GB2313477B - Method of manufacturing a semiconductor device - Google Patents
Method of manufacturing a semiconductor deviceInfo
- Publication number
- GB2313477B GB2313477B GB9710491A GB9710491A GB2313477B GB 2313477 B GB2313477 B GB 2313477B GB 9710491 A GB9710491 A GB 9710491A GB 9710491 A GB9710491 A GB 9710491A GB 2313477 B GB2313477 B GB 2313477B
- Authority
- GB
- United Kingdom
- Prior art keywords
- manufacturing
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8125689A JPH09309256A (en) | 1996-05-21 | 1996-05-21 | Rotary stamping device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB9710491D0 GB9710491D0 (en) | 1997-07-16 |
| GB2313477A GB2313477A (en) | 1997-11-26 |
| GB2313477B true GB2313477B (en) | 2001-01-17 |
Family
ID=14916260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9710491A Expired - Fee Related GB2313477B (en) | 1996-05-21 | 1997-05-21 | Method of manufacturing a semiconductor device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH09309256A (en) |
| GB (1) | GB2313477B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3024589B2 (en) * | 1997-04-23 | 2000-03-21 | 日本電気株式会社 | Method for manufacturing semiconductor device |
| JP3233113B2 (en) * | 1998-11-11 | 2001-11-26 | 日本電気株式会社 | Method for manufacturing semiconductor device |
| US7963221B2 (en) | 2008-03-19 | 2011-06-21 | Clearsnap Holding, Inc. | Systems and methods for forming continuous ink images |
| WO2022204844A1 (en) | 2021-03-29 | 2022-10-06 | Yangtze Memory Technologies Co., Ltd. | Ladder annealing process for increasing polysilicon grain size in semiconductor device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5147826A (en) * | 1990-08-06 | 1992-09-15 | The Pennsylvania Research Corporation | Low temperature crystallization and pattering of amorphous silicon films |
| EP0521644A1 (en) * | 1991-06-21 | 1993-01-07 | Nec Corporation | Method of manufacturing polysilicon film |
-
1996
- 1996-05-21 JP JP8125689A patent/JPH09309256A/en active Pending
-
1997
- 1997-05-21 GB GB9710491A patent/GB2313477B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5147826A (en) * | 1990-08-06 | 1992-09-15 | The Pennsylvania Research Corporation | Low temperature crystallization and pattering of amorphous silicon films |
| EP0521644A1 (en) * | 1991-06-21 | 1993-01-07 | Nec Corporation | Method of manufacturing polysilicon film |
Also Published As
| Publication number | Publication date |
|---|---|
| GB9710491D0 (en) | 1997-07-16 |
| JPH09309256A (en) | 1997-12-02 |
| GB2313477A (en) | 1997-11-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20090521 |