GB2467805C - Cooled electronic system - Google Patents
Cooled electronic system Download PDFInfo
- Publication number
- GB2467805C GB2467805C GB0908156A GB0908156A GB2467805C GB 2467805 C GB2467805 C GB 2467805C GB 0908156 A GB0908156 A GB 0908156A GB 0908156 A GB0908156 A GB 0908156A GB 2467805 C GB2467805 C GB 2467805C
- Authority
- GB
- United Kingdom
- Prior art keywords
- electronic system
- cooled electronic
- cooled
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
-
- H10W40/47—
-
- H10W40/70—
-
- H10W40/77—
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0908156A GB2467805C (en) | 2009-05-12 | 2009-05-12 | Cooled electronic system |
| JP2012510362A JP5863643B2 (en) | 2009-05-12 | 2010-05-12 | Electronic system cooled |
| CN201080031498.8A CN102626006B (en) | 2009-05-12 | 2010-05-12 | cooled electronic system |
| EP20205595.0A EP3846601B1 (en) | 2009-05-12 | 2010-05-12 | Cooled electronic system |
| EP10722744.9A EP2430893B1 (en) | 2009-05-12 | 2010-05-12 | Cooled electronic system |
| CN201811383010.2A CN110072368B (en) | 2009-05-12 | 2010-05-12 | Cooled electronic system |
| PCT/GB2010/000950 WO2010130993A2 (en) | 2009-05-12 | 2010-05-12 | Cooled electronic system |
| CN201610009043.5A CN105491858B (en) | 2009-05-12 | 2010-05-12 | Cooled electronic system |
| JP2015189870A JP6485808B2 (en) | 2009-05-12 | 2015-09-28 | Electronic system cooled |
| JP2017146149A JP6604999B2 (en) | 2009-05-12 | 2017-07-28 | Electronic system cooled |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0908156A GB2467805C (en) | 2009-05-12 | 2009-05-12 | Cooled electronic system |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| GB0908156D0 GB0908156D0 (en) | 2009-06-24 |
| GB2467805A GB2467805A (en) | 2010-08-18 |
| GB2467805B GB2467805B (en) | 2011-04-06 |
| GB2467805C true GB2467805C (en) | 2011-06-01 |
Family
ID=40833881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0908156A Active GB2467805C (en) | 2009-05-12 | 2009-05-12 | Cooled electronic system |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2467805C (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9719865B2 (en) | 2012-11-28 | 2017-08-01 | International Business Machines Corporation | Thermally determining flow and/or heat load distribution in parallel paths |
| GB201613234D0 (en) * | 2016-08-01 | 2016-09-14 | Iceotape Ltd | Thermal interface for modular immersion cooling of electronic components |
| GB2557616A (en) * | 2016-12-12 | 2018-06-27 | Iceotope Ltd | Closed loop coolant control |
| IL308679B2 (en) * | 2017-09-06 | 2025-10-01 | Iceotope Group Ltd | Heat sink, heat sink arrangement and module for liquid immersion cooling |
| US10548239B1 (en) * | 2018-10-23 | 2020-01-28 | Google Llc | Cooling electronic devices in a data center |
| US11582886B2 (en) * | 2020-02-05 | 2023-02-14 | Baidu Usa Llc | Modular server cooling system |
| DE102020105925B4 (en) | 2020-03-05 | 2024-09-12 | Bayerische Motoren Werke Aktiengesellschaft | Cooling arrangement for a motor vehicle |
| CN111625073A (en) * | 2020-06-22 | 2020-09-04 | 深圳比特微电子科技有限公司 | Liquid cooling heat abstractor and liquid cooling virtual currency digs ore deposit machine |
| WO2024186240A1 (en) * | 2023-03-07 | 2024-09-12 | Telefonaktiebolaget Lm Ericsson (Publ) | A cooling arrangement for an electronic device |
| CN119233614B (en) * | 2024-12-03 | 2025-02-07 | 江苏海鋆自动化技术有限公司 | Semiconductor radiator with water cooling function |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4203129A (en) * | 1978-07-11 | 1980-05-13 | International Business Machines Corporation | Bubble generating tunnels for cooling semiconductor devices |
| US4449580A (en) * | 1981-06-30 | 1984-05-22 | International Business Machines Corporation | Vertical wall elevated pressure heat dissipation system |
| NO894328L (en) * | 1989-10-30 | 1991-05-02 | Dolphin Server Technology As | PROCEDURE AND DEVICE FOR COOLING ELECTRONIC COMPONENTS. |
| US5455458A (en) * | 1993-08-09 | 1995-10-03 | Hughes Aircraft Company | Phase change cooling of semiconductor power modules |
| US5736915A (en) * | 1995-12-21 | 1998-04-07 | Cooper Industries, Inc. | Hermetically sealed, non-venting electrical apparatus with dielectric fluid having defined chemical composition |
| JPH11297906A (en) * | 1998-03-23 | 1999-10-29 | Motorola Inc | Electronic assembly and manufacturing method |
| US6670719B2 (en) * | 1999-08-25 | 2003-12-30 | Micron Technology, Inc. | Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture |
| KR100602023B1 (en) * | 2000-01-22 | 2006-07-20 | 유티스타콤코리아 유한회사 | Long Code State Information Transmission Method in Asynchronous Mobile Communication System |
| AT411126B (en) * | 2001-04-06 | 2003-09-25 | Siemens Ag Oesterreich | SEMICONDUCTOR MODULE |
| DE10201557B4 (en) * | 2002-01-17 | 2011-06-30 | Modine Manufacturing Co., Wis. | Evaporative cooling container and method for evacuating and filling the container |
| US7307841B2 (en) * | 2005-07-28 | 2007-12-11 | Delphi Technologies, Inc. | Electronic package and method of cooling electronics |
| US7492594B2 (en) * | 2007-05-03 | 2009-02-17 | Hamilton Sundstrand Corporation | Electronic circuit modules cooling |
-
2009
- 2009-05-12 GB GB0908156A patent/GB2467805C/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| GB2467805A (en) | 2010-08-18 |
| GB2467805B (en) | 2011-04-06 |
| GB0908156D0 (en) | 2009-06-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) |
Free format text: REGISTERED BETWEEN 20120712 AND 20120718 |
|
| 732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) |
Free format text: REGISTERED BETWEEN 20200109 AND 20200115 |