GB2488374A

GB2488374A - Apparatus and methods for forming void spaces within the envelope of a building

Info

Publication number: GB2488374A
Application number: GB1103385.9A
Authority: GB
Inventors: Mohammed Salah-Eldin Imbabi; Esam Elsarrag; Terence George O'hara
Original assignee: WIZZHER Ltd
Current assignee: WIZZHER Ltd
Priority date: 2011-02-28
Filing date: 2011-02-28
Publication date: 2012-08-29
Also published as: EP2681372A1; GB201103385D0; US20140209270A1; WO2012117241A1

Abstract

The apparatus comprises a void space forming element which are placed between two panels to define the void space. The space forming element comprises a panel attachment means and a spacer element for defining the separation between two elements. The spacer element 5 may comprise two radially extending formations 9 which are longitudinally separated along the panel attachment means 6. The space forming element may comprise an apertured plate (13, Figure 4) with panel attachment pins (11, Figure 4) arranged around the perimeter of the plate. Alternatively the spacer element may comprise a cylindrical component (17, Figure 6) with a radially extending formation (18, Figure 6). The space forming element may also have protrusions (25, Figure 8(b)) on a backing sheet (24, Figure 8(b)). Also claimed are a void space defining apparatus 30 comprising panels and a void space forming element and a dynamic insulation system.

Description

I Arparatus and Methods for Forming Void Spaces within the EnveloQe of a Building 3 The present invention relates to the formation of buildings and other habitable 4 constructions. More specifically it relates to apparatus and methods for forming void spaces within the envelope of a building or habitable construction, and in particular the 6 creation of void spaces between two or panels to facilitate the flow of ventilation air 7 through a dynamic insulation system.

9 Backuround to the invention When forming a building or habitable construction it is normally a regulatory requirement to 11 provide a minimum level of thermal insulation within the envelope of the building or 12 habitable construction. These minimum requirements are set in order to limit to some 13 extent the amount of heat transferred between the interior of the building and the 14 surrounding environment. The function of the insulation is to reduce the energy consumption for heating or refrigerating the building or habitable construction, particularly 16 those used for residential, leisure, healthcare, educational, municipal and commercial 17 purposes.

I Traditionally, insulation is employed to reduce heat flow through a building envelope, for 2 example the walls, floors and roofs. The wall construction in Figure 1 depicts a 3 conventional static insulating system I which can be seen to comprise an outer brick rain 4 screen 2, a layer of insulation material 3 located within the building envelope and a pre-cast concrete block inner leaf 4. The insulating material 3 typically comprises a compliant 6 foam such as expanded polystyrene (EPS), extruded polystyrene (XPS), polyurethane 7 (PU) and polyisocyanurate (PIR); rigid foams such as autoclaved (and other) aerated 8 concretes, aerated mineral insulation board such as Xella's Ytong MultiporTM; natural and 9 synthetic fibres such as sheep's wool, glass fibre, polymide and polystyrene based fibres and mineral wool; and bonded or processed fibre boards, timber and other celluloid based 11 materials. Normally the insulating material 3 is supplied in the form of panels or rolls of 12 defined dimensions, which are conveniently resized and! or reshaped so as to locate 13 within the building envelope.

The determining properties for the efficiency of the insulation material 3 are the 16 characteristic thermal conductivity of the material from which it is formed and the thickness 17 of the material deployed. Once the value of these parameters have been set then the 18 thermal heat loss coefficient (Us) for the envelope element is fixed. Many internationally 19 leading building standards typically require a minimum thickness of 140mm of expanded polystyrene or bonded mineral wool insulation, or alternatively around 80mm of 21 polyurethane foam insulation (or equivalent) to achieve U-value compliance.

23 Builders and developers therefore have to decide whether to spend their money on 24 expensive insulation materials that they require less of, or inexpensive insulation that they require more of. This is not always an easy choice. Opting for a cheaper insulating 26 material will require thicker insulating panels to achieve the required minimum insulation 27 levels. Thick insulating panels result in thick walls, floors and roofs, which results in more 28 expensive buildings. Exotic insulation materials, on the other hand, can either be very 29 expensive or not readily available.

31 Dynamic insulation (Dl) systems have been proposed in order to attempt to overcome the 32 drawbacks of conventional static insulation systems 1. With dynamic insulation, a 33 proportion of the exterior skin or envelope of the building is used as a ventilation source.

34 The resulting air flow rate per unit area through the intervening Dl system employed to deliver a fresh air supply can be quite low. Under such conditions, efficient heat transfer I between the building envelope and incoming/outgoing air takes place as a function of air 2 flow rate, thus significantly reducing thermal losses.

4 There are two main types of dynamic insulation known in the art. Permeodynamic insulation employs an air permeable media through which the air can flow. This enables 6 an effect similar to contra flow thermal recovery of the fabric heat lost to the incoming air.

7 Alternatively, parietodynamic insulation employs an impermeable media and an air flow 8 conduit to enable a form of cross-flow thermal recovery. The basic effect of pre-warming 9 or pre-cooling ventilation air is the same for both types of dynamical insulation, irrespective of the direction of airflow. The dynamic thermal recovery effect can also be conveniently 11 expressed as a reduction in fabric thermal transmission.

13 It is important to note that in dynamic insulation the reduction in thermal transmission with 14 air flow rate is independent of the direction of airflow. This means that dynamic insulation will operate irrespective of whether it is employed as an air supply or as an air extraction 16 device.

18 Dynamic insulation systems reduce the material input required to reach the desired 19 minimum insulation levels. The dynamic insulation systems known in the art are preformed components comprising an insulating panel through which a substantially 21 internal airflow channel is formed. These components are then incorporated into the 22 building envelope so as to allow air to circulate from the exterior of the building to the 23 interior and vice versa. This circulation of air allows for a heat exchange to take place 24 between the building fabric and the flow of air in the sense that it reduces to a significant extent the heat transfer between the building interior and its surroundings. Dynamic 26 insulation systems enable the production of thinner walls, roofs or floors since they 27 reduces the thickness of insulating material needed to achieve the same insulation levels 28 provided with a conventional static insulation system 1.

