GB2213999A - Repairing printed circuits - Google Patents
Repairing printed circuits Download PDFInfo
- Publication number
- GB2213999A GB2213999A GB8729494A GB8729494A GB2213999A GB 2213999 A GB2213999 A GB 2213999A GB 8729494 A GB8729494 A GB 8729494A GB 8729494 A GB8729494 A GB 8729494A GB 2213999 A GB2213999 A GB 2213999A
- Authority
- GB
- United Kingdom
- Prior art keywords
- laminate
- track
- prototype
- repair
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims abstract description 5
- 230000001681 protective effect Effects 0.000 claims abstract description 4
- 230000008439 repair process Effects 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000004048 modification Effects 0.000 claims description 2
- 238000012986 modification Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 3
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004922 lacquer Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Abstract
A laminate for repairing damaged sections of the conductive tracks of a printed circuit comprises a copper sheet (2) coated on one side with a solder layer (1) and on the other side with an adhesive layer (3) covered by a removable protective material (4). A suitably shaped piece of laminate is adhered to the printed circuit to cover a damaged section and then soldered to the ends of the undamaged parts of the track. The laminate may be used to construct prototype circuits. <IMAGE>
Description
ELECTRICAL CIRCUIT PROTOTYPE AND REPAIR KIT
This invention relates to Electrical Circuit Repairs and manufacture of Prototypes.
Electrical Circuits often suffer from accidental or operational related damage. At the present time repairs to circuit conductive tracks are time consuming, awkward and usually unsig-htly.
Currently, Prototype Circuits consisting of custom made conductive tracks, necessitate the etching and tinning of copper : clad fibre board, this causes delay and inflexibility of the finish Prototype.
According to the present invention, there is provided a selection of preformed conductive track circuit components.
Each component consists of adhesive based tinned copper.
These components can be applied to a suitably prepared surface to replace damaged circuits. Once pressed into position solder is floued over the joint to complete the repair. A suitable lacquer may be added to give insulation and extra security.
Manufacture of Prototype Electrical Circuits using this method allows maximum flexibility and ease of construction.
A specific embodiment of the invention uill now be described by way of example with reference-to the accompanying drawing in which :
Fig. 1. Shows in perspective a section of the laminated
material used in manufacture of the invention.
Fig. 2. Illustrates variations of form required for repair
and prototype of Electrical Circuit conductive
tracks.
Fig. 3. Shows an example of a damaged electrical
circuit conductive trace.
Fig. 4. Shows an electrical circuit after completion
of repair, using the invention.
Fig. 5. Shous an example of a Prototype Electrical
Circuit Board of Electrical Circuit Modification.
Referring to the drawing the laminate comprises of a copper sheet (2) With an adhesive base (3) Covered by a protective material (4). The surface of the laminate is solder coated. (1) The laminate in Fig. 1. is produced in a variety of forms
Fig. 2. The pad (5) The straight track (6). The pad and track combined (7) A curve (8) An edge connector (9) Or any required configuration.
A damaged electrical circuit track Fig. 3. has circuit sections (13) and (11) Broken, revealing the base board (12). To repair this damage an appropriate section of laminate, in this case a pad and track (7) and a straight track (6) are used. The damage area is cleaned and the appropriate laminate Fig. 2. selected. The protective material (4) Is removed and the selected laminate applied to the damaged area (11) and (13)
With an overlap (16) onto the original track (15). Solder is then flowed over the joint area (17) to form an electrical contact. A coating of lacquer can then be applied to insulate the repair and aid repair security.
A Prototype Electrical Circuit can be contructed Fig. 5. By using variations of the laminate (5)- (9) in the manner previously described.
Claims (1)
- CLAIMS (1) A laminate consisting of copper sheet backed by an adhesive which is covered by a protective sheet, the copper is coated on top with a solder layer.(2) A laminate is claimed in claim (1) manufacturered in shapes suitable for use in repair of electrical circuits.(3) A laminate as claimed in claim (1) and (2) manufactured in shapes suitable for use in Prototype and Modification of Electrical Circuits.(4) A laminate substantially as described herein with reference to Figs. 1. to 5. of the accompanying drawings.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8729494A GB2213999A (en) | 1987-12-18 | 1987-12-18 | Repairing printed circuits |
| PCT/GB1988/001095 WO1989006087A1 (en) | 1987-12-18 | 1988-12-12 | Improvements in or relating to the repair of electrical circuits |
| AU29028/89A AU2902889A (en) | 1987-12-18 | 1988-12-12 | Improvements in or relating to the repair of electrical circuits |
| GB8828967A GB2211668B (en) | 1987-12-18 | 1988-12-12 | Improvements in or relating to the repair of electrical circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8729494A GB2213999A (en) | 1987-12-18 | 1987-12-18 | Repairing printed circuits |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB8729494D0 GB8729494D0 (en) | 1988-02-03 |
| GB2213999A true GB2213999A (en) | 1989-08-23 |
Family
ID=10628662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8729494A Withdrawn GB2213999A (en) | 1987-12-18 | 1987-12-18 | Repairing printed circuits |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2213999A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5289632A (en) * | 1992-11-25 | 1994-03-01 | International Business Machines Corporation | Applying conductive lines to integrated circuits |
| GB2379557A (en) * | 2001-08-30 | 2003-03-12 | Agilent Technologies Inc | Flexible repair circuit |
| EP2858468A1 (en) * | 2013-10-04 | 2015-04-08 | Cartamundi Turnhout N.V. | Method and system for manufacturing a laminated sheet with a conductive pattern |
-
1987
- 1987-12-18 GB GB8729494A patent/GB2213999A/en not_active Withdrawn
Non-Patent Citations (1)
| Title |
|---|
| Practical El * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5289632A (en) * | 1992-11-25 | 1994-03-01 | International Business Machines Corporation | Applying conductive lines to integrated circuits |
| US5321886A (en) * | 1992-11-25 | 1994-06-21 | International Business Machines Corporation | Applying conductive lines to integrated circuits |
| GB2379557A (en) * | 2001-08-30 | 2003-03-12 | Agilent Technologies Inc | Flexible repair circuit |
| GB2379557B (en) * | 2001-08-30 | 2005-05-25 | Agilent Technologies Inc | Flexible repair circuit |
| EP2858468A1 (en) * | 2013-10-04 | 2015-04-08 | Cartamundi Turnhout N.V. | Method and system for manufacturing a laminated sheet with a conductive pattern |
Also Published As
| Publication number | Publication date |
|---|---|
| GB8729494D0 (en) | 1988-02-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |