GB2312073B - Method for manufacturing liquid crystal display - Google Patents
Method for manufacturing liquid crystal displayInfo
- Publication number
- GB2312073B GB2312073B GB9707017A GB9707017A GB2312073B GB 2312073 B GB2312073 B GB 2312073B GB 9707017 A GB9707017 A GB 9707017A GB 9707017 A GB9707017 A GB 9707017A GB 2312073 B GB2312073 B GB 2312073B
- Authority
- GB
- United Kingdom
- Prior art keywords
- liquid crystal
- crystal display
- manufacturing liquid
- manufacturing
- display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133345—Insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
- H10D30/0316—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/451—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by the compositions or shapes of the interlayer dielectrics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H10W20/056—
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133357—Planarisation layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0231—Manufacture or treatment of multiple TFTs using masks, e.g. half-tone masks
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960010414A KR100202231B1 (en) | 1996-04-08 | 1996-04-08 | A method for producting lcd device and structure of the lcd device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB9707017D0 GB9707017D0 (en) | 1997-05-28 |
| GB2312073A GB2312073A (en) | 1997-10-15 |
| GB2312073B true GB2312073B (en) | 1998-06-24 |
Family
ID=19455205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9707017A Expired - Lifetime GB2312073B (en) | 1996-04-08 | 1997-04-07 | Method for manufacturing liquid crystal display |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4023866B2 (en) |
| KR (1) | KR100202231B1 (en) |
| DE (1) | DE19714510C2 (en) |
| FR (1) | FR2747233B1 (en) |
| GB (1) | GB2312073B (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100223153B1 (en) * | 1996-05-23 | 1999-10-15 | 구자홍 | Manufacturing method of active matrix liquid crystal display device and active matrix liquid crystal display device |
| KR100251091B1 (en) * | 1996-11-29 | 2000-04-15 | 구본준 | Manufacturing method of liquid crystal display device and liquid crystal display device manufactured by the manufacturing method |
| JP3431128B2 (en) | 1998-08-05 | 2003-07-28 | シャープ株式会社 | Method for manufacturing semiconductor device |
| JP2000353809A (en) * | 1999-03-02 | 2000-12-19 | Semiconductor Energy Lab Co Ltd | Semiconductor device and manufacturing method thereof |
| US7821065B2 (en) | 1999-03-02 | 2010-10-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising a thin film transistor comprising a semiconductor thin film and method of manufacturing the same |
| GB2350204B (en) | 1999-05-21 | 2003-07-09 | Lg Philips Lcd Co Ltd | Liquid crystal display and fabrication method thereof |
| KR100317625B1 (en) * | 1999-05-25 | 2001-12-22 | 구본준, 론 위라하디락사 | A method for fabricating thin film transistor |
| KR100326881B1 (en) * | 1999-10-15 | 2002-03-13 | 구본준, 론 위라하디락사 | Liquid Crystal Display Device And Method Of Fabricating The Same |
| KR100752204B1 (en) * | 1999-12-28 | 2007-08-24 | 엘지.필립스 엘시디 주식회사 | LCD and its manufacturing method |
| DE10046411A1 (en) * | 2000-09-18 | 2002-03-28 | Philips Corp Intellectual Pty | Projection device with liquid crystal light modulator |
| US7256421B2 (en) | 2002-05-17 | 2007-08-14 | Semiconductor Energy Laboratory, Co., Ltd. | Display device having a structure for preventing the deterioration of a light emitting device |
| TWI238444B (en) | 2002-12-10 | 2005-08-21 | Seiko Epson Corp | Method for manufacturing optoelectronic device, optoelectronic device and electronic machine |
| KR100915864B1 (en) * | 2002-12-26 | 2009-09-07 | 엘지디스플레이 주식회사 | Manufacturing Method of Array Substrate for Liquid Crystal Display |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4636038A (en) * | 1983-07-09 | 1987-01-13 | Canon Kabushiki Kaisha | Electric circuit member and liquid crystal display device using said member |
| US4646424A (en) * | 1985-08-02 | 1987-03-03 | General Electric Company | Deposition and hardening of titanium gate electrode material for use in inverted thin film field effect transistors |
| EP0647965A1 (en) * | 1993-09-22 | 1995-04-12 | Dow Corning Corporation | Method of forming Si-O containing coatings |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5032883A (en) * | 1987-09-09 | 1991-07-16 | Casio Computer Co., Ltd. | Thin film transistor and method of manufacturing the same |
| JPH04257826A (en) * | 1991-02-13 | 1992-09-14 | Sharp Corp | Manufacture of active matrix substrate |
| JPH05210116A (en) * | 1992-01-31 | 1993-08-20 | Canon Inc | Liquid crystal display device |
| KR100292767B1 (en) * | 1992-09-25 | 2001-09-17 | 이데이 노부유끼 | LCD Display |
| DE69332142T2 (en) * | 1992-12-25 | 2003-03-06 | Sony Corp., Tokio/Tokyo | Active matrix substrate |
| JPH07302912A (en) * | 1994-04-29 | 1995-11-14 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
-
1996
- 1996-04-08 KR KR1019960010414A patent/KR100202231B1/en not_active Expired - Lifetime
-
1997
- 1997-04-02 JP JP09979597A patent/JP4023866B2/en not_active Expired - Lifetime
- 1997-04-07 GB GB9707017A patent/GB2312073B/en not_active Expired - Lifetime
- 1997-04-07 FR FR9704209A patent/FR2747233B1/en not_active Expired - Lifetime
- 1997-04-08 DE DE19714510A patent/DE19714510C2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4636038A (en) * | 1983-07-09 | 1987-01-13 | Canon Kabushiki Kaisha | Electric circuit member and liquid crystal display device using said member |
| US4646424A (en) * | 1985-08-02 | 1987-03-03 | General Electric Company | Deposition and hardening of titanium gate electrode material for use in inverted thin film field effect transistors |
| EP0647965A1 (en) * | 1993-09-22 | 1995-04-12 | Dow Corning Corporation | Method of forming Si-O containing coatings |
Non-Patent Citations (1)
| Title |
|---|
| IBM Technical Disclosure Bulletin, September 1982 vol.25 no. 4 pages 1885-1886 * |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2312073A (en) | 1997-10-15 |
| JPH1068970A (en) | 1998-03-10 |
| KR970071092A (en) | 1997-11-07 |
| DE19714510A1 (en) | 1997-11-06 |
| KR100202231B1 (en) | 1999-06-15 |
| FR2747233B1 (en) | 2000-09-15 |
| GB9707017D0 (en) | 1997-05-28 |
| DE19714510C2 (en) | 2000-05-25 |
| JP4023866B2 (en) | 2007-12-19 |
| FR2747233A1 (en) | 1997-10-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
| PE20 | Patent expired after termination of 20 years |
Expiry date: 20170406 |