Noteworthy examples of the prior art in dynamic insulation systems include patent 31 publication numbers WO 03/057470 Al, WO 2010/122353 Al, US2009236074 Al, GB 32 2439191 A, JP2008069574 (A), 0A1229714 Al, FR2552l21 and FR19860006083. These 33 examples share the attribute that the dynamic insulation system is thereby produced by 34 deploying several dynamic insulation panels that are attached to the structural elements (walls, floor and/or roofs) of a building. Furthermore, the dynamic insulation panels are I produced in predetermined sizes and so are not amenable to being cut or shaped post 2 production, thus imposing limitations on the area of the envelope that can be dynamically 3 insulated. Indeed, resizing or reshaping of the panels would render them unusable as 4 dynamic insulation. In some cases they further constrain the direction of air flow.

Therefore, their use is limited to certain building dimensions and they are not capable of 6 being deployed under or above doors or windows. This generally renders as impossible 7 the complete insulation of a building.

9 In addition, the production and installation costs of such dynamic insulation panels are significantly higher compared to ordinary insulation. This is a potentially significant barrier 11 to the mass market adoption of dynamic insulation that is required to trigger the economies 12 of scale that are essential for such a market to thrive and prosper.

14 It is therefore an object of an aspect of the present invention to provide a dynamic insulation system that obviates or at least mitigates the problems encountered with the 16 dynamic insulation systems known in the art.

18 Summary of the invention

19 According to a first aspect of the present invention, there is provided a void space forming element suitable for connecting and defining a void space between two panels wherein the 21 void space forming element comprises a panel attachment means for connecting the void 22 space forming element to at least one panel and a spacer element that provides a means 23 for defining a spatial separation between the two panels.

The void space forming elements provides a ubiquitous means for create void spaces 26 within a building envelope. Preferably the formed void space may be employed within a 27 dynamic insulation system. Alternatively the void space forming elements can provide a 28 generic means for creating an aeration or drainage path within the envelope of a 29 construction, and or integrating other equipment, services and functions within the habitat envelope and through partitions.

32 The spacer element may comprise two radially extending formations longitudinally 33 separated along the length of the panel attachment means.

I Alternatively the spacer element may comprise a plate. The plate may comprise apertures 2 located therein. In this embodiment the panel attachment means may comprise one or 3 more attachment pins located around the perimeter of the plate. The attachment pins are 4 preferably located at regular intervals around the perimeter of the plate.

6 Preferably the spacer plate comprises one or more pin engagement means located around 7 the perimeter of the plate. The pin engagement means are preferably located at regular 8 intervals around the perimeter of the plate.

Most preferably the one or more attachment pins and the one or more pin engagement 11 means provide a means for two void space forming elements to be inter-connected so as 12 to provide a bidirectional void space forming element.

14 The spacer element may comprise a cylindrical component concentrically attached to one end of which is a radially extending formation. The radially extending formation is 16 preferably in the form of a circular or disc shape having a radius that is greater than a 17 radius of the cylindrical component.

19 In an alternative embodiment the spacer element may comprise an array of protrusions located on a backing sheet. The role of the protrusions is to simultaneously provide fixing, 21 structural support and also aid the air flow distribution within the formed void space.

23 Preferably the array of protrusions comprises a regular array.

The array of protrusions may comprise a linear array. Alternatively the array of protrusions 26 comprises two dimensional arrays of protrusions. Optionally the array of protrusions may 27 comprise two or more interspersed two dimensional arrays of protrusions.

29 The protrusions may comprise square based pyramids truncated in a plane parallel to the plane of the backing sheet.

32 The panel attachment means may comprise one or more attachment pins. The one or 33 more attachment pins may comprise one or more barbed ends.

I The panel attachment means may comprise one or more layers of adhesive located upon 2 one or more panel engaging surfaces of the spacer elements.

4 The void space forming elements may be made from one or more materials selected from the group of materials comprising plastic, coated plastics, sprayed-on plastic foams, plastic 6 composites, metals, ceramics, fibre-reinforced resins and water-proof pressed and/or 7 sprayed pulps.

9 According to a second aspect of the present invention there is provided a dynamic insulation system suitable for deployment within an envelope of building or habitable 11 construction wherein the dynamic insulation system comprises one or more layers of 12 insulation and one or more void space forming elements in accordance with the first 13 aspect of the present invention wherein attachment of the void space forming elements to 14 the one or more layers of insulation provides a means for defining at least one void space within the envelope.

17 Preferably the dynamic insulation system further comprises two or more conduits arranged 18 so as to provide fluid communication through the dynamic insulation system via the at 19 least one void space.

21 The dynamic insulation system may have a width such that it extends across the full width 22 of the envelope of the building or habitable construction. Alternatively, the dynamic 23 insulation system may have a width such that it extends across only part of the width of the 24 envelope of building or habitable construction.

26 The one or more layers of insulation may comprise a permeodynamic insulating material.

28 The one or more layers of insulation may comprise a parietodynamic insulating material.

29 Optionally the parietodynamic insulating material comprises a spray on plastic foam.

31 The dynamic insulation system may comprise two layers of an insulating material and two 32 or more void space forming elements arranged so as to form a multiple void dynamic 33 insulation system. The multiple void dynamic insulation system provides a means for 34 simultaneously supply air to and extracting air from the internal area of a building without permitting the two air supplies to mix.

2 The multiple void dynamic insulation system may comprise two layers of a parietodynamic 3 insulating material and two or more void space forming elements arranged so as to form a 4 dual void dynamic insulation system.

6 Optionally the dual void dynamic insulation system further comprises a third layer of a 7 parietodynamic insulating material located between the two or more void space forming 8 elements.

Preferably the dual void dynamic insulation system comprises four or more conduits 11 arranged to provide a first fluid communication path through the system via a first void 12 space and a second fluid communication path through the system via a second void 13 space.

The multiple void dynamic insulation system may comprise two layers of a parietodynamic 16 insulating material and four or more void space forming elements arranged so as to form a 17 quad void dynamic insulation system.

