[go: up one dir, main page]

GB2499792B - Electronic device comprising an electronic die and a substrate integrated waveguide, and flip-chip ball grid array package - Google Patents

Electronic device comprising an electronic die and a substrate integrated waveguide, and flip-chip ball grid array package

Info

Publication number
GB2499792B
GB2499792B GB1203405.4A GB201203405A GB2499792B GB 2499792 B GB2499792 B GB 2499792B GB 201203405 A GB201203405 A GB 201203405A GB 2499792 B GB2499792 B GB 2499792B
Authority
GB
United Kingdom
Prior art keywords
flip
grid array
ball grid
electronic
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1203405.4A
Other versions
GB2499792A (en
GB201203405D0 (en
Inventor
Merlet Hervé
Le Bars Philippe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to GB1203405.4A priority Critical patent/GB2499792B/en
Publication of GB201203405D0 publication Critical patent/GB201203405D0/en
Publication of GB2499792A publication Critical patent/GB2499792A/en
Application granted granted Critical
Publication of GB2499792B publication Critical patent/GB2499792B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H10W74/117—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/08—Dielectric windows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/202—Coaxial filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/12—Hollow waveguides
    • H01P3/121—Hollow waveguides integrated in a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/02—Refracting or diffracting devices, e.g. lens, prism
    • H01Q15/08—Refracting or diffracting devices, e.g. lens, prism formed of solid dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0239—Signal transmission by AC coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H10W70/635—
    • H10W90/724—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Aerials With Secondary Devices (AREA)
GB1203405.4A 2012-02-28 2012-02-28 Electronic device comprising an electronic die and a substrate integrated waveguide, and flip-chip ball grid array package Active GB2499792B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1203405.4A GB2499792B (en) 2012-02-28 2012-02-28 Electronic device comprising an electronic die and a substrate integrated waveguide, and flip-chip ball grid array package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1203405.4A GB2499792B (en) 2012-02-28 2012-02-28 Electronic device comprising an electronic die and a substrate integrated waveguide, and flip-chip ball grid array package

Publications (3)

Publication Number Publication Date
GB201203405D0 GB201203405D0 (en) 2012-04-11
GB2499792A GB2499792A (en) 2013-09-04
GB2499792B true GB2499792B (en) 2016-05-04

Family

ID=45991820

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1203405.4A Active GB2499792B (en) 2012-02-28 2012-02-28 Electronic device comprising an electronic die and a substrate integrated waveguide, and flip-chip ball grid array package

Country Status (1)

Country Link
GB (1) GB2499792B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103762400B (en) * 2014-02-20 2016-04-13 东南大学 A kind of method and circuit transmission structure using substrate integration wave-guide connection circuit structure
EP2945222A1 (en) * 2014-05-14 2015-11-18 Gapwaves AB A microwave or millimeter wave RF part using pin grid array (PGA) and/or ball grid array (BGA) technologies
US10468738B2 (en) 2016-03-15 2019-11-05 Aptiv Technologies Limited Signaling device including a substrate integrated waveguide coupled to a signal generator through a ball grid array
US10199707B2 (en) * 2016-10-13 2019-02-05 Aptiv Technologies Limited Ball-grid-array radio-frequency integrated-circuit printed-circuit-board assembly for automated vehicles
US11183751B2 (en) * 2017-09-20 2021-11-23 Aptiv Technologies Limited Antenna device with direct differential input useable on an automated vehicle
DE102019200902A1 (en) 2019-01-24 2020-07-30 Audi Ag Radar sensor, motor vehicle and method for producing a radar sensor
US11139581B2 (en) 2019-03-07 2021-10-05 Aptiv Technologies Limited Signaling device including a slot transition between a substrate integrated waveguide and a signal generator
DE102023102086A1 (en) * 2023-01-27 2024-08-01 Bea Sa Microwave radiation unit and associated transceiver
DE102023204741A1 (en) * 2023-05-22 2024-11-28 Infineon Technologies Ag chip packages with substrate-integrated waveguides

