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GB2486361B - Light guide array for an image sensor - Google Patents

Light guide array for an image sensor

Info

Publication number
GB2486361B
GB2486361B GB1203302.3A GB201203302A GB2486361B GB 2486361 B GB2486361 B GB 2486361B GB 201203302 A GB201203302 A GB 201203302A GB 2486361 B GB2486361 B GB 2486361B
Authority
GB
United Kingdom
Prior art keywords
light guide
image sensor
guide array
array
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB1203302.3A
Other versions
GB2486361A (en
GB201203302D0 (en
Inventor
Thanh-Trung Do
Hiok-Nam Tay
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Candela Microsystems S Pte Ltd
Original Assignee
Candela Microsystems S Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Candela Microsystems S Pte Ltd filed Critical Candela Microsystems S Pte Ltd
Priority claimed from PCT/IB2009/006148 external-priority patent/WO2011001196A1/en
Priority claimed from US12/806,192 external-priority patent/US20110031381A1/en
Publication of GB201203302D0 publication Critical patent/GB201203302D0/en
Publication of GB2486361A publication Critical patent/GB2486361A/en
Application granted granted Critical
Publication of GB2486361B publication Critical patent/GB2486361B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H01L27/14621—
    • H01L27/14625—
    • H01L31/0203—
    • H01L31/0216—
    • H01L31/0232—
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/026—Wafer-level processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8067—Reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/30—Coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)
GB1203302.3A 2009-07-02 2009-07-02 Light guide array for an image sensor Expired - Fee Related GB2486361B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/IB2009/006148 WO2011001196A1 (en) 2009-07-02 2009-07-02 Light guide array for an image sensor
US12/806,192 US20110031381A1 (en) 2007-12-28 2009-07-02 Light guide array for an image sensor

Publications (3)

Publication Number Publication Date
GB201203302D0 GB201203302D0 (en) 2012-04-11
GB2486361A GB2486361A (en) 2012-06-13
GB2486361B true GB2486361B (en) 2012-10-10

Family

ID=45218963

Family Applications (2)

Application Number Title Priority Date Filing Date
GB1203302.3A Expired - Fee Related GB2486361B (en) 2009-07-02 2009-07-02 Light guide array for an image sensor
GB1011222.5A Expired - Fee Related GB2481651B (en) 2009-07-02 2009-07-02 Light guide array for an image sensor

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB1011222.5A Expired - Fee Related GB2481651B (en) 2009-07-02 2009-07-02 Light guide array for an image sensor

Country Status (1)

Country Link
GB (2) GB2486361B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6444066B2 (en) 2014-06-02 2018-12-26 キヤノン株式会社 Photoelectric conversion device and imaging system
JP6173259B2 (en) * 2014-06-02 2017-08-02 キヤノン株式会社 Photoelectric conversion device and imaging system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040070039A1 (en) * 2002-10-09 2004-04-15 Canon Kabushiki Kaisha Solid state image pickup element and method of manufacturing a solid state pickup element
US20060158547A1 (en) * 2005-01-18 2006-07-20 Matsushita Electric Industrial Co., Ltd. Solid state imaging device and fabrication method thereof, and camera incorporating the solid state imaging device
US20070103572A1 (en) * 2005-11-10 2007-05-10 Matsushita Electric Industrial Co., Ltd. Solid-state imaging device and method of manufacturing the same
JP2007288057A (en) * 2006-04-19 2007-11-01 Toppan Printing Co Ltd Color image sensor and color image sensor manufacturing method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6937193B2 (en) * 2002-06-04 2005-08-30 Skycross, Inc. Wideband printed monopole antenna
KR101550866B1 (en) * 2009-02-09 2015-09-08 삼성전자주식회사 Method for manufacturing a image sensor by filling a upper part of dielectric trench and forming air gap to improve optical cross-talk

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040070039A1 (en) * 2002-10-09 2004-04-15 Canon Kabushiki Kaisha Solid state image pickup element and method of manufacturing a solid state pickup element
US20060158547A1 (en) * 2005-01-18 2006-07-20 Matsushita Electric Industrial Co., Ltd. Solid state imaging device and fabrication method thereof, and camera incorporating the solid state imaging device
US20070103572A1 (en) * 2005-11-10 2007-05-10 Matsushita Electric Industrial Co., Ltd. Solid-state imaging device and method of manufacturing the same
JP2007288057A (en) * 2006-04-19 2007-11-01 Toppan Printing Co Ltd Color image sensor and color image sensor manufacturing method

Also Published As

Publication number Publication date
GB2481651B (en) 2012-10-10
GB201011222D0 (en) 2010-08-18
GB2486361A (en) 2012-06-13
GB201203302D0 (en) 2012-04-11
HK1171567A1 (en) 2013-03-28
GB2481651A (en) 2012-01-04

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