GB2460420A

GB2460420A - Heat transfer panel with reinforcing layer

Info

Publication number: GB2460420A
Application number: GB0809653A
Authority: GB
Inventors: Allen Jones
Original assignee: Individual
Current assignee: Individual
Priority date: 2008-05-28
Filing date: 2008-05-28
Publication date: 2009-12-02
Also published as: GB0809653D0

Abstract

A heat transfer panel 1 comprises a body 2 with first and second opposed planar surfaces and one or more channels 3 for receiving a heat transfer pipe formed therein and an opening at the first planar surface. The panel is provided with a reinforcing layer 5, 6 at each of the first and second surfaces of the body. The reinforcing layer on at least the first planar surface of the body is a thermally conductive material. The reinforcing layer may be a fibre reinforced aluminium foil.

Description

HEAT TRANSFER PANEL AND SYSTEM

Field of the Invention

The present invention relates to heat transfer panels and heat transfer systems using such panels together with methods for installing such systems. In particular, the invention relates to underfloor heat transfer panels and systems, especially underfloor heating panels and systems, which are suitable for installation into existing buildings.

Background of the Invention

Underfloor heating systems are increasingly used in modern buildings in place of the traditional radiator based heating systems used hitherto. Typically, the heating medium, which is generally warm water, is circulated in pipes arranged underneath a floor.

Known systems for use with screeded floors comprise rigid insulation panels upon which heating pipes are held in place, for example by means of clips, the overall assembly being covered over with screed.

Heating systems which have found commercial application for use with suspended floors typically involve the use of heat diffusion plates made from a high thermal conductivity material such as aluminium which are fitted into pipe carrying channels formed in a layer of thermal insulation fixed between the joists of the floor. Following installation of the heating pipes in the heat diffusion plates, floorboards or some other such suitable floor covering can be laid on top of the joists. The heat diffusion plates, which support the heating pipes, contact the underside of the floorboards and transfer the heat away from the heating pipes and towards the floorboards.

Although such underfloor heating systems are in common use, they are not without their disadvantages. The heat diffusion plates are expensive and difficult to handle in transportation and on site due to their bulky shape, adding to the time and cost of the installation process. Furthermore, they also increase the overall height profile of the heating panels. Commercially available heat diffusion plate systems typically have a thickness of upwards of 40 mm, rendering them generally unsuited for installation in existing buildings as raising the level of the floor by such an amount can present problems and can lead to disjointed floor levels.

There therefore remains a continuing need for the development of heat transfer systems which overcome the problems associated with known systems and particularly which can be installed in existing buildings.

Summary of the Invention

The present invention is concerned with a heat transfer panel and system suitable for installation in existing buildings, either as a wall mounted heat transfer system or as an underfloor heat transfer system. In particular, the invention provides an underfloor heat transfer panel and system which can be installed in existing buildings without raising the floor height significantly.

In a first aspect, the invention provides a heat transfer panel comprising a body comprising first and second opposed planar surfaces and having one or more channels for receiving a heat transfer element formed therein and opening at the first planar surface, the panel being provided with a reinforcing layer at each of the first and second surfaces of the body, the reinforcing layer on at least the first planar surface of the body comprising a thermally conductive material.

In other aspects, the invention also provides a heat transfer system comprising one or more such panels and one or more heat transfer elements and a method for installing such a heat transfer system.

Also provided is a floor or wall comprising a heat transfer system according to the above aspect.

Further provided is a building comprising such a floor or wall.

By means of the invention, a reinforced heat transfer panel is provided which is sufficiently robust that it can be handled and installed without serious risk of suffering damage. The strengthening presence of the reinforcing layers affords the additional advantage that the panel can be made sufficiently thin that when used as an underfloor heat transfer panel it can be incorporated into an existing floor without a major impact on floor levels.

Detailed description of the Invention

As used herein, the term "heat transfer" relates to heating or cooling processes.

A heat transfer element may comprise a pipe through which a heating or cooling fluid is passed or alternatively the heat transfer element may comprise an electrical heating cable.

In one embodiment, the heat transfer element comprises a pipe which may be made of any suitable material conventional in the art. It will be appreciated that any materials suitable for carrying the heating or cooling fluid may be employed. In one embodiment, the pipe is preferably made of a plastics material.

