GB2318758A - Metod for applying conductive shielding to a non-conductive part - Google Patents
Metod for applying conductive shielding to a non-conductive part Download PDFInfo
- Publication number
- GB2318758A GB2318758A GB9720010A GB9720010A GB2318758A GB 2318758 A GB2318758 A GB 2318758A GB 9720010 A GB9720010 A GB 9720010A GB 9720010 A GB9720010 A GB 9720010A GB 2318758 A GB2318758 A GB 2318758A
- Authority
- GB
- United Kingdom
- Prior art keywords
- conductive layer
- conductive
- mold cavity
- finished part
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 claims abstract description 45
- 239000012811 non-conductive material Substances 0.000 claims abstract description 19
- 239000010410 layer Substances 0.000 claims description 79
- 239000002355 dual-layer Substances 0.000 claims description 12
- 238000007666 vacuum forming Methods 0.000 claims description 7
- 238000000465 moulding Methods 0.000 abstract description 13
- 238000012545 processing Methods 0.000 abstract description 3
- 238000002347 injection Methods 0.000 description 12
- 239000007924 injection Substances 0.000 description 12
- 239000011888 foil Substances 0.000 description 6
- 238000005507 spraying Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000088 plastic resin Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0011—Electromagnetic wave shielding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3431—Telephones, Earphones
- B29L2031/3437—Cellular phones
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Telephone Set Structure (AREA)
Abstract
A substantially planar conductive layer (12) provides a conductive shield. The conductive layer (12) is vacuum formed to produce a vacuum formed part. The vacuum formed part is loaded into a mold cavity (20) of a mold machine (10). The mold cavity (20) and the vacuum formed part have a predetermined shape being substantially the same. Non-conductive material (22) is injected into the mold cavity (20) between the conductive layer (12) and a surface (50) of the mold cavity (20) to permit the non-conductive material (22) to bond to the conductive layer (12) to form a finished part (27) having the predetermined shape. The finished part (27) has the non-conductive material (22) on an outer surface (52) of the finished part (27) and the conductive layer (12) on an inner surface (54) of the finished part (27). The finished part (27) is ejected from the mold cavity (20). The abovementioned method (28) reduces processing time, reduces piece part cost and improves the conductive shield's placement and effectiveness over that of the prior art. The conductive layer 12 is carried on a carrier layer during the moulding process. The finished part 27 may be a top or bottom housing for a portable radiotelephone handset.
Description
2318758 METHOD FOR APPLYING CONDUCTIVE SHIELDING TO A NON-CONDUCTIVE PART
FIELD OF THE INVENTION
The present invention relates generally to a process for molding parts, and more particularly to a method for applying conductive shielding to a non-conductive part.
BACKGROUND OF THE INVENTION
Parts are molded to provide housings for a variety of products such as electronic equipment. One example of electronic equipment is a radio.
Radios include radiotelephones and pagers, for example. Housings for radios contain radio circuitry for transmitting or receiving signals to provide a user of a radio with wireless communications.
Housings for radios typically need conductive shielding to serve several known purposes including reducing the effects of: electromagnetic interference (EMI), radio frequency interference (RFI) and static discharge (SD). The housings are typically non-conductive plastic on their outer surface to provide an aesthetic appearance. The housings [are] typically have the conductive shielding on their inner surface to provide protection against EMI, RFI and SI).
The housings are usually injection molded. Conventional methods used to apply a conductive shield to the inside surface of the injected molded housings include: vacuum metalization, conductive paint spraying, adhesive foil, electroplating, plasma stream and hot metal spraying. Various methods for grounding electronic circuitry to the conductive shield are well known in the art.
CE00717R A disadvantage of the vacuum metalization, conductive paint spraying, electroplating, plasma stream and hot metal spraying methods is that the inner surface of the injection molded housing must be masked off.
The mask blocks the outer surface of the injection molded housing from receiving the conductive shielding. The mask only allows the inner surface of the injection molded housing to receive the conductive shielding. The masking process is usually applied manually to each part and is therefore time consuming and expensive to make. Further, the conductive shielding may be ineffective if the mask is not aligned properly.
A disadvantage of the adhesive-backed conductive foil method is that the adhesive foil is usually manually applied to the inner surface of the injection molded housing. Therefore, this method is also time consuming and expensive to make. Further, the conductive shielding may be ineffective if the adhesive-backed conductive foil is not aligned properly.
Accordingly, there is a need for a method for applying conductive shielding to a non-conductive part which reduces processing time, reduces piece part cost and improves the conductive shield's placement and effectiveness.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an elevation view of a machine for molding parts in accordance with the present invention.
