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GB2388711B - CPU Cooling apparatus with thermal pipe - Google Patents

CPU Cooling apparatus with thermal pipe

Info

Publication number
GB2388711B
GB2388711B GB0306123A GB0306123A GB2388711B GB 2388711 B GB2388711 B GB 2388711B GB 0306123 A GB0306123 A GB 0306123A GB 0306123 A GB0306123 A GB 0306123A GB 2388711 B GB2388711 B GB 2388711B
Authority
GB
United Kingdom
Prior art keywords
cooling apparatus
thermal pipe
cpu cooling
cpu
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB0306123A
Other versions
GB0306123D0 (en
GB2388711A (en
Inventor
Shih-Tsung Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shuttle Inc
Original Assignee
Shuttle Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shuttle Inc filed Critical Shuttle Inc
Publication of GB0306123D0 publication Critical patent/GB0306123D0/en
Publication of GB2388711A publication Critical patent/GB2388711A/en
Application granted granted Critical
Publication of GB2388711B publication Critical patent/GB2388711B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W40/73—
    • H10W40/43—
GB0306123A 2002-05-13 2003-03-18 CPU Cooling apparatus with thermal pipe Expired - Lifetime GB2388711B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW091206737U TW588823U (en) 2002-05-13 2002-05-13 CPU heat dissipation apparatus having heat conduction pipe

Publications (3)

Publication Number Publication Date
GB0306123D0 GB0306123D0 (en) 2003-04-23
GB2388711A GB2388711A (en) 2003-11-19
GB2388711B true GB2388711B (en) 2005-08-10

Family

ID=21688543

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0306123A Expired - Lifetime GB2388711B (en) 2002-05-13 2003-03-18 CPU Cooling apparatus with thermal pipe

Country Status (6)

Country Link
US (1) US6940717B2 (en)
JP (1) JP3096729U (en)
DE (1) DE20304206U1 (en)
FR (1) FR2839562B3 (en)
GB (1) GB2388711B (en)
TW (1) TW588823U (en)

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US20050006365A1 (en) * 2003-07-11 2005-01-13 Lincoln Global, Inc. Heat dissipation platform
DE10334798B4 (en) * 2003-07-30 2005-06-23 Fujitsu Siemens Computers Gmbh Arrangement for cooling heat-generating computer components
CN100343611C (en) * 2003-12-31 2007-10-17 奇鋐科技股份有限公司 Heat dissipation module and manufacturing method thereof
WO2005088429A2 (en) * 2004-03-09 2005-09-22 Curamik Electronics Gmbh Cooling system for electronic devices and device with such a cooling system
US20050257532A1 (en) * 2004-03-11 2005-11-24 Masami Ikeda Module for cooling semiconductor device
EP1591871A1 (en) * 2004-04-29 2005-11-02 Shuttle Inc. Heat dissipating structure for computer host
US20060032616A1 (en) * 2004-08-11 2006-02-16 Giga-Byte Technology Co., Ltd. Compound heat-dissipating device
JP4551729B2 (en) * 2004-09-30 2010-09-29 株式会社東芝 Cooling device and electronic device having cooling device
KR100766109B1 (en) * 2004-10-20 2007-10-11 엘지전자 주식회사 Heat shield
US7277282B2 (en) * 2004-12-27 2007-10-02 Intel Corporation Integrated circuit cooling system including heat pipes and external heat sink
CN100453955C (en) * 2005-01-07 2009-01-21 鸿富锦精密工业（深圳）有限公司 Heat pipe and manufacturing method thereof
US7219504B2 (en) * 2005-02-09 2007-05-22 Egbon Electronics Ltd. Heat dissipation system with an air compressing mechanism
US20060232928A1 (en) * 2005-04-19 2006-10-19 Vinson Wade D Heat sink for multiple components
CN100499089C (en) * 2005-06-08 2009-06-10 富准精密工业(深圳)有限公司 heat sink
KR100683412B1 (en) * 2005-06-11 2007-02-20 삼성전자주식회사 computer
US7100681B1 (en) * 2005-10-31 2006-09-05 Foxconn Technology Co., Ltd. Heat dissipation device having heat pipe
US7254023B2 (en) * 2005-11-01 2007-08-07 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipation assembly
US7447027B2 (en) * 2005-12-19 2008-11-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Hybrid heat dissipation device
US7942195B2 (en) * 2006-03-14 2011-05-17 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a bracket
US7520317B2 (en) * 2006-05-16 2009-04-21 Delphi Technologies, Inc Orientation insensitive compact thermosiphon with a remote auxiliary condenser
JP4719084B2 (en) * 2006-05-30 2011-07-06 株式会社東芝 Electronics
US20080082219A1 (en) * 2006-09-29 2008-04-03 Belady Christian L Heat sink system management
CN101242732B (en) * 2007-02-08 2011-01-05 鸿富锦精密工业（深圳）有限公司 Heat sink combination
US20100132924A1 (en) * 2007-04-27 2010-06-03 National University Of Singapore Cooling device for electronic components
US20090071628A1 (en) * 2007-09-13 2009-03-19 Forcecon Technology Co., Ltd. Heat-radiating device with composite radiation efficiency
US20100079950A1 (en) * 2008-10-01 2010-04-01 Asia Vital Components (Shen Zhen) Co., Ltd. Radiating Fin and Thermal Module Formed Therefrom
US8120913B2 (en) * 2009-06-29 2012-02-21 Rosemount Aerospace Inc. Methods and devices for forced air cooling of electronic flight bags
JP2016090080A (en) * 2014-10-30 2016-05-23 富士通株式会社 Cooling device and electronic device
CN107404257A (en) * 2017-08-25 2017-11-28 西安石油大学 A kind of CPU waste heat recoveries and dedusting consumption reducing device
CN112286325B (en) * 2020-11-20 2025-03-28 太仓欣华盈电子有限公司 External radiator for notebook computer

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US6343643B1 (en) * 1999-12-15 2002-02-05 Sun Microsystems, Inc. Cabinet assisted heat sink
JP2002261481A (en) * 2001-03-02 2002-09-13 Sanyo Electric Co Ltd Cooler for electronic component which generates heat

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US6288895B1 (en) * 1996-09-30 2001-09-11 Intel Corporation Apparatus for cooling electronic components within a computer system enclosure
DE29806082U1 (en) * 1998-04-02 1998-06-18 Ideal Electronics Inc., San Chung, Taipei Cooling device for a central processing unit
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JP3939868B2 (en) * 1998-12-07 2007-07-04 株式会社フジクラ Electronic element cooling structure
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US6394175B1 (en) * 2000-01-13 2002-05-28 Lucent Technologies Inc. Top mounted cooling device using heat pipes
US6212074B1 (en) 2000-01-31 2001-04-03 Sun Microsystems, Inc. Apparatus for dissipating heat from a circuit board having a multilevel surface
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US6407916B1 (en) * 2000-06-12 2002-06-18 Intel Corporation Computer assembly for cooling high powered microprocessors
US6328097B1 (en) * 2000-06-30 2001-12-11 Intel Corporation Integrated heat dissipation apparatus
US6404634B1 (en) 2000-12-06 2002-06-11 Hewlett-Packard Company Single piece heat sink for computer chip
US6418018B1 (en) * 2000-12-21 2002-07-09 Foxconn Precision Components Co., Ltd. Heat removal system
US7121327B2 (en) * 2000-12-28 2006-10-17 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly
US6621698B2 (en) * 2001-05-29 2003-09-16 Intel Corporation Computer assembly providing cooling for more than one electronic component
TW510532U (en) 2001-07-25 2002-11-11 Wen-Chen Wei Flexible heat tube structure
TW577578U (en) * 2001-08-24 2004-02-21 Uniwill Comp Corp Heat dissipation device of low flow resistance for notebook computer
JP3637304B2 (en) * 2001-11-29 2005-04-13 株式会社東芝 Small electronic equipment
US6480387B1 (en) 2002-03-14 2002-11-12 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly
US20030183373A1 (en) * 2002-03-28 2003-10-02 David Sarraf Video game console cooler
TW532717U (en) 2002-07-10 2003-05-11 Hon Hai Prec Ind Co Ltd A heat sink clip
TWM250191U (en) 2002-08-13 2004-11-11 Jiun-Fu Liou Fastening apparatus of heat dissipation module
US6704976B1 (en) 2002-08-27 2004-03-16 Wan-Tien Chen Fastener for a heat-radiator
TW539391U (en) 2002-09-17 2003-06-21 Hon Hai Prec Ind Co Ltd Fixing apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6343643B1 (en) * 1999-12-15 2002-02-05 Sun Microsystems, Inc. Cabinet assisted heat sink
JP2002261481A (en) * 2001-03-02 2002-09-13 Sanyo Electric Co Ltd Cooler for electronic component which generates heat

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
A. ALI, R. DEHOFF and K. GRUBB, Advanced heat pipe thermal solutions for higher power notebook computers, 1999. [retrieved on 2003-05-03]. Retrieved from the Internet: <URL:http://www.thermacore.com/pdfs/adv_hpt.pdf> *
Essentec website, product details for EST-Mt. BLANC [retrieved on 2003-05-07]. Reitrieved from the Internet: <URL:http://www.essentec.com/product-information/EST-HP-2127-MAG8025Z.htm> *

Also Published As

Publication number Publication date
JP3096729U (en) 2003-10-03
US6940717B2 (en) 2005-09-06
GB0306123D0 (en) 2003-04-23
FR2839562A3 (en) 2003-11-14
TW588823U (en) 2004-05-21
GB2388711A (en) 2003-11-19
DE20304206U1 (en) 2003-06-05
FR2839562B3 (en) 2004-04-02
US20040047126A1 (en) 2004-03-11

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20230317