The diameter of the pipe will be chosen so as to achieve the desired heating/cooling effect. Suitably, a pipe with a diameter of 12 mm is employed although the use of smaller diameter pipes of, for example 8mm or 10 mm, is also contemplated In one particular embodiment, the heat transfer panel according to the invention is a heating panel. Suitably, the heating fluid is warm water.

In another embodiment, the heat transfer panel according to the invention is a cooling panel.

According to one embodiment, the heat transfer panel according to the invention may be installed in or mounted on a wall. In one particular embodiment, the heat transfer panel may be installed underfloor.

The body of the heat transfer panel suitably comprises any material which is sufficiently resilient that a heat transfer element received in a channel formed therein is engaged by the channel and may be held in place without the need for additional fixing means.

In one embodiment, the body comprises a thermally insulating material. In one embodiment, the body of the heat transfer panel comprises a plastics material, for example polystyrene.

Alternatively, the heat transfer panel may suitably comprise a wooden panel including MDF board, also Gyproc type materials.

Typically, the heat transfer panel has a thickness in the range of from 10mm to 30mm. In one embodiment, the heat transfer panel has a thickness of 15 mm.

The channel for receiving the heat transfer element is suitably formed to an appropriate size to ensure a close fit with the heat transfer element. The channel may suitably be formed using a heated wire cutter or alternatively using a router.

It will be appreciated that the optimal diameter of the channel formed in the body of the panel and opening at the first surface thereof will depend on the diameter of the heat transfer element and the thickness of the body of the panel. If the external diameter of the heat transfer element is too large in relation to the thickness of the panel, the panel will be weakened.

Typically, the external diameter of the heat transfer element is desirably in the range of Bnun to 20 mm.

In one embodiment, the dimensions of the channel are such that the received heat transfer element does not protrude beyond the first surface of the body of the panel.

The first surface and the second surface of the body of the panel respectively are provided with a reinforcing layer to provide strength to the panel and protect it from fracturing and separating.

It will be appreciated that in the case of an underfloor heat transfer panel, the first surface, in use, is the upper surface of the panel and the second surface, in use, is the lower surface of the panel. Where the heat transfer panel is mounted on a wall, the first surface, in use, is the surface remote from the wall.

Suitably, the reinforcing layers cover substantially the whole of the first and second surfaces of the body of the panel respectively.

In one embodiment, the reinforcing layers on each of the first and second surfaces of the body have a depth of 6 to 20 microns.

The reinforcing layer on the first, upper surface of the panel comprises a thermally conductive material. In one embodiment, the thermally conductive layer extends over substantially the whole of the first surface of the body including into the channel formed in the body and opening into the first surface.

The thermally conductive layer suitably comprises a metal sheet or foil, preferably aluminium. In one particular embodiment, the thermally conductive layer comprises a layer of aluminium foil, in particular aluminium foil which has been reinforced by a membrane of woven fibres.

It will be appreciated that the thermally conductive layer has the dual purpose of strengthening the panel and also providing thermal conduction away from the heat transfer element. The thermally conductive layer should be of sufficient depth to provide acceptable thermal conduction but not so deep that the weight and height profile of the panel are increased unacceptably.

The thermally conductive layer on the first surface of the body may be formed from a single sheet of thermally conductive material extending over substantially the whole of the first surface of the body, including into the channel or channels formed in the body and opening into the first surface.

In one embodiment, the thermally conductive layer fitted within the channel or channels formed in the body and the thermally conductive layer formed on the remainder of the first surface of the body are formed from separate sheets of material, the individual layers being affixed together, typically by adhesion of overlapping regions.

Suitably, the thermally conductive layer is adhered to the first surface of the body. Any conventional adhesive suitable for adhering a metal sheet to the body material may be employed.

The reinforcing layer on the second surface of the body of the panel desirably comprises a reflective material so as to minimise radiative heat transfer at the lower surface of the body of the heat transfer panel. The reinforcing layer on the second surface of the body may comprise a thermally conductive material.

In one embodiment, the reinforcing layer on the second surface of the body of the panel comprises a reflective, thermally conductive material such as a reinforced aluminium foil as described above.

Suitably, the reinforcing layer on the second surface is adhered to the second surface of the body. As for the first surface above, any conventional adhesive suitable for adhering a metal sheet to the body material may be employed.

The panel according to the invention is lightweight, easily handleable and inexpensive to manufacture. Fitting the heat transfer element into the channel or channels formed in the body is a simple matter and does not require specialist equipment, rendering installation of underfloor heating or cooling systems an inexpensive procedure.

