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GB2232109B - Ceramic lid hermetic seal package structure and process. - Google Patents

Ceramic lid hermetic seal package structure and process.

Info

Publication number
GB2232109B
GB2232109B GB9012487A GB9012487A GB2232109B GB 2232109 B GB2232109 B GB 2232109B GB 9012487 A GB9012487 A GB 9012487A GB 9012487 A GB9012487 A GB 9012487A GB 2232109 B GB2232109 B GB 2232109B
Authority
GB
United Kingdom
Prior art keywords
package structure
hermetic seal
seal package
ceramic lid
lid hermetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9012487A
Other versions
GB9012487D0 (en
GB2232109A (en
Inventor
Robert C Byrne
Jon T Ewanich
Chee-Men Yu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/026,912 external-priority patent/US4769272A/en
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of GB9012487D0 publication Critical patent/GB9012487D0/en
Publication of GB2232109A publication Critical patent/GB2232109A/en
Application granted granted Critical
Publication of GB2232109B publication Critical patent/GB2232109B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/14—Soldering, e.g. brazing, or unsoldering specially adapted for soldering seams
    • B23K1/18—Soldering, e.g. brazing, or unsoldering specially adapted for soldering seams circumferential seams, e.g. of shells
    • H10W76/60—
    • H10W95/00—
    • H10W70/682—
    • H10W72/5522—
    • H10W72/5524—
    • H10W76/18—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
GB9012487A 1987-03-17 1990-06-05 Ceramic lid hermetic seal package structure and process. Expired - Fee Related GB2232109B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/026,912 US4769272A (en) 1987-03-17 1987-03-17 Ceramic lid hermetic seal package structure
GB8717887A GB2202479B (en) 1987-03-17 1987-07-28 Ceramic lid hermetic seal package structure and process

Publications (3)

Publication Number Publication Date
GB9012487D0 GB9012487D0 (en) 1990-07-25
GB2232109A GB2232109A (en) 1990-12-05
GB2232109B true GB2232109B (en) 1991-02-20

Family

ID=26292546

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9012487A Expired - Fee Related GB2232109B (en) 1987-03-17 1990-06-05 Ceramic lid hermetic seal package structure and process.

Country Status (1)

Country Link
GB (1) GB2232109B (en)

Also Published As

Publication number Publication date
GB9012487D0 (en) 1990-07-25
GB2232109A (en) 1990-12-05

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930728