19 Optionally the quad void dynamic insulation system further comprises a central layer of a parietodynamic insulating material located between two or more of the void space forming 21 elements.

23 Preferably the quad void dynamic insulation system comprises four or more conduits 24 arranged to provide a first fluid communication path through the system via a first layer of permeodynamic insulating material and a second fluid communication path through the 26 system via a second layer of permeodynamic insulating material.

28 The dynamic insulation system may further comprise a membrane or foil. The membrane 29 or file may comprise a discrete vapour barrier or a reflective foil.

31 The dynamic insulation system may further comprise a dual function layer of insulation 32 material. The dual function layer of insulation material may comprise a dual function layer 33 of insulation material selected from a group comprising a phase change material layer that 34 provides a means for thermal storage, an electrocatalytic material layer that provides a I means for filtering airborne pollutants, a desiccant material that provides a means for 2 regulating moisture content and an aerated material.

4 Embodiments of the second aspect of the invention may include one or more features of the first aspect of the invention or its embodiments, or vice versa.

7 According to a third aspect of the present invention there is provided a kit of parts that can 8 be assembled to form a dynamic insulation system, the kit of parts comprising one or more 9 layers of insulation and one or more void space forming elements in accordance with the first aspect of the present invention.

12 Embodiments of the third aspect of the invention may include one or more features of the 13 first or second aspects of the invention or its embodiments, or vice versa.

According to a fourth aspect of the present invention there is provided a method of 16 producing a dynamic insulation system for use within an envelope of a building or 17 habitable construction the method comprising attaching one or more void space forming 18 elements in accordance with the first aspect of the present invention to one or more layers 19 of insulation.

21 The method of producing a dynamic insulation system may further comprise arranging two 22 or more conduits so as to provide a fluid communication path through the dynamic 23 insulation system.

The method of producing a dynamic insulation system may further comprise cutting the 26 dynamic insulation system to a desired size for deployment within an envelope of building 27 or habitable construction.

29 The method of producing a dynamic insulation system may further comprise attaching a membrane or foil to the one or more layers of insulation.

32 The method of producing a dynamic insulation system may further comprise attaching the 33 one or more void space forming elements to a dual function layer of insulation material.

I Embodiments of the fourth aspect of the invention may include one or more features of the 2 first, second or third aspects of the invention or its embodiments, or vice versa.

4 According to a fifth aspect of the present invention there is provided a method of dynamically insulating an envelope of a building or habitable construction the method 6 comprising the deployment of a dynamic insulation system in accordance with the second 7 aspect of the present invention within the envelope.

9 The method of dynamically insulating the envelope of a building or habitable construction may further comprise deploying the dynamic insulation system across the full width of the 11 envelope. Alternatively, the method of dynamically insulating the envelope of a building or 12 habitable construction may further comprise deploying the dynamic insulation system 13 across part of the width of the envelope.

Embodiments of the fifth aspect of the invention may include one or more features of the 16 first, second, third or fourth aspects of the invention or its embodiments, or vice versa.

18 According to a sixth aspect of the present invention there is provided a void space defining 19 apparatus suitable for deployment within an envelope of a building or habitable construction wherein the void space defining apparatus comprises one or more panels and 21 one or more void space forming elements in accordance with the first aspect of the present 22 invention wherein attachment of the void space forming elements to the one or more 23 panels provides a means for defining at least one void space within the envelope.

Embodiments of the sixth aspect of the invention may include one or more features of the 26 first, second, third, fourth or fifth aspects of the invention or its embodiments, or vice versa.

28 According to a seventh aspect of the present invention there is provided a kit of parts that 29 can be assembled to form a void space defining apparatus, the kit of parts comprising one or more panels and one or more void space forming elements in accordance with the first 31 aspect of the present invention.

33 Embodiments of the seventh aspect of the invention may include one or more features of 34 the first, second, third, fourth, fifth or sixth aspects of the invention or its embodiments, or vice versa.

2 According to an eighth aspect of the present invention there is provided a method of 3 producing a void space defining apparatus for use within an envelope of a building or 4 habitable construction the method comprising attaching one or more void space forming elements in accordance with the first aspect of the present invention to one or panels.

7 The method of producing a void space defining apparatus may further comprise cutting the 8 void space defining apparatus to a desired size for deployment within an envelope of 9 building or habitable construction.

11 The method of producing void space defining apparatus may further comprise attaching a 12 membrane or foil to the one or more panels.

14 The method of producing a void space defining apparatus may further comprise attaching the one or more void space forming elements to a dual function layer of an insulation 16 material.

18 Embodiments of the eighth aspect of the invention may include one or more features of the 19 first, second, third, fourth, fifth, sixth or seventh aspects of the invention or its embodiments, or vice versa.

22 According to a ninth aspect of the present invention there is provided a method of 23 producing a void space within an envelope of a building or habitable construction the 24 method comprising the deployment of a void space defining apparatus in accordance with the sixth aspect of the present invention within the envelope.

27 The method of providing a void space within the envelope of a building or habitable 28 construction may further comprise deploying the void space defining apparatus across the 29 full width of the envelope. Alternatively, the method of providing a void space within the envelope of a building or habitable construction may further comprise deploying the void 31 space defining apparatus across part of the width of the envelope.

33 Embodiments of the ninth aspect of the invention may include one or more features of the 34 first, second, third, fourth, fifth, sixth, seventh or eighth aspects of the invention or its embodiments, or vice versa.