FIG. 2 is a flow chart describing steps of a method performed by the machine shown in FIG. 1 in accordance with the present invention.
FIG. 3 is a cross-section view of a planar conductive layer provided in accordance with the steps shown in the flow chart of FIG. 2.
FIG. 4 is a cross-section view of the planar conductive layer shown in FIG. 3 applied to a planar non-conductive layer in accordance with the steps shown in the flow chart of FIG. 2.
FIG. - 5 is a cross-section view of the planar conductive layer shown in FIG. 3 applied to a planar non-conductive layer and vacuum formed in a predetermined shape in accordance with the steps shown in the flow chart of FIG. 2.
FIG. 6 is a cross-section view of the vacuum formed part shown in FIG.
wherein the planar non-conductive layer is overmolded using an injection 2 CE00717R molding process to produce a finished part having a nonconductive out'.- er layer and a conductive inner layer in accordance with the steps shown in the flow chart of FIG. 2.
FIG. 7 is a perspective view of an assembled housing for a portable radiotelephone handset including a top housing and a bottom housing constructed in accordance with the steps shown in the flow chart of FIG. 2.
DETAILED DESCRIPTION OF A PREFERRED EMBODIMENT
FIG. 1 is an elevation view of a machine 10 for molding parts in accordance with the present invention. The machine 10 generally comprises a vacuum forming mold 14 and an injection mold 16 and 18 including a moving side mold platen 16 and a stationary side mold platen 18. The moving side mold platen 16 and the stationary side mold platen 18 together form a mold cavity 20 for molding parts having a predetermined shape. A hopper 24 stores resin 22 formed of a non-conductive material which is injected into the mold cavity 20 through the stationary side moldplaten 18. A metalized heat transfer foil 12 forms a conductive layer to be processed by the machine 10 in accordance with a method described hereinbelow with reference to FIG. 2. A control mechanism 26 feeds, indexes and aligns the metalized heat transfer foil 12 in accordance with the position and process timing of the vacuum forming mold 14 and injection mold 16 and 18 as it is processed by the machine 10 to produce a finished part 27 as shown in FIG. 6.
FIG. 2 is a flow chart 28 describing steps of a method performed by the machine 10 shown in FIG. 1 in accordance with the present invention'. The flow chart 28 describes a method for applying conductive shielding 12 to a non-conductive molded part as shown in FIG. 6. In the preferred embodiment, the conductive shielding 12 to a non-conductive molded part provides a shielded housing for electronic equipment, such as a radio. In the preferred embodiment, the shielded housing is for a cellular radiotelephone. Alterndtively, the shielded housing may be used for any radio device such as a pager or a two-way land portable radio, for example.
The method begins with the step 29. The method continues to step 30 of providing the conductive layer 12 which is substantially planar. Preferably, the conductive layer 12 is carried on a carrier layer 31 as shown in FIGs. 3-6 and forms the conductive shielding for the finished part 27 as shown in FIG.
3 CE00717R 6. The carrier layer 31 provides a way to transport the conductive layer 12 during the molding process. The carrier layer 31 preferably remains attached to the conductive layer 12 throughout the molding process until the finished part is ejected from the mold cavity 20. Thus, the carrier layer 31 advantageously provides automatic handling of the conductive layer 12 during the molding process. In the preferred embodiment, the conductive layer 12 is a layer of metal. The conductive layer 12 has a preferred thickness of 0.0005-0.001 inches and a preferred resistivity of 0.2 Ohms/square. However, any other conductive layer having appropriate conduction characteristics and strength, such as a painted film, may be used.
In the preferred embodiment, the method continues with the step 33 of providing a non-conductive layer 32 as shown in FIGs. 3-6 which is also substantially planar. The non-conductive layer 32 is preferably a film for supporting the conductive layer 12. Alternatively, the non-conductive layer 32 may be a thin layer of non-conductive resin, such as 0.0005-0.001 inches, for example. It is important that the non-conductive layer 32 have proper material characteristics to properly affix itself to both the conductive layer- 12 and the non-conductive material 22. Alternatively, the non- conductive material can be directly applied to the conductive layer 12 during the injection molding process.
The method continues with the step 34 of applying the conductive layer 12 to the non-conductive layer 32 to form a dual layer structure 36. The conductive layer 12 and the non-conductive layer 32 are preferably joined before the process of forming the finished part. The dual layer structure 36 would typically be provided by another vendor than the one forming the finished parts. Alternatively, the dual layer structure 36 may be formed during the process of forming the finished part if so desired.
