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GB2443352B - Method and system for hermetically sealing packages for optics - Google Patents

Method and system for hermetically sealing packages for optics

Info

Publication number
GB2443352B
GB2443352B GB0800592A GB0800592A GB2443352B GB 2443352 B GB2443352 B GB 2443352B GB 0800592 A GB0800592 A GB 0800592A GB 0800592 A GB0800592 A GB 0800592A GB 2443352 B GB2443352 B GB 2443352B
Authority
GB
United Kingdom
Prior art keywords
optics
hermetically sealing
sealing packages
packages
hermetically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0800592A
Other versions
GB2443352A (en
GB0800592D0 (en
Inventor
Xiao Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miradia Inc
Original Assignee
Miradia Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/693,323 external-priority patent/US7303645B2/en
Application filed by Miradia Inc filed Critical Miradia Inc
Priority to GB0800592A priority Critical patent/GB2443352B/en
Priority claimed from GB0703881A external-priority patent/GB2439403B/en
Publication of GB0800592D0 publication Critical patent/GB0800592D0/en
Publication of GB2443352A publication Critical patent/GB2443352A/en
Application granted granted Critical
Publication of GB2443352B publication Critical patent/GB2443352B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L27/14618—
    • H01L31/0203—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H10W95/00—
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • H10W72/5522—
    • H10W74/00—
    • H10W90/754—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)
GB0800592A 2003-10-24 2004-10-22 Method and system for hermetically sealing packages for optics Expired - Fee Related GB2443352B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0800592A GB2443352B (en) 2003-10-24 2004-10-22 Method and system for hermetically sealing packages for optics

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/693,323 US7303645B2 (en) 2003-10-24 2003-10-24 Method and system for hermetically sealing packages for optics
GB0800592A GB2443352B (en) 2003-10-24 2004-10-22 Method and system for hermetically sealing packages for optics
GB0703881A GB2439403B (en) 2003-10-24 2004-10-22 Method and system for hermetically sealing packages for optics

Publications (3)

Publication Number Publication Date
GB0800592D0 GB0800592D0 (en) 2008-02-20
GB2443352A GB2443352A (en) 2008-04-30
GB2443352B true GB2443352B (en) 2008-07-16

Family

ID=39273305

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0800592A Expired - Fee Related GB2443352B (en) 2003-10-24 2004-10-22 Method and system for hermetically sealing packages for optics

Country Status (1)

Country Link
GB (1) GB2443352B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9057872B2 (en) 2010-08-31 2015-06-16 Qualcomm Mems Technologies, Inc. Dielectric enhanced mirror for IMOD display
US20120235959A1 (en) * 2011-03-15 2012-09-20 Qualcomm Mems Technologies, Inc. Seal anchor structures

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001029890A2 (en) * 1999-10-19 2001-04-26 Imego Ab Method relating to anodic bonding

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001029890A2 (en) * 1999-10-19 2001-04-26 Imego Ab Method relating to anodic bonding

Also Published As

Publication number Publication date
GB2443352A (en) 2008-04-30
GB0800592D0 (en) 2008-02-20

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20181022