I Brief description of the drawjg

2 There will now be described, by way of example only, various embodiments of the 3 invention with reference to the following figures, of which: Figure 1 presents (a) a schematic representation and (b) a side elevation of a conventional 6 static insulation system; 8 Figure 2 presents schematic representations of void space forming elements comprising 9 two attachment pins, as represented in Figure 2(a) and a single attachment pin, as shown in Figure 2(b); 12 Figure 3 presents schematic representations of alternative embodiments of the void space 13 forming element comprising two barbed-ended attachment pins, as represented in Figure 14 3(a) and a single barbed-ended attachment pin, as shown in Figure 3(b); 16 Figure 4 presents a schematic representation of an alternative uni-directional, load bearing 17 embodiment of the void space forming element; 19 Figure 5 presents a schematic representation of hybrid bi-directional, load bearing void space forming element produced by connecting two of the void space forming elements 21 shown in Figure 4; 23 Figure 6 presents schematic representations of three further alternative embodiments of 24 the void space forming element; 26 Figure 7 presents a schematic representation of a plurality of void space forming elements 27 of Figure 6 connected together to form of a mesh structure; 29 Figure 8 presents three linear array-type void space forming elements that are in the form of bars and / or strips; 32 Figure 9 presents three array-type void space forming elements; 34 Figure 10 presents schematic perspective and side views of the formation of a void space through the employment of: I (a) an array of hybrid void space forming elements; 2 (b) a mesh structure of void space forming elements; 3 (c) three linear array-type void space forming elements; and 4 (d) a two dimensional array-type void space forming element.

6 Figure 11 presents (a) an exploded view of an array-type void space forming element 7 deployed within a building envelope so as to provide a dynamic insulation system and (b) 8 a schematic representation of the airflow within the void space of the dynamic insulation 9 system; 11 Figure 12 presents a schematic side view of: 12 (a) a permeodynamically insulated full-fill wall; and 13 (b) a permeodynamically insulated part-fill wall; Figure 13 presents a schematic side view of: 16 (a) a parietodynamically insulated full-fill wall; and 17 (b) a parietodynamically insulated part-fill wall; 19 Figure 14 presents: (a) Table 1 which outlines the product specification employed to quantify the 21 thermal performance of the parietodynamically insulated full-fill wall of Figure 22 13(a); 23 (b) a plot of the Dynamic U-value (Ud) versus air flow rate for an XPS full-fill 24 insulation material; (c) a plot of the Dynamic U-value (Ud) versus air flow rate for a PIR full-fill 26 insulation material; 28 Figure 15 presents a schematic side view of: 29 (a) a dynamically insulated dry wall cladding; and (b) a dynamically insulated external cladding; 32 Figure 16 presents: 33 (a) Table 2 which outlines the product specification employed to quantify the 34 thermal performance of the dynamically insulated dry wall cladding of Figure 15(a); I (b) a plot of the Dynamic U-value (Ud) versus air flow rate for XPS insulated 2 plasterboard wall construction; 3 (c) a plot of the Dynamic U-value (Ud) versus air flow rate for a PIR insulated 4 plasterboard wall construction; 6 Figure 17 presents a schematic side view of: 7 (a) an alternative embodiment of a dynamically insulated dry wall cladding; and 8 (b) an alternative embodiment of a dynamically insulated external cladding; Figure 18 presents a schematic side view of: 11 (a) a dynamically insulated dual void wall; and 12 (b) a dynamically insulated quad void wall; 14 Figure 19 presents a schematic side view of: (a) an alternative embodiment of a dynamically insulated dual void wall; and 16 (b) an alternative embodiment of a dynamically insulated quad void wall; 18 Figure 20 presents a schematic side view of: 19 (a) a dynamically insulated hybrid wall; and (b) an alternative dynamically insulated hybrid wall configuration; 22 Figure 21 presents a schematic side view of: 23 (a) a dynamically insulated hybrid wall incorporating a thin membrane; and 24 (b) a parietodynamically insulated full-fill wall that incorporates a thin membrane; and 27 Figure 22 presents a schematic side view of: 28 (a) a dynamically insulated hybrid wall incorporating an additional material layer; 29 and (b) an alternative dynamically insulated hybrid wall configuration that incorporates 31 an additional material layer.

I Detailed descrirtion of Qreferred embodiments 2 With reference to Figures 2 to 9, there will now be described a number of void space 3 forming elements in accordance with an aspect of the present invention. The void space 4 forming elements can be employed to connect and or space two or more panels so as to form one or more predetermined void spaces which can then be deployed within the 6 envelope of a building or habitable construction. Several examples of how these void 7 spaces may be deployed so as to provide a dynamic insulation system for a building or a 8 habitable construction are then described.

Figure 2 presents a first and second embodiment of a void space forming elements, 11 depicted generally by reference numerals 5 and Sb. The void space forming elements 5 12 and Sb are single point connectors and can be seen to comprise a panel attachment 13 means 6 upon which is mounted a spacer element 7. The panel attachment means 6 may 14 comprise two attachment pins 8, as shown in Figure 2(a), or a single attachment pin 8, as shown in Figure 2(b). In both embodiments presented in Figure 2 the spacer element 7 16 comprises two radially extending formations 9 longitudinally separated along the length of 17 the panel attachment means 6. The two radially extending formations 9 may have a 18 circular or disc shape. The radially extending formations 9 may also comprise a layer of 19 adhesive on their panel engaging surfaces so as provide a further means for assisting in the attachment of the two panels.

22 Figure 3 presents alternative embodiments of the single point void space forming 23 elements, depicted generally by reference numerals 10 and lOb. These embodiments are 24 similar to those described above with reference to Figure 2 however in these embodiments the panel attachment means 6 comprise two barbed-ended attachment pins 11, as shown 26 in Figure 3(a), or a single barbed-ended attachment pin 11, as shown in Figure 3(b).

27 Employing barbed-ended pins 11 provides a more secure, pull-resistant attachment 28 between the void space forming elements 10 and lOb and a panel when compared with 29 the void space forming elements 5 and Sb presented in Figure 2.

31 Figures 4 and 5 present further alternative embodiments of the void space forming 32 elements, depicted generally by reference numerals 12 and 12b. From Figure 4 it can be 33 seen that the void space forming elements 12 comprises a plate 13 as the spacer element 34 7 and that the attachment means 6 comprises four barbed-ended attachment pins 11 located at equally spaced intervals around the perimeter of the plate 13. Apertures 14 I may be formed within the spacer plate 13 so as to assist with the flow of air within the 2 formed void space when the void space forming elements 12 are deployed within a 3 dynamic insulation system, as described in further detail below. The spacer plate 13 may 4 also comprise a layer of adhesive on its panel engaging surfaces so as provide a further means for assisting in the attachment of the two panels.

7 It is preferable for the void space forming elements 12 to further comprise pin engagement 8 means 15 located around the perimeter of the plate 13. In the presently described 9 embodiment, four pin engagement means 15 are provided at equally spaced intervals around the perimeter of the plate 13 such that they are interspersed between the four 11 barbed-ended attachment pins 11. The function of the pin engagement means 15 is to 12 allow two void space forming elements 12 to be connected together so as to form a single 13 hybrid, bi-directional fixing device 12b as presented in Figure 5. To produce the panel 14 connector 12b one of the panel connectors 12 is simply inverted and positioned such the spacer plates 13 locate together. By introducing a relative rotation between the panel 16 connectors 12 the barbed-ended attachment pins 11 of one of the panel connectors 12 17 locate with the pin engagement means 15 of the other so as to secure the hybrid device 18 12b. Increasing the plate diameter in this void space fixing device type will increase its 19 load bearing I support capacity, such as may be required in the production of large, dynamically insulated pre-cast concrete building envelope elements.

22 It will be appreciated by the skilled reader that in further alternative embodiments the 23 number of attachment pins 11, pin engagement means 15 and their spacing around the 24 perimeter of the plate 13 may be varied.

26 Figure 6 presents yet further alternative embodiments of the single point void space 27 forming elements, depicted generally by reference numerals 16, 16b and 16c. In each of 28 these embodiments the spacer element 7 comprises a cylindrical component 17 29 concentrically attached to one end of which is radially extending formation 18. The radially extending formation 18 is in the form of a circular or disc shape having a radius that is 31 greater than the radius of the cylindrical component 17.

33 In the presently described embodiments, four attachment tabs 19 are provided at equally 34 spaced intervals around the perimeter of the radially extending formation 18. The attachment tabs 19 allow the void space forming elements 16, 16b and 16c to be I connected together in the form of an array or mesh structure 20, as presented in Figure 7.

2 The mesh structure 20 may itself provide the means for connecting two panels together. It 3 is preferable however for the void space forming elements to further comprise either a 4 layer of adhesive 21 (see element 16) and or attachment pins (see element 16c) on one or more of its panel engaging surfaces.

7 Figures 8 and 9 present a number of alternative array-type void space forming elements.

8 In particular, Figure 8 presents three different linear array-type void space forming 9 elements 22, 22b and 22c. In Figure 8(a) the linear array-type void space forming element 22 is formed by the introduction of a plurality of equally spaced notches 23 along the 11 length of a strip of material 24 e.g. a plastic strip. The linear array-type void space forming 12 element 22b of Figure 8(b) is formed by attaching a series of blocks 25 at equally spaced 13 intervals along the length of the strip 24. The linear array-type void space forming element 14 22c of Figure 8(c) is similar to that of Figure 8(b) however in this embodiment each element of the array in fact comprises a 3x3 array of protrusions 26. The protrusions 26 16 can be thought of as square based pyramids that have been truncated in a plane parallel 17 to the plane of the square base. Void space forming element 22c may be formed by 18 injection moulding of an appropriate plastic material.

Figure 9 presents three different alternative array-type void space forming elements 27, 21 27b and 27c. Each of the void space forming elements 27, 27b and 27c comprise a 22 backing sheet 28 upon which an array of protrusions 26 have been formed, the pattern 23 formed by the protrusions 26 being the differing factor between each of these elements.

In Figure 9(a) the void space forming elements 27 comprises a regular 2x2 array of 26 protrusions arranged at a 45° angle to the edges of the backing sheet 28. In Figure 9(b) 27 the protrusions comprise two superimposed regular 2x2 arrays of protrusions 26. Each 28 element of the first array of protrusions comprises a single protrusion 26 while each 29 element of the second array comprises a 3x3 array of protrusions 26. The embodiment presented in Figure 9(c) comprises a regular 2x2 array of protrusions wherein each 31 element of the array comprises a 3x3 array of protrusions 26.

33 It will be appreciated that the array pattern of the protrusions 26 of the above described 34 embodiments may be varied. For example, the arrays of protrusions may not be regular in form or the number of protrusions contained within a particular array element may also I vary. The role of the protrusions 26 is to simultaneously provide fixing / structural support 2 and also aid the air flow distribution within the formed void space and so variations in the 3 array pattern simple leads to corresponding variation in the air flow distribution.

The above described void space forming elements may be made from any durable, inert, 6 fire resistant material or combination of materials. For example they can be made of 7 plastic by injection moulding, extrusion or thermoforming. Other materials may 8 alternatively be employed such as multi-layered plastics, coated plastics, sprayed-on 9 plastic foams, plastic composites, metals, ceramics, fibre-reinforced resins or water-proof pressed and/or sprayed pulps.

12 It should be noted that the use of any thermally conductive material e.g. metals in the 13 production of sheet-type void space forming elements 27, 27b and 27c, for example 14 aluminium, will enhance lateral heat transfer within the void space. This acts to improve the performance in zones of localised stagnation or where the air flow rate is significantly 16 lower than the mean air flow rate. Furthermore, the use of metals may also provide the 17 void spacing elements, and hence systems and apparatus incorporating these devices 18 with ii insulation properties.

Method of Forming a Void Space 21 There now follows a description of how the above described void space forming elements 22 may be deployed so as to provide a void space 29 within the envelope of a building or 23 habitable construction. In particular, Figure 10 presents schematic perspective and side 24 views of the formation of a void space 29 through the employment of (a) an array of hybrid void space forming elements I 2b; (b) a mesh structure 20 of void space forming elements 26 16; (c) three linear array-type void space forming elements 22b; and a two dimensional 27 array-type void space forming element 27. Each of the void spaces 29 are produced by 28 locating the void space forming element 12b, 20, 22b or 27 between two sheets of 29 standard insulation material 3. The appropriate attachment means 6 act to attach the void space forming element 27 to the two sheets of insulation material 3 while the 31 corresponding spacing elements 7 simultaneously act to provide and maintain the desired 32 void space 29. If required, the composite structure can then be cut to the desired size so 33 as to fit within the building envelope e.g. that formed between the outer brick rain screen 2 34 and the concrete block inner leaf 4.