The method continues with the steps 38 of feeding, indexing and aligning the dual layer structure 36. These steps are provided by the control mechanism 26. The step of feeding feeds the dual layer structure 36 through the machinL- 10 during the process of making the finished part. The molding process includes the steps of vacuum forming, loading, injecting the nonconductive material, ejecting the finished part and removing the carrier layer 31, as will be described hereinbelow. The step of indexing indexes the dual layer structure 36 through the machine 10 in incremental distances during the process of making the finished part. The step of aligning aligns the dual 4 CE00717R layer structure 36 with the vacuum mold 14 and the mold cavity 20 of the injection mold 16 and 18 of the machine 10 during the process of making the finished part. The steps 38 of feeding, indexing and aligning the dual layer structure 36 advantageously provide accurate positioning of the conductive layer 12 on the finished part during the automatic handling of the conductive layer 12 during the mold process. Accurate positioning of the conductive layer 12 on the finished part 27 increases the effectiveness of its shielding characteristics.
The method continues with the step 40 of vacuum forming the dual layer structure 36 with the vacuum forming mold 14 to produce a vacuum formed part 42 having a predetermined shape. The predetermine shape is close to but smaller than the predetermined shape of the finished part so that the vacuum formed part 42 can easily fit in the mold cavity 20 and allow space for additional material to be injection molded over the vacuum formed part 42. The vacuum forming mold 14 advantageously forms the dual layer structure 36 in a predetermined shape having extreme shapes and contours that would not be feasible if the forming of the dual layer structure 36 were performed in the injection mold 16 and 18 during the injection molding process.
The method continues with the step 44 of loading the vacuum formed part 42 into a mold cavity 20 of the machine 10 so that the non- conductive layer 32 faces a surface 46 of the mold cavity 20. The mold cavity 20 and the vacuum formed part 42 have substantially the same predetermined shape to permit the mold cavity 20 to receive the vacuum formed part 42.
The method continues with the step 48 of injecting the non conductive material 22, such as plastic resin, into the mold cavity 20 between the non-conductive layer 32 and a surface 50 of the mold cavity 20 to permit the nonconductive material 22 to bond to the non-conductive layer 32 to form a finished part 27 having the predetermined shape. In the preferred embodiment, the non-conductive material 22 forming the plastic resin is polycar'bonate. The finished part 27 has the non-conductive material 22 on an outer surface 52 of the finished part 27 and the conductive layer 12 on an inner surface 54 of the finished part 27.
The method continues with the step 56 of ejecting the finished part 27 from the mold cavity 20. The step 56 of ejecting is performed by opening the CE00717R mold cavity 20 and causing the finished part 27 to pop out of the mold cavity 20 in a conventional manner, such as with ejection pins, for example.
The method ends with the step 58 of removing the carrier layer 31 from the conductive layer 12 to remove the carrier layer 31 from the finished part 27. At this point, the finished part has completed the molding and shielding process. In the preferred embodiment, the finished part 27 is a top or bottom housing for a portable radiotelephone handset. Portable radiotelephone handset housings which may be manufactured in accordance with the method of the present invention are shown, for example, in U.S.
Patents D350,348 and b348,665. The conductive layer 12, forming the shielding surface, is advantageously applied without any masking operation or manual labor. Therefore, the processing time for the finished part is reduced which in turn substantially reduces the piece part cost of making the finished part 27. Further, the steps of steps 38 of feeding, indexing and aligning the dual layer structure 36 advantageously ensure that the conductive layer 12 is properly aligned with the non-conductive material 22 on the outer surface 52 of the finished part 27 to provide forconsistent effective shielding.
FIG. 3 is a cross-section view 58 of the substantially planar conductive layer 12 provided in accordance with the steps shown in the flow chart 28 of FIG. 2. The substantially planar conductive layer 12 is shown with the carrier layer 31 attached to the top side of the conductive layer 12. In the preferred embodiment, the carrier layer 31 is preferably made from polyester.
FIG. 4 is a cross-section view 60 of the planar conductive layer 12, shown in FIG. 3, applied to a planar non-conductive layer 32 in accordance with the steps shown in the flow chart 28 of FIG. 2. The substantially planar conductive layer 12 is shown with the carrier layer 31 still attached. In the preferred embodiment, the non-conductive layer 32 forming the plastic resin is polycarbonate.
FIG. 5 is a cross-section view 62 of the planar conductive layer 12, shown in FIG. 3, applied to the substantially planar non-conductive layer 32 and thereafter vacuum formed to create a vacuum formed part 42 in a predetermined shape in accordance with the steps shown in the flow chart 28 of FIG. 2. A portion of the vacuum mold 14 slightly separated from the vacuum formed part 42 is shown for reference. Note that the shape of the 6 CE00717R vacuum formed part 42 is arbitrary in. the present application and may take any desirable form.