Suitably, the heat transfer panel is provided with connecting means for connecting one panel to another such that a plurality of panels may be joined together to form a substantially planar surface of overall size appropriate to the area of the floor or wall in which the heat transfer system is to be installed. Any conventional connecting means may be employed, such as clips or joints, to join the panels together. Alternatively, the panels suitably may be adhered together.

In one embodiment, the heat transfer system according to the invention comprises a plurality of such heat transfer panels.

It will be appreciated that the panels will desirably be positioned such that the channel or channels in the bodies of the individual panels are aligned so as to provide a Continuous passage to allow the heat transfer element to pass between one panel to another.

In one embodiment, the body of the panel has a plurality of channels formed therein and opening at the first surface thereof. Suitably, the body of the panel comprises a plurality of parallel channels.

In one embodiment, the channel or channels within the body of the panel are shaped so as to provide a passage for the heat transfer element in the panel. Where necessary, the body of the panel has one or more curved channels to enable the heat transfer element to be formed into a loop.

Suitably, a sufficient number of heat transfer panels having curved channels may be incorporated into the overall arrangement of panels so that the heat transfer element received therein can be arranged in an appropriate configuration so as to provide a heating or cooling effect across the whole of the area of the floor or wall in which the heat transfer system is to be installed.

In one embodiment, the heat transfer element is arranged in a looped configuration preferably in a serpentine configuration having one or more loops with a return bend of an angle of 1800 or greater.

In installation, the heat transfer panel is placed in position on the floor or wall (or the plurality of heat transfer panels are assembled together in the desired arrangement and placed in position) and the heat transfer element is inserted in the channel. An outer floor or wall covering is then applied.

Suitably, in the case of an underfloor heat transfer system, a layer of a material such as concrete may be applied over the top of the panel or panels to form the outer floor covering.

Alternatively, the panel or panels may be affixed to the underside of a boarded floor.

Where the heat transfer panel is intended for use as a wall panel, it is conveniently provided on the second surface with a backing board comprising chipboard, MDF or some similar such rigid material for attaching the panel to the wall. A sheet of plasterboard is suitably applied over the first surface of the panel to provide a surface ready for plastering or dryliriing.

Throughout the description and claims of this specification, the words "comprise" and "contain" and variations of the words, for example "comprising" and "comprises", mean "including but not limited to", and do not exclude other moieties, additives, components, integers or steps.

Throughout the description and claims of this specification, the singular encompasses the plural unless the context otherwise requires. In particular, where the indefinite article is used, the specification is to be understood as contemplating plurality as well as singularity, unless the context requires otherwise.

Preferred features of each aspect of the invention may be as described in connection with any of the other aspects.

Other features of the present invention will become apparent from the following example. Generally speaking the invention extends to any novel one, or any novel combination, of the features disclosed in this specification (including any accompanying claims and drawings) . Thus features, integers or characteristics described in conjunction with a particular aspect, embodiment or example of the invention are to be understood to be applicable to any other aspect, embodiment or example described herein unless incompatible therewith.

Moreover unless stated otherwise, any feature disclosed herein may be replaced by an alternative feature serving the same or a similar purpose.

The invention may be further illustrated by way of example only with reference to the following figures in which:-Figure 1 shows in cross-section a heat transfer panel according to the invention Figure 2 shows a perspective view of a heat transfer system according to the invention Figure 1 shows a panel (1) comprising a body (2) which may be made of a thermally insulating material such as polystyrene. The body (2) is formed with a channel (3) opening at its first surface (constituting the upper surface in use) and shaped to provide a close fit to a heat transfer element (not shown) when received therein to ensure good thermal contact between the outside of the heat transfer element and the inside of the channel. The channel (3) is formed to a depth which is substantially the same as the diameter of the heat transfer element and has a lower surface shaped to accommodate the heat transfer element. In the embodiment of Figure 1, the heat transfer element (not shown) is circular in shape and the base of the channel (3) is therefore semi-circular in cross-section.

The channel may be formed using a heated wire cutter or a router and multiple channels (not shown) may be provided in the panel as desired.

