GB2211662B - Multichip carriers - Google Patents
Multichip carriersInfo
- Publication number
- GB2211662B GB2211662B GB8829920A GB8829920A GB2211662B GB 2211662 B GB2211662 B GB 2211662B GB 8829920 A GB8829920 A GB 8829920A GB 8829920 A GB8829920 A GB 8829920A GB 2211662 B GB2211662 B GB 2211662B
- Authority
- GB
- United Kingdom
- Prior art keywords
- multichip
- carriers
- multichip carriers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H10W40/43—
-
- H10W70/668—
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB888800959A GB8800959D0 (en) | 1988-01-16 | 1988-01-16 | Multichip carriers |
| GB888828209A GB8828209D0 (en) | 1988-01-16 | 1988-12-02 | Multichip carriers |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8829920D0 GB8829920D0 (en) | 1989-02-15 |
| GB2211662A GB2211662A (en) | 1989-07-05 |
| GB2211662B true GB2211662B (en) | 1991-01-16 |
Family
ID=26293334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8829920A Expired - Fee Related GB2211662B (en) | 1988-01-16 | 1988-12-22 | Multichip carriers |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2211662B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8944151B2 (en) * | 2008-05-28 | 2015-02-03 | International Business Machines Corporation | Method and apparatus for chip cooling |
| US11158781B2 (en) | 2019-11-27 | 2021-10-26 | International Business Machines Corporation | Permanent wafer handlers with through silicon vias for thermalization and qubit modification |
| WO2025123306A1 (en) * | 2023-12-15 | 2025-06-19 | 潘勇 | Throttling refrigeration infrared detector, intelligent mold, and injection compression molding method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1500313A (en) * | 1974-05-30 | 1978-02-08 | Ibm | Micro-electronic modules |
| EP0285445A2 (en) * | 1987-04-01 | 1988-10-05 | Semiconductor Energy Laboratory Co., Ltd. | Electric circuit having superconducting multilayered structure and manufacturing method for same |
| DE3812662A1 (en) * | 1987-04-17 | 1988-10-27 | Hitachi Ltd | Semiconductor component with superconducting connections |
| EP0290271A2 (en) * | 1987-05-08 | 1988-11-09 | Fujitsu Limited | Superconducting circuit board and process of manufacturing it |
| EP0292125A1 (en) * | 1987-04-27 | 1988-11-23 | Fujitsu Limited | Multi-layer superconducting circuit substrate and process for manufacturing same |
-
1988
- 1988-12-22 GB GB8829920A patent/GB2211662B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1500313A (en) * | 1974-05-30 | 1978-02-08 | Ibm | Micro-electronic modules |
| EP0285445A2 (en) * | 1987-04-01 | 1988-10-05 | Semiconductor Energy Laboratory Co., Ltd. | Electric circuit having superconducting multilayered structure and manufacturing method for same |
| DE3812662A1 (en) * | 1987-04-17 | 1988-10-27 | Hitachi Ltd | Semiconductor component with superconducting connections |
| EP0292125A1 (en) * | 1987-04-27 | 1988-11-23 | Fujitsu Limited | Multi-layer superconducting circuit substrate and process for manufacturing same |
| EP0290271A2 (en) * | 1987-05-08 | 1988-11-09 | Fujitsu Limited | Superconducting circuit board and process of manufacturing it |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2211662A (en) | 1989-07-05 |
| GB8829920D0 (en) | 1989-02-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20051222 |