I It will be appreciated by the skilled reader that the above methodology may be adapted 2 such that the void space forming elements 12b, 20, 22b or 27 are provided preformed on a 3 layer of standard insulation material 3. The production process is thereafter completed by 4 simply attaching the second layer of standard insulation material 3 to the void space forming elements 12b, 20, 22b or 27. Preforming the void space forming elements 12b, 6 20, 22b or 27 on a layer of standard insulation material 3 acts to reduce the time required 7 to form the void space, particularly when employing singly point type void space forming 8 elements 12b and 20.

The above methodology can easily be adapted so as to cost effectively produce a simple 11 to make, easy to apply range of dynamic insulation panels for use in a building or habitable 12 construction. This is explained in further detail with reference to Figure 11(a) which 13 presents an exploded view of the array-type void space forming element 27 deployed 14 within a building envelope so as to provide a dynamic insulation system 30.

16 With reference to the arrangement in Figure 11(a), the first step is to again locate the void 17 space forming element 27 between the two sheets of standard insulation material 3.

18 Apertures for receiving an entrance / inlet conduit 31 and an exit / outlet conduit 32 are 19 then formed within the two sheets of insulation material 3 and the void space forming element 27. With the entrance and exit conduits 31 and 32 in place the panel attachment 21 means 6, in this embodiment adhesive layers 21 located on the panel engagement 22 surfaces, again act to attach the void space forming element 27 to the two sheets of 23 insulation material 3. The spacing elements 7 simultaneously act to provide and maintain 24 the desired void space 29 between the sheets of insulation material 3. If required, the composite structure can then be cut to the desired size so as to fit within the building 26 envelope formed between the outer brick rain screen 2 and the concrete block inner leaf 4.

28 The void space forming element 27 serves a secondary but equally important function.

29 The parameters that govern air flow are the separation distance, shape, size and spacing of the device, the location of the entrance 31 and exit conduits 32 to the void space 29, the 31 number and type of systems 30 employed and the systems 30 orientation and location 32 (vertical for walls, horizontal for ceilings and floors, pitched for roofs, etc.)! The void space 33 forming element 27 permits the free flow of air vertically and laterally within the wall, as 34 presented schematically in Figure 11(b). In practice, this results in an almost complete envelope area coverage for the air flow. Since a uniform air flow is important in achieving I the best performance from a dynamic insulation system 30 the presence of the void space 2 forming element 27 acts to maximise the overall reduction in building fabric thermal 3 transmission.

It will be appreciated that the void space forming elements need to have sufficient strength 6 and stiffness to function as a support and to deliver the required separation between the 7 layers of insulation material so as to enable them to function as part of a dynamic 8 insulation panel, without adversely impacting or impeding the air flow rate or the routing of 9 services where applicable. In order to achieve these objectives the void space forming elements may be produced in specific shapes and sizes.

12 With regard to their wider use in building construction, the void space forming elements 13 enable users to vary the spacing of cladding material layers in the range of 5 to 100 mm, 14 and more commonly in the range of 10 to 30 mm for the majority of applications.

16 The footprint of the void space forming elements can similarly vary, depending on the 17 available area, the rigidity of the material layers to either side thereof and the load bearing 18 capacity that the void space forming elements are required to support within the 19 acceptable deformation limits of both the device or the insulation (or other) material layers to which they are attached.

22 Dynamic Insulation Systems 23 Employing the above described void space forming elements and methods of construction 24 provides for a significantly greater degree of flexibility in the configurations of the dynamic insulation systems that can be achieved. A number of example configurations of dynamic 26 insulation systems will now be described with reference to Figures 12 to 22.

28 Figure 12(a) presents a schematic side view of a permeodynamically insulated full-fill wall 29 33 while Figure 12(b) presents a similar arrangement but in a part-fill configuration 34. in both embodiments there is located a permeodynamically insulated material 35 which is 31 fixed in place within the building envelope by a plurality of void space forming elements 32 12b. The spacer elements 7 of the void space forming elements 12b act to define a void 33 space 29 and 29b on either side of the permeodynamically insulated material 35 which are 34 in fluid communication with an entrance conduit 31 and an exit conduit 32, respectively.

I In a similar manner the described apparatus and methods can be readily employed so as 2 to provide a parietodynamically insulated wall system. In particular Figure 13(a) presents 3 a schematic side view of a parietodynamically insulated full-fill wall 36 while Figure 13(b) 4 presents a similar arrangement but in a part-fill configuration 37. In both embodiments there are located a plurality of void space forming elements 12b between two panels of 6 standard insulation material 3. The spacer elements 7 of the void space forming elements 7 12b act to define a central void space 29 which is in fluid communication with both an 8 entrance conduit 31 and an exit conduit 32.

The parameters governing steady-state heat transfer through a dynamically insulated wall 11 are the thermal conductivity of the constituent materials, the physical properties of the air, 12 the air flow rate, the internal and external temperatures and the wall geometry e.g. layer 13 thicknesses, void space depth, wall height, etc. This allows theoretical modelling to be 14 carried out so as to quantify the thermal performance of the dynamically insulated wall.

16 Figure 14(a) presents Table I which outlines the product specification employed to 17 theoretically quantify the thermal performance of the parietodynamically insulated full-fill 18 wall 36 of Figure 13(a). Figure 14(b) plots the Dynamic U-value (Ud) versus air flow rate 19 for an XPS full-fill insulation material while Figure 14(c) plots the Dynamic U-value (Ud) versus air flow rate for a PIR full-fill insulation material. PIR offers lower thermal 21 conductivity and, compared to XPS, is the better insulator. In both cases the trend is 22 reduction in the dynamic U-value as a function of air flow rate and insulation thickness. At 23 air flow rates in the range 0 -1.5 l/m2-s the type of insulation and its thickness can have a 24 significant impact. However, at flow rates > 2.0 l/m2-s the effect of air flow rate becomes the dominant factor, with the type of material and thickness being only marginally 26 significant.