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0858126A2 (en) * 1997-02-10 1998-08-12 Kabushiki Kaisha Toshiba Monolithic antenna
US20060043585A1 (en) * 2004-08-24 2006-03-02 Sony Corporation Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication
US20090315637A1 (en) * 2008-06-19 2009-12-24 Ahmadreza Rofougaran Method and system for communicating via flip-chip die and package waveguides
EP2190061A1 (en) * 2008-11-25 2010-05-26 Thales Radiating element network and antenna comprising such a network
US20100141350A1 (en) * 2007-04-13 2010-06-10 Kyocera Corporation High-Frequency Circuit Board, High-Frequency Circuit Module, and Radar Apparatus
EP2375444A1 (en) * 2009-01-07 2011-10-12 Sony Corporation Semiconductor device, method for producing the same, millimeter-wave dielectric transmission device, method for producing the same, and millimeter-wave dielectric transmission system
US20110309899A1 (en) * 2010-06-20 2011-12-22 Siklu Communication ltd. Accurate millimeter-wave antennas and related structures

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0858126A2 (en) * 1997-02-10 1998-08-12 Kabushiki Kaisha Toshiba Monolithic antenna
US20060043585A1 (en) * 2004-08-24 2006-03-02 Sony Corporation Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication
US20100141350A1 (en) * 2007-04-13 2010-06-10 Kyocera Corporation High-Frequency Circuit Board, High-Frequency Circuit Module, and Radar Apparatus
US20090315637A1 (en) * 2008-06-19 2009-12-24 Ahmadreza Rofougaran Method and system for communicating via flip-chip die and package waveguides
EP2190061A1 (en) * 2008-11-25 2010-05-26 Thales Radiating element network and antenna comprising such a network
EP2375444A1 (en) * 2009-01-07 2011-10-12 Sony Corporation Semiconductor device, method for producing the same, millimeter-wave dielectric transmission device, method for producing the same, and millimeter-wave dielectric transmission system
US20110309899A1 (en) * 2010-06-20 2011-12-22 Siklu Communication ltd. Accurate millimeter-wave antennas and related structures

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
SUGA,'Cost-Effective 60-GHz Antenna Package With End-Fire Radiation for Wireless File-Transfer System', IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL 58, NR 12, PG 3989-3995, ISSN 0018-9480, 2010 *
TORBEN, 'Vertically integrated voltage-controlled oscillator in LTCC at K-Band' , Microwave Symposium Digest, 2008 IEEE MTT-S International, ISBN 978-1-4244-1780-3, PP359-362 15th June 2008. *

Also Published As

Publication number Publication date
GB2499792A (en) 2013-09-04
GB201203405D0 (en) 2012-04-11

Similar Documents

Publication Publication Date Title
GB2499792B (en) Electronic device comprising an electronic die and a substrate integrated waveguide, and flip-chip ball grid array package
SG11201504013QA (en) An integrated electronic device including an interposer structure and a method for fabricating the same
GB2515940B (en) Electronic package for millimeter wave semiconductor dies
TWI560836B (en) Semiconductor device package with through silicon vias
SG10201506633SA (en) Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (ewlb-mlp)
GB2502908B (en) Antenna with a waveguide feed structure suitable for IC chip package applications
GB2514771B (en) Methods of securely changing the root key of a chip, and related electronic devices and chips
TWI562364B (en) Semiconductor device and manufacturing method thereof
SG11201600907UA (en) Resin sheet for hollow electronic device encapsulation and method for manufacturing hollow electronic device package
TWI562285B (en) Semiconductor device and method for manufacturing the same
GB201321766D0 (en) Package structures including discrete antennas assembled on a device
TWI562379B (en) Semiconductor device and method for manufacturing semiconductor device
EP2833405A4 (en) Semiconductor device, and method for manufacturing semiconductor device
SG2013088984A (en) Thermocompression bonding method and apparatus for the mounting of semiconductor chips on a substrate
EP2902115A4 (en) Pattern forming method, electronic wiring substrate, optical device, and pattern forming device
SG11201600906YA (en) Resin sheet for electronic device encapsulation and method for manufacturing electronic device package
EP4235762A3 (en) Semiconductor package and method for fabricating base for semiconductor package
SG11201504825RA (en) Semiconductor device and method for manufacturing the same
GB201121915D0 (en) Semiconductor device and manufacturing method thereof
EP2784808B8 (en) Electrical component resin, semiconductor device, and substrate
SG10201400672TA (en) Semiconductor devices having through-contacts and related fabrication methods
SG11201507246VA (en) Flip chip bonder and flip chip bonding method
GB2484862B (en) Semiconductor device structure and manufacturing method thereof
SG11201505057RA (en) A semiconductor device for high-power applications
SG11201403635SA (en) Resin composition for encapsulation and electronic device using the same