GB2301224B - Method of forming a sog film in a semiconductor device - Google Patents

Method of forming a sog film in a semiconductor device

Info

Publication number: GB2301224B
Authority: GB; United Kingdom
Prior art keywords: forming; semiconductor device; sog film; sog; film
Prior art date: 1995-05-22
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

GB9610103A

Other versions

GB2301224A (en

GB9610103D0 (en

Inventor

Dong Sun Sheen

Min Jae Kim

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

SK Hynix Inc

Original Assignee

Hyundai Electronics Industries Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1995-05-22

Filing date

1996-05-15

Publication date

1999-07-14

1996-05-15 Application filed by Hyundai Electronics Industries Co Ltd filed Critical Hyundai Electronics Industries Co Ltd

1996-07-24 Publication of GB9610103D0 publication Critical patent/GB9610103D0/en

1996-11-27 Publication of GB2301224A publication Critical patent/GB2301224A/en

1999-07-14 Application granted granted Critical

1999-07-14 Publication of GB2301224B publication Critical patent/GB2301224B/en

2016-05-15 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H10P95/00—
- H10P14/60—

GB9610103A 1995-05-22 1996-05-15 Method of forming a sog film in a semiconductor device Expired - Fee Related GB2301224B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
KR1019950012711A KR0172539B1 (en)	1995-05-22	1995-05-22	S.O.Film Formation Method of Semiconductor Device

Publications (3)

Publication Number	Publication Date
GB9610103D0 GB9610103D0 (en)	1996-07-24
GB2301224A GB2301224A (en)	1996-11-27
GB2301224B true GB2301224B (en)	1999-07-14

Family

ID=19415020

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB9610103A Expired - Fee Related GB2301224B (en)	1995-05-22	1996-05-15	Method of forming a sog film in a semiconductor device

Country Status (6)

Country	Link
JP (1)	JPH08330301A (en)
KR (1)	KR0172539B1 (en)
CN (1)	CN1076869C (en)
DE (1)	DE19620677B4 (en)
GB (1)	GB2301224B (en)
TW (1)	TW299467B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR970052338A (en) *	1995-12-23	1997-07-29	김주용	Manufacturing method of semiconductor device
GB2322734A (en) *	1997-02-27	1998-09-02	Nec Corp	Semiconductor device and a method of manufacturing the same
KR100458081B1 (en) *	1997-06-26	2005-02-23	주식회사 하이닉스반도체	Via hole formation method of semiconductor device
KR100459686B1 (en) *	1997-06-27	2005-01-17	삼성전자주식회사	Fabrication method of contact hole for semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0529954A1 (en) *	1991-08-26	1993-03-03	Nec Corporation	Method for making a planarized semiconductor device
US5270267A (en) *	1989-05-31	1993-12-14	Mitel Corporation	Curing and passivation of spin on glasses by a plasma process wherein an external polarization field is applied to the substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2823878B2 (en) *	1989-03-09	1998-11-11	触媒化成工業株式会社	Method for manufacturing semiconductor integrated circuit
JPH04158519A (en) *	1990-10-22	1992-06-01	Seiko Epson Corp	Manufacturing method of semiconductor device
JPH0778816A (en) *	1993-06-30	1995-03-20	Kawasaki Steel Corp	Method for manufacturing semiconductor device

1995
- 1995-05-22 KR KR1019950012711A patent/KR0172539B1/en not_active Expired - Fee Related
1996
- 1996-05-04 TW TW085105671A patent/TW299467B/zh active
- 1996-05-15 GB GB9610103A patent/GB2301224B/en not_active Expired - Fee Related
- 1996-05-20 JP JP8124131A patent/JPH08330301A/en active Pending
- 1996-05-22 CN CN96110029A patent/CN1076869C/en not_active Expired - Fee Related
- 1996-05-22 DE DE19620677A patent/DE19620677B4/en not_active Expired - Fee Related

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5270267A (en) *	1989-05-31	1993-12-14	Mitel Corporation	Curing and passivation of spin on glasses by a plasma process wherein an external polarization field is applied to the substrate
EP0529954A1 (en) *	1991-08-26	1993-03-03	Nec Corporation	Method for making a planarized semiconductor device

Also Published As

Publication number	Publication date
CN1140898A (en)	1997-01-22
GB2301224A (en)	1996-11-27
GB9610103D0 (en)	1996-07-24
TW299467B (en)	1997-03-01
KR0172539B1 (en)	1999-03-30
JPH08330301A (en)	1996-12-13
KR960043018A (en)	1996-12-21
DE19620677B4 (en)	2007-06-14
CN1076869C (en)	2001-12-26
DE19620677A1 (en)	1996-11-28

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Legal Events

Date	Code	Title	Description
2011-01-26	PCNP	Patent ceased through non-payment of renewal fee	Effective date: 20100515