FIG. 6 is a cross-section view 64 of the vacuum formed part 42 shown in FIG. 5 wherein the planar non-conductive layer 32 is overmolded with non-conductive material 22 using an injection molding process to produce a finished part 27 having the non-conductive outer layer 22 and the conductive inner layer 12 in accordance with the steps shown in the flow chart 28 of FIG. 2. A portion of the mold cavity 20 between the injection mold platens 16 and 18 is shown slightly removed from the finished part 27 for reference. Note that the shape of the finished part 27 is arbitrary in the present application and may take any desirable form.
FIG. 7 is a perspective view of an assembled housing 70 for a portable radiotelephone handset including a top housing 72 and a bottom housing 74. The top housing 72 and the bottom housing 74 are manufactured using the molding process of the present invention as described hereinabove to produce finished parts. The finished part 27 shown in FIG. 6 is representative of the top housing 72 or the bottom housing 74. In thepreferred embodiment of the present invention, the molding and shielding process of FIG. 2 is applied to manufacture the portable radiotelephone handset housing 70.
Claims (5)
- What is claimed is:7 CE00717R CLAIMS 1. A method for applying conductive shielding to a non-conductive molded part, comprising the steps of:providing a conductive layer which is substantially planar; forming the conductive layer to produce a formed part; loading the formed part into a mold cavity of a mold machine, the mold cavity and the formed part having a predetermined shape being substantially the same; injecting non-conductive material into the mold cavity between the conductive layer and a surface of the mold cavity to permit the non conductive material to bond to the conductive layer to form a finished part having the predetermined shape, the finished part having the non conductive material on an outer surface of the finished part which forms the non-conductive molded part and the conductive layer on an inner surface of the finished part which forms the conductive shielding; and ejecting the finished part from the mold cavity.
- 2. A method according to claim 1 further comprising the steps of:providing a non-conductive layer which is substantially planar; and applying the conductive layer to the non-conductive layer to form the formed part having a dual layer structure; wherein the step of loading further comprises the step of loading the formed part into the mold cavity of the mold machine so that the non conductive layer faces the surface of the mold cavity; and wherein the step of injecting further comprises the step of injecting the non-conductive material into the mold cavity between the non-conductive layer and the surface of the mold cavity to permit the non-conductive material to bond to the non-conductive layer to form the finished part having the predetermined shape, the finished part having the non conductive -material on the outer surface of the finished part and the conductive layer on an inner surface of the finished part.8 CE00717R
- 3. A method according to claim 1 or 2 further comprising the step of: feeding, indexing and aligning the conductive layer during the steps of providing forming, loading, injecting and ejecting.
- 4. A method according to claim 1, 2 or 3, wherein the step of forming further comprises the step of vacuum forming.
- 5. A method according to claim 1, 2, 3 or 4, further comprising the steps of:carrying the conductive layer on a carrier layer; and removing the carrier layer from the conductive layer after the step of ejecting is completed.9
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US74188796A | 1996-10-31 | 1996-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB9720010D0 GB9720010D0 (en) | 1997-11-19 |
| GB2318758A true GB2318758A (en) | 1998-05-06 |
Family
ID=24982617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9720010A Withdrawn GB2318758A (en) | 1996-10-31 | 1997-09-22 | Metod for applying conductive shielding to a non-conductive part |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPH10135680A (en) |
| KR (1) | KR100259950B1 (en) |
| CN (1) | CN1182346A (en) |
| BR (1) | BR9706688A (en) |
| DE (1) | DE19744176C2 (en) |
| GB (1) | GB2318758A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2360011A (en) * | 2000-03-10 | 2001-09-12 | Nokia Mobile Phones Ltd | A component with a metallic foil secured to an injection moulded substrate |
| WO2002026010A1 (en) * | 2000-09-25 | 2002-03-28 | Nolato Silikonteknik Ab | Method for manufacturing of housings |
