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GB2337121B - Temperature estimation arrangement and method - Google Patents

Temperature estimation arrangement and method

Info

Publication number
GB2337121B
GB2337121B GB9809855A GB9809855A GB2337121B GB 2337121 B GB2337121 B GB 2337121B GB 9809855 A GB9809855 A GB 9809855A GB 9809855 A GB9809855 A GB 9809855A GB 2337121 B GB2337121 B GB 2337121B
Authority
GB
United Kingdom
Prior art keywords
temperature estimation
estimation arrangement
arrangement
temperature
estimation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9809855A
Other languages
English (en)
Other versions
GB2337121A (en
GB9809855D0 (en
Inventor
Peter Miller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions UK Ltd
Original Assignee
Motorola Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Ltd filed Critical Motorola Ltd
Priority to GB9809855A priority Critical patent/GB2337121B/en
Publication of GB9809855D0 publication Critical patent/GB9809855D0/en
Priority to DE19920401A priority patent/DE19920401A1/de
Publication of GB2337121A publication Critical patent/GB2337121A/en
Application granted granted Critical
Publication of GB2337121B publication Critical patent/GB2337121B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/42—Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
    • H10W40/00—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
GB9809855A 1998-05-09 1998-05-09 Temperature estimation arrangement and method Expired - Fee Related GB2337121B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB9809855A GB2337121B (en) 1998-05-09 1998-05-09 Temperature estimation arrangement and method
DE19920401A DE19920401A1 (de) 1998-05-09 1999-05-04 Anordnung und Verfahren zur Temperaturschätzung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9809855A GB2337121B (en) 1998-05-09 1998-05-09 Temperature estimation arrangement and method

Publications (3)

Publication Number Publication Date
GB9809855D0 GB9809855D0 (en) 1998-07-08
GB2337121A GB2337121A (en) 1999-11-10
GB2337121B true GB2337121B (en) 2002-07-31

Family

ID=10831681

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9809855A Expired - Fee Related GB2337121B (en) 1998-05-09 1998-05-09 Temperature estimation arrangement and method

Country Status (2)

Country Link
DE (1) DE19920401A1 (de)
GB (1) GB2337121B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10401235B2 (en) 2015-09-11 2019-09-03 Qualcomm Incorporated Thermal sensor placement for hotspot interpolation

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1241459A1 (de) * 2001-08-09 2002-09-18 Infineon Technologies AG Verfahren und Vorrichtung zur Bestimmung der Prozesstemperatur der Oberfläche eines Produkts, insbesondere einer Halbleiterscheibe
WO2004062082A1 (de) * 2002-12-20 2004-07-22 Siemens Aktiengesellschaft Regelverfahren für einen elektrischen antrieb
DE10309302B4 (de) * 2003-03-04 2007-09-27 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Sensorbauteil
FI118363B (fi) * 2004-03-29 2007-10-15 Vacon Oyj Tehopuolijohdekomponenttien suojaus
DE102004018578B4 (de) 2004-04-16 2007-02-22 Siemens Ag Verfahren und Vorrichtung zur Erfassung eines Verschmutzungsgrades eines betriebenen Umrichtergerätes
DE102005013762C5 (de) 2005-03-22 2012-12-20 Sew-Eurodrive Gmbh & Co. Kg Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters
US7839201B2 (en) 2005-04-01 2010-11-23 Raytheon Company Integrated smart power switch
FR2944876B1 (fr) * 2009-04-27 2012-12-28 Peugeot Citroen Automobiles Sa Procede et systeme pour quantifier une temperature de jonction de composant.
US9030054B2 (en) 2012-03-27 2015-05-12 Raytheon Company Adaptive gate drive control method and circuit for composite power switch
DE102013211841A1 (de) * 2013-06-21 2015-01-08 Osram Opto Semiconductors Gmbh Verfahren zum Bestimmen einer Temperatur eines optoelektronischen Halbleiterchips und optoelektronisches Bauelement
CN219740736U (zh) * 2023-01-19 2023-09-22 华为数字能源技术有限公司 功率模块、充电桩及电源

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1347409A (en) * 1970-06-23 1974-02-27 Gen Electric Semiconductor device junction temperature monitor
GB1534862A (en) * 1974-12-02 1978-12-06 Gen Electric Canada Temperature monitoring of semiconductors

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1347409A (en) * 1970-06-23 1974-02-27 Gen Electric Semiconductor device junction temperature monitor
GB1534862A (en) * 1974-12-02 1978-12-06 Gen Electric Canada Temperature monitoring of semiconductors

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10401235B2 (en) 2015-09-11 2019-09-03 Qualcomm Incorporated Thermal sensor placement for hotspot interpolation

Also Published As

Publication number Publication date
GB2337121A (en) 1999-11-10
GB9809855D0 (en) 1998-07-08
DE19920401A1 (de) 1999-11-11

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20040509