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GB2320965B - Method for testing electronic devices attached to a leadframe - Google Patents

Method for testing electronic devices attached to a leadframe

Info

Publication number
GB2320965B
GB2320965B GB9804054A GB9804054A GB2320965B GB 2320965 B GB2320965 B GB 2320965B GB 9804054 A GB9804054 A GB 9804054A GB 9804054 A GB9804054 A GB 9804054A GB 2320965 B GB2320965 B GB 2320965B
Authority
GB
United Kingdom
Prior art keywords
leadframe
electronic devices
devices attached
testing electronic
testing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9804054A
Other versions
GB2320965A (en
GB9804054D0 (en
Inventor
Yiu Kam Law
Glenn King Tong Cheung
Pak So Lie
Simon Hong Sing She
Kwok Heung Ho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to GB9804054A priority Critical patent/GB2320965B/en
Publication of GB9804054D0 publication Critical patent/GB9804054D0/en
Publication of GB2320965A publication Critical patent/GB2320965A/en
Application granted granted Critical
Publication of GB2320965B publication Critical patent/GB2320965B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H10W70/421—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
GB9804054A 1993-11-25 1993-11-25 Method for testing electronic devices attached to a leadframe Expired - Fee Related GB2320965B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9804054A GB2320965B (en) 1993-11-25 1993-11-25 Method for testing electronic devices attached to a leadframe

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9804054A GB2320965B (en) 1993-11-25 1993-11-25 Method for testing electronic devices attached to a leadframe
GB9324219A GB2285139B (en) 1993-11-25 1993-11-25 Method for testing electronic devices attached to a leadframe

Publications (3)

Publication Number Publication Date
GB9804054D0 GB9804054D0 (en) 1998-04-22
GB2320965A GB2320965A (en) 1998-07-08
GB2320965B true GB2320965B (en) 1998-08-26

Family

ID=10745664

Family Applications (3)

Application Number Title Priority Date Filing Date
GB9804054A Expired - Fee Related GB2320965B (en) 1993-11-25 1993-11-25 Method for testing electronic devices attached to a leadframe
GB9324219A Expired - Fee Related GB2285139B (en) 1993-11-25 1993-11-25 Method for testing electronic devices attached to a leadframe
GB9804053A Expired - Fee Related GB2320964B (en) 1993-11-25 1993-11-25 Method for testing electronic devices attached to a a leadframe

Family Applications After (2)

Application Number Title Priority Date Filing Date
GB9324219A Expired - Fee Related GB2285139B (en) 1993-11-25 1993-11-25 Method for testing electronic devices attached to a leadframe
GB9804053A Expired - Fee Related GB2320964B (en) 1993-11-25 1993-11-25 Method for testing electronic devices attached to a a leadframe

Country Status (4)

Country Link
JP (1) JPH07253450A (en)
CN (1) CN1104647C (en)
GB (3) GB2320965B (en)
MY (1) MY118387A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG82566A1 (en) * 1996-10-17 2001-08-21 Motorola Inc Method and apparatus for transporting ang testing electronic devices attached to a leadframe
NL1008697C2 (en) * 1998-03-25 1999-09-28 Fico Bv Test device, test assembly, method for testing and method for calibrating a test device.
WO2000004395A1 (en) * 1998-07-15 2000-01-27 Siemens Aktiengesellschaft Device for the electric testing of integrated circuits
NL1012420C2 (en) * 1999-06-23 2000-12-28 Johannes Nicolaas Peperkamp Method for measuring electronic components, in particular integrated circuits, and device for that purpose.
JP4111767B2 (en) 2002-07-26 2008-07-02 株式会社ルネサステクノロジ Manufacturing method of semiconductor device and electrical property inspection method of small element
US20080265248A1 (en) * 2007-04-27 2008-10-30 Microchip Technology Incorporated Leadframe Configuration to Enable Strip Testing of SOT-23 Packages and the Like
CN102565652A (en) * 2010-12-30 2012-07-11 展晶科技(深圳)有限公司 Detection device and detection method of encapsulation structure of light-emitting diode

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4855672A (en) * 1987-05-18 1989-08-08 Shreeve Robert W Method and process for testing the reliability of integrated circuit (IC) chips and novel IC circuitry for accomplishing same
US4985988A (en) * 1989-11-03 1991-01-22 Motorola, Inc. Method for assembling, testing, and packaging integrated circuits
US5008615A (en) * 1989-11-03 1991-04-16 Motorola, Inc. Means and method for testing integrated circuits attached to a leadframe
GB2249868A (en) * 1990-11-15 1992-05-20 Sgs Thompson Microelectronics A testing and finishing system for integrated circuit package units

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4855672A (en) * 1987-05-18 1989-08-08 Shreeve Robert W Method and process for testing the reliability of integrated circuit (IC) chips and novel IC circuitry for accomplishing same
US4985988A (en) * 1989-11-03 1991-01-22 Motorola, Inc. Method for assembling, testing, and packaging integrated circuits
US5008615A (en) * 1989-11-03 1991-04-16 Motorola, Inc. Means and method for testing integrated circuits attached to a leadframe
GB2249868A (en) * 1990-11-15 1992-05-20 Sgs Thompson Microelectronics A testing and finishing system for integrated circuit package units

Also Published As

Publication number Publication date
GB2285139B (en) 1998-06-24
GB2320964A (en) 1998-07-08
GB2285139A (en) 1995-06-28
CN1106926A (en) 1995-08-16
MY118387A (en) 2004-10-30
CN1104647C (en) 2003-04-02
JPH07253450A (en) 1995-10-03
GB2320965A (en) 1998-07-08
GB9804053D0 (en) 1998-04-22
GB2320964B (en) 1998-08-26
GB9324219D0 (en) 1994-01-12
GB9804054D0 (en) 1998-04-22

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20071125