28 Figure 15 presents a system whereby the described apparatus and methodologies can be 29 employed to dynamically insulate a cladding wall 38. ln particular, Figure 15(a) presents a schematic side view of a dynamically insulated dry wall cladding 39 wherein void space 31 forming elements I 2b are deployed so as to define an air flow void space 29 between the 32 internal side of cladding wall 38 and a panel of standard insulation material 3. An entrance 33 conduit 31 and an exit conduit 32 again provide for fluid communication from the outside to 34 the inside of the building via the air flow void space 29.

I Figure 15(b) presents a dynamically insulated external cladding 40 that is of a similar 2 configuration to the arrangement of Figure 15(a). However in this embodiment the air flow 3 void space 29 is located between the external side of cladding wall 38 and the panel of 4 standard insulation material 3. An external render 41 may be applied to the external surface of the panel 3.

7 Figure 16(a) presents Table 2 which outlines the product specification employed to 8 theoretically quantify the thermal performance of the dynamically insulated dry wall 9 cladding 39 of Figure 15(a). Figure 16(b) plots the Dynamic U-value (Ud) versus air flow rate for XPS plasterboard insulation material while Figure 16(c) plots the Dynamic U-value 11 (U) versus air flow rate for a FIR plasterboard insulation material. The highlighted trend is 12 the same as previously discussed with reference to Figure 14. FIR offers lower thermal 13 conductivity and, compared to XPS, is the better insulator. In both cases the trend is 14 reduction in the dynamic U-value as a function of air flow rate and insulation thickness. At air flow rates in the range 0 -1.5 l/m2-s the type of insulation and its thickness can have 16 significant impact. However, at flow rates > 2.0 l/m2-s the effect of air flow rate becomes 17 the dominant factor, with the type of material and thickness being only marginally 18 significant.

As a result of the increased flexibility provided by the employment of the void space 21 forming elements novel dynamic insulation system configurations can be produced.

22 Furthermore, these systems may also employ novel combinations of materials. By way of 23 example, Figure 17(a) and Figure 17(b) present alternative embodiments of the 24 dynamically insulated dry wall cladding and the dynamically insulated external cladding described above with reference to Figure 15(a) and Figure 15(b), respectively and 26 generally depicted by reference numerals 39b and 40b. The difference between the 27 presently described embodiments and those presented in Figure 15 is that the use of the 28 void space forming elements allows for the panels of insulation material 3 to be replaced 29 by layers of spray-on foam or pulp insulation 42. The air flow void space 29 is formed using either void space forming elements 27, 27b and 27c or with void space forming 31 elements 10, lOb, 12, 12b, 16, 16b, 16c, 22, 22b and 22c employed in conjunction with a 32 rigid backing substrate 43 (that could also exhibit insulating properties), over which the 33 foam insulation may be sprayed on and subsequently dressed.

I The increased flexibility provided by the employment of the void space forming elements 2 allows for dynamic insulation system configurations that can simultaneously supply air to 3 and extract air from the internal area of a building without permitting the two air supplies to 4 mix. For example, Figures 18(a) and Figures 18(b) present schematic side views of a dynamically insulated dual void space wall 44 and a dynamically insulated quad void 6 space wall 45.

8 The dynamically insulated dual void space wall 44 is produced by having three panels of 9 insulation material 3 attached to each other by two layers of void space forming elements so as to form two air flow void spaces 29 and 29b. Each of the air flow void spaces 29 and 11 29b has an associated entrance conduit 31 and 31 b and an exit conduit 32 and 32b again 12 employed to provide means for fluid communication between the outside to the inside of 13 the building.

The dynamically insulated quad void space wall 45 can be seen to comprise a central 16 panel of insulation material 3 on either side of which is located a layer of 17 permeodynamically insulated material 35 and 35b. Four layers of void space forming 18 elements 6, Sb, Sc and Sd are employed to attach the layers of insulation material 3, 35 19 and 35b so as to define four air flow void spaces 29, 29b, 29c and 29d. An entrance conduit 31 and an exit conduit 32 provide a means for fluid communication from the 21 outside to the inside of the building via the layer of permeodynamically insulated material 22 35b. Similarly, an entrance conduit 31b and an exit conduit 32b provide a means for fluid 23 communication from the inside to the outside of the building via the layer of 24 permeodynamically insulated material 35.

26 The dynamically insulated dual void space wall 44 and dynamically insulated quad void 27 space wall 45 provide means for reducing both the fabric and ventilation conductance 28 losses i.e. the incoming air is pre-heated or pre-cooled by both the fabric and exhaust air.

Figure 19(a) and Figure 19(b) present alternative embodiments of the dynamically 31 insulated dual void space wall and the dynamically insulated quad void space wall 32 described above with reference to Figure 18(a) and Figure 18(b), respectively and 33 generally depicted by reference numerals 44b and 45b. The difference between the 34 presently described embodiments and those presented in Figure 18 is that the central panel of insulation material 3 can be omitted if the void spaces 29 and 29b of the I dynamically insulated dual void space wall 44b, or the air void spaces 29b and 29c of the 2 dynamically insulated quad void space wall 45b, are formed using void space forming 3 elements 27, 27b and 27c. Alternatively, if with void space forming elements 10, lOb, 12, 4 12b, 16, 16b, 16c, 22, 22b and 22c are employed to produce the aforementioned void spaces then the central panel of insulation material 3 is replaced by a thin, air 6 impermeable, conducting membrane 46.

8 Figure 20 presents a schematic side view of two alternative dynamically insulated hybrid 9 walls 47 and 48. Each embodiment comprises a layer of permeodynamically insulated material 35 and panel of insulation material 3. Two layers of void space forming elements 11 are employed so as to define air flow void spaces 29 and 29b on either side of the layer of 12 permeodynamically insulated material 35. An entrance conduit 31 and an exit conduit 32 13 are employed to provide means for fluid communication between the outside to the inside 14 of the building via the layer of permeodynamically insulated material 35. The described hybrid dynamically insulated hybrid walls 47 and 48 deliver the superior thermal 16 performance of permeodynamic insulation while exploiting the utility of parietodynamic 17 insulation.

