconductor module
EP0750204A1 (en) * 1995-06-22 1996-12-27 Hitachi, Ltd. Optical semiconductor array module, method of fabricating the module, and external board mounting structure of the module
US6422766B1 (en) * 1998-05-27 2002-07-23 Siemens Aktiengesellschaft Ag Housing configuration for a laser module
EP1298473A1 (en) * 2001-09-27 2003-04-02 Agilent Technologies, Inc. (a Delaware corporation) A package for opto-electrical components

Also Published As

Publication number Publication date
GB2405532A (en) 2005-03-02
GB0320089D0 (en) 2003-10-01

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20130725 AND 20130731

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20140828