| US9343939B2 (en) | 2010-12-23 | 2016-05-17 | General Electric Company | Electric motor structure to minimize electro-magnetic interference |
| EP3512322A1 (en) * | 2018-01-16 | 2019-07-17 | Amphenol - Air LB | Method for insulating a housing for electrical connection device against electromagnetic waves and housing obtained by implementing said method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6807731B2 (en) * | 2002-04-02 | 2004-10-26 | Delphi Technologies, Inc. | Method for forming an electronic assembly |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4171563A (en) * | 1977-05-20 | 1979-10-23 | U.S. Philips Corporation | Method of manufacturing an antenna reflector |
| JPS60132717A (en) * | 1983-12-21 | 1985-07-15 | Toshiba Chem Corp | Preparation of electromagnetic wave shielding case |
| EP0256499A2 (en) * | 1986-08-13 | 1988-02-24 | Showa Denko Kabushiki Kaisha | Method of preforming a cover member of can-shaped container |
| US4944908A (en) * | 1988-10-28 | 1990-07-31 | Eaton Corporation | Method for forming a molded plastic article |
| EP0521343A1 (en) * | 1991-06-24 | 1993-01-07 | Mitsubishi Denki Kabushiki Kaisha | Electronic device and its production method |
| WO1995034423A1 (en) * | 1994-06-14 | 1995-12-21 | Telefonaktiebolaget Lm Ericsson | Method of injection-moulding plastics for electrical shielding casings |
| GB2298387A (en) * | 1994-11-24 | 1996-09-04 | Nec Corp | Shielding enclosure made of plastics material |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US350348A (en) * | 1886-10-05 | Edwaed n | ||
| US348665A (en) * | 1886-09-07 | Demijohn |
-
1997
- 1997-09-22 GB GB9720010A patent/GB2318758A/en not_active Withdrawn
- 1997-10-07 BR BR9706688A patent/BR9706688A/en not_active IP Right Cessation
- 1997-10-07 DE DE19744176A patent/DE19744176C2/en not_active Expired - Fee Related
- 1997-10-15 JP JP9297738A patent/JPH10135680A/en active Pending
- 1997-10-30 CN CN97121264A patent/CN1182346A/en active Pending
- 1997-10-31 KR KR1019970057001A patent/KR100259950B1/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4171563A (en) * | 1977-05-20 | 1979-10-23 | U.S. Philips Corporation | Method of manufacturing an antenna reflector |
| JPS60132717A (en) * | 1983-12-21 | 1985-07-15 | Toshiba Chem Corp | Preparation of electromagnetic wave shielding case |
| EP0256499A2 (en) * | 1986-08-13 | 1988-02-24 | Showa Denko Kabushiki Kaisha | Method of preforming a cover member of can-shaped container |
| US4944908A (en) * | 1988-10-28 | 1990-07-31 | Eaton Corporation | Method for forming a molded plastic article |
| EP0521343A1 (en) * | 1991-06-24 | 1993-01-07 | Mitsubishi Denki Kabushiki Kaisha | Electronic device and its production method |
| WO1995034423A1 (en) * | 1994-06-14 | 1995-12-21 | Telefonaktiebolaget Lm Ericsson | Method of injection-moulding plastics for electrical shielding casings |
| GB2298387A (en) * | 1994-11-24 | 1996-09-04 | Nec Corp | Shielding enclosure made of plastics material |
Non-Patent Citations (1)
| Title |
|---|
| WPI Abstract Accession No. 85-207716/198534 & JP 60132717 A (TOSHIBA) 15.07.85 (see abstract) * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2360011A (en) * | 2000-03-10 | 2001-09-12 | Nokia Mobile Phones Ltd | A component with a metallic foil secured to an injection moulded substrate |
| GB2360011B (en) * | 2000-03-10 | 2004-08-11 | Nokia Mobile Phones Ltd | A component with a metallic foil secured to an injection moulded substrate |
| WO2002026010A1 (en) * | 2000-09-25 | 2002-03-28 | Nolato Silikonteknik Ab | Method for manufacturing of housings |
| US9343939B2 (en) | 2010-12-23 | 2016-05-17 | General Electric Company | Electric motor structure to minimize electro-magnetic interference |
| EP3512322A1 (en) * | 2018-01-16 | 2019-07-17 | Amphenol - Air LB | Method for insulating a housing for electrical connection device against electromagnetic waves and housing obtained by implementing said method |
| FR3076975A1 (en) * | 2018-01-16 | 2019-07-19 | Amphenol - Air Lb | METHOD OF INSULATING AN ELECTRICAL CONNECTION DEVICE HOUSING WITH RESPECT TO ELECTROMAGNETIC WAVES AND HOUSING OBTAINED BY CARRYING OUT SAID METHOD |
Also Published As
| Publication number | Publication date |
|---|---|
| DE19744176C2 (en) | 2001-02-15 |
| BR9706688A (en) | 1999-04-06 |
| DE19744176A1 (en) | 1998-05-07 |
| JPH10135680A (en) | 1998-05-22 |
| KR19980033374A (en) | 1998-07-25 |
| KR100259950B1 (en) | 2000-06-15 |
| CN1182346A (en) | 1998-05-20 |
| GB9720010D0 (en) | 1997-11-19 |
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