19 The flexibility provided by the above described void space forming elements and their method of deployment can be further exploited so as to allow for additional layers of 21 material to be incorporated within the dynamic insulations systems. For example Figure 22 2 1(a) presents the hybrid dynamically insulated hybrid walls 47 of Figure 20(a) which now 23 incorporates a membrane or foil 49 on the internal surface of the panel of insulation 24 material 3. Similarly, Figure 21(b) presents the parietodynamically insulated full-fill wall 33 of Figure 13(a) which now incorporates the membrane or foil 49 on an internal surface of 26 one of the panels of insulation material 3. The membrane or foil 49 may comprise a 27 discrete vapour barrier or a reflective foil to block radiant heat transfer within certain types 28 of insulation, such as EPS or XPS, that are transparent to long wave radiation.

This facility may be further exploited as shown by the embodiments presented in Figure 22 31 which are similar to those discussed previously with reference to Figure 21. However, in 32 these embodiments instead of adding a membrane or foil 49 to an internal surface of one 33 of the panels of insulation material 3 these panels have simply been replaced by a layer of 34 material 50 that may be used to deliver not only insulation performance but also an additional functionality e.g. a phase change material layer for thermal storage, an I electrocatalytic material layer to filter airborne pollutants, a desiccant layer to regulate 2 moisture content; or sheets of autoclave aerated concrete or aerated mineral insulation 3 board such as Xella's MultiporTM building product.

Although these above described configurations have been presented in relation to a wall 6 envelope it will be appreciated by the skilled reader that similar configurations for roofs and 7 floors, using other materials, are also possible. It should also be noted that different 8 permutations and combinations of these configurations are also possible.

Furthermore, it will be appreciated by the skilled reader that the above production methods 11 may be adapted so as to enable the formation of curved void spaces and hence curved 12 dynamic insulation panels. This may be achieved by employing a former, over which the 13 sheets of insulation material 3, or other material layers 50, could be flexed before being 14 coupled together using void space forming elements to preserve and maintain the desired geometry.

17 It will also be appreciated that the void space forming elements can be made from any 18 durable, inert, fire resistant material or combination of materials including but not limited to 19 injection moulded, extruded and thermoformed plastics, multi-layered or coated plastics and plastic composites, sprayed-on' plastic foams, metals, ceramics, fibre-reinforced 21 resins and waterproof pressed and sprayed pulps.

23 The method of attaching and anchoring the void space forming elements to the adjacent 24 material layers within the construction can, where required, be via mechanical penetration, a combination of penetration and interlock and I or the use of adhesive coatings or layers, 26 reactive bonding etc. The attachment methods will clearly be different for rigid, foam- 27 based or fibre-based insulation materials, but the objective of fixing, separating and 28 supporting the materials to create a void space is the same.

The various above described embodiments of the void space forming elements can be 31 applied either manually or automatically, as part of a production line process. They can be 32 supplied in discrete form or as pre-fabricated inter-linked or meshed arrays, strips or 33 sheets in both rigid, or flexible, flat pack form, or in rolls to facilitate rapid, cost-effective 34 application. They can be fitted either off-site (in the factory) or on-site, during construction, or retrofitted into existing habitats. Variants of the device can be used in combination, for I instance to facilitate certain types of edge fixing or to help correct, regulate and control 2 specific air flow distribution scenarios within the void plane. The void space forming 3 elements can also be made or pre-fabricated as an integral part of one or more of the 4 sheet materials or combination of materials that are employed in for the production of dynamic insulation systems described above.

7 The above described dynamic insulation systems highlight a number of the advantages 8 provided by employing the void space forming elements. In the first instance the void 9 space forming elements allow for the fixing and support of different layers of insulation material within the exterior envelope elements or cladding and internal partitions of 11 habitable constructions (i.e., dwellings, other building types and other stationary and 12 mobile platforms) 14 Secondly the resultant dynamic insulation systems can made directly, without modification, from any commonly available, inexpensive, mass produced flat insulation sheet material 16 (and by extension henceforth, any other sheet material), or combination of materials. This 17 acts to reduce the costs of the system without sacrificing performance or versatility.

19 A further advantage is that the described systems facilitate the flow of ventilation (or exhaust) air across the entire plane of the insulation sheets.

22 Finally, the insulation sheets can be cut to any size and shape, and joined together without 23 loss of functionality to maximise dynamic insulation coverage of the building envelope for 24 superior fabric efficiency and energy-saving performance, and with it provide an overall energy-saving performance for the building.

27 In addition to the above described dynamic insulation systems it will be appreciated by the 28 skilled reader that the void space forming elements can provide a generic means for 29 creating an aeration or drainage path within the envelope of the construction, and or integrating other equipment, services and functions within the habitat envelope and 31 through partitions. For example, they can be employed to prevent deposition or 32 accumulation of moisture, or provide a drainage conduit, within the envelope.

33 Alternatively, they can be used to facilitate hidden cabling, pipes, etc, within the 34 construction. The void space forming elements thus provides a ubiquitous means for create voids within the building envelope.

2 The invention provides void space forming elements that can be used to make void spaces 3 within the envelope of a building by means of a simple production method. In particular, 4 high performance, low cost dynamic insulation panels can be made from any type of mass-produced flat sheet insulation material. The dynamic insulation systems produced 6 eliminate the constraint of directional flow associated with the known prior art systems 7 since air is allowed to flow freely in any direction within the void space plane created by 8 the void space forming elements. As a result more of the external envelope of a building 9 can be dynamically insulated. Previously, inaccessible spaces such as above and below windows, above doors, etc., can also be dynamically insulated where previously they could 11 only be insulated statically. A number of new dynamic insulation configurations are also 12 presented that are achievable as a direct result of the use of the void space forming 13 elements.

The foregoing description of the invention has been presented for the purposes of 16 illustration and description and is not intended to be exhaustive or to limit the invention to 17 the precise form disclosed. The described embodiments were chosen and described in 18 order to best explain the principles of the invention and its practical application to thereby 19 enable others skilled in the art to best utilise the invention in various embodiments and with various modifications as are suited to the particular use contemplated. Therefore, 21 further modifications or improvements may be incorporated without departing from the 22 scope of the invention as defined by the appended claims.