The upper and lower surfaces, as shown, of the body of the panel are faced with reinforcing layers (5), (6) of typical thickness 6-20 microns. The reinforcing layer on the first, upper surface (5) is formed of a thermally conducting material, which in the embodiment shown is aluminium foil reinforced with woven fibres, and the reinforcing layer on the second surface (constituting the bottom surface in the embodiment shown)preferably comprises a reflective material and again in the embodiment shown is reinforced aluminium foil. In the present embodiment the reinforcing layers are glued onto the respective surfaces of the body (2). As can be seen from Figure 1, the reinforcing layer (4)lining the channel (3)formed in the body and opening into the first, upper surface of the body is formed from a separate sheet of material to the reinforcing layer adhered to the upper surface of the body. In the embodiment shown, the channel lining layer (4) is first set into the channel and glued into position, then the upper surface of the body is covered with a reinforcing layer (5) and this too is glued into position. A slit is then cut through the portion of the layer (5) located directly above the channel to allow the heat transfer element to be inserted into the channel.

The overall thickness of the panel (1) shown in Figure 1 is approximately 15 mm with a channel depth of approximately 12 mm.

Figure 2 shows a view of a heat transfer system comprising a heat transfer panel as shown in Figure 1 with a heat transfer pipe installed in a channel formed in the body of the panel and opening into the first, upper surface (A) . Additional channels into which the heat transfer pipe can be fitted are also shown (B).

Claims

Claims 1. A heat transfer panel comprising a body comprising first and second opposed planar surfaces and having one or more channels for receiving a heat transfer element formed therein and opening at the first planar surface, the panel being provided with a reinforcing layer at each of the first and second surfaces of the body, the reinforcing layer on at least the first planar surface of the body comprising a thermally conductive material.
2. A heat transfer panel according to claim 1 wherein the body comprises a thermally insulating material.
3. A heat transfer panel according to claim 1 or claim 2 wherein the body comprises polystyrene.
4. A heat transfer panel according to any preceding claim wherein the reinforcing layer on the second surface of the body comprises a reflective material.
5. A heat transfer panel according to any preceding claim wherein the reinforcing layers at the first and second surfaces of the body each comprise reinforced aluminium foil.
6. A heat transfer panel according to any preceding claim wherein the reinforcing layers have a depth of from 6 to 20 microns.
7. A heat transfer panel according to any preceding claim wherein the reinforcing layer on the first surface of the body extends over substantially the whole of the first surface of the body including into the channel formed in the body and opening into the first surface.
8. A heat transfer panel according to any preceding claim wherein the reinforcing layer on the second surface extends substantially over the whole of the second surface of the body.
9. A heat transfer panel according to any preceding claim wherein the body has a plurality of parallel channels formed therein.
10. A heat transfer panel according to any preceding claim wherein the body has one or more curved channels formed therein.
11. A heat transfer panel according to any preceding claim wherein the panel has a thickness in the range of from 10mm to 30mm.
12. A heat transfer panel according to claim 11 wherein the panel has a thickness of 15 mm.
13. A heat transfer panel according to any preceding claim wherein the heat transfer panel is provided with connecting means for connecting one panel to another.
14. A heat transfer system comprising one or more heat transfer panels according to any of claim 1 to 13 and one or more heat transfer elements received in the channels.
15. A heat transfer system according to claim 14 comprising a plurality of heat transfer panels according to any of claims 1 to 13.
16. A heat transfer system according to claim 15 wherein the panels are joined together to form a substantially planar surface.
17. A heat transfer system according to claim 16 wherein the channels in the bodies of the individual panels are aligned so as to provide a continuous passage to allow the heat transfer element to pass between one panel and another.
18. A heat transfer system according to claim 17 wherein the heat transfer element is arranged in a serpentine configuration.
19. A method of installing a heat transfer system comprising providing at least one heat transfer panel according to any of claim 1 to 13 in position on a wall or floor with the first surface of the body remote from the surface of the wall or floor, inserting a heat transfer element through the opening in the first surface of the body into the channel formed in the body and covering the heat transfer panel with a floor or wall covering.
20. A method of installing a heat transfer system comprising providing a plurality of heat transfer panels each according to any of claim 1 to 13, assembling the panels together so that the channels in the panels align to provide a continuous passage between one panel and another, inserting a heat transfer element into the passage so formed and covering the heat transfer panel with a floor or wall covering.
21. A heat transfer panel substantially as hereinbefore described with reference to the Figures.
22. A heat transfer system substantially as hereinbefore described.
23. A floor or wall including a heat transfer system according to any of claims 14 to 18.
24. A building including a floor or wall according to claim 23.