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GB2208569B - Method for connecting leadless chip packages and articles - Google Patents

Method for connecting leadless chip packages and articles

Info

Publication number
GB2208569B
GB2208569B GB8821709A GB8821709A GB2208569B GB 2208569 B GB2208569 B GB 2208569B GB 8821709 A GB8821709 A GB 8821709A GB 8821709 A GB8821709 A GB 8821709A GB 2208569 B GB2208569 B GB 2208569B
Authority
GB
United Kingdom
Prior art keywords
articles
leadless chip
chip packages
pads
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8821709A
Other versions
GB2208569A (en
GB8821709D0 (en
Inventor
Philip V Pesavento
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of GB8821709D0 publication Critical patent/GB8821709D0/en
Publication of GB2208569A publication Critical patent/GB2208569A/en
Application granted granted Critical
Publication of GB2208569B publication Critical patent/GB2208569B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H10W72/073—
    • H10W72/075—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/534—
    • H10W72/5363—
    • H10W72/5445—
    • H10W72/552—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/884—
    • H10W72/923—
    • H10W72/932—
    • H10W72/952—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

Leadless chip package (10) is adhesively secured to printed wiring board (14) and is electrically connected by metallic conductor ribbon or wire (40, 42, 44...) to pads (30, 32, 34, 36) on the package (10) and pads (16, 18, 20, 22...) on the printed wiring board (14) to provide secure connection.
GB8821709A 1987-01-21 1988-09-16 Method for connecting leadless chip packages and articles Expired - Fee Related GB2208569B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US571587A 1987-01-21 1987-01-21
PCT/US1988/000146 WO1988005428A1 (en) 1987-01-21 1988-01-21 Method for connecting leadless chip packages and articles

Publications (3)

Publication Number Publication Date
GB8821709D0 GB8821709D0 (en) 1988-11-16
GB2208569A GB2208569A (en) 1989-04-05
GB2208569B true GB2208569B (en) 1991-01-30

Family

ID=21717338

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8821709A Expired - Fee Related GB2208569B (en) 1987-01-21 1988-09-16 Method for connecting leadless chip packages and articles

Country Status (6)

Country Link
JP (1) JPH0719952B2 (en)
AU (1) AU611127B2 (en)
ES (1) ES2006054A6 (en)
GB (1) GB2208569B (en)
IL (1) IL85008A0 (en)
WO (1) WO1988005428A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2634616B1 (en) * 1988-07-20 1995-08-25 Matra METHOD FOR MOUNTING ELECTRONIC MICRO-COMPONENTS ON A SUPPORT AND PRODUCT REALIZABLE BY THE METHOD
US4996629A (en) * 1988-11-14 1991-02-26 International Business Machines Corporation Circuit board with self-supporting connection between sides
GB2283863A (en) * 1993-11-16 1995-05-17 Ibm Direct chip attach module
GB2344550A (en) 1998-12-09 2000-06-14 Ibm Pad design for electronic package
DE10018415C1 (en) 2000-04-03 2001-09-27 Schott Glas Connection between sensor terminal and conductor path applied to glass plate uses conductive connection element ultrasonically welded to conductor path
GB2362515B (en) * 2000-04-13 2003-09-24 Zeiss Stiftung Connection of a junction to an electrical conductor track on a plate
US7090098B2 (en) 2004-05-06 2006-08-15 Johnsondiversey, Inc. Metering and dispensing closure
CN102528266B (en) * 2010-12-24 2014-03-05 中国科学院深圳先进技术研究院 Welding Method of Circuit Leads of Ultrasonic Array Sound Head Element

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1252883A (en) * 1967-11-10 1971-11-10
US4225900A (en) * 1978-10-25 1980-09-30 Raytheon Company Integrated circuit device package interconnect means
US4320438A (en) * 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
US4423468A (en) * 1980-10-01 1983-12-27 Motorola, Inc. Dual electronic component assembly

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53134116A (en) * 1977-04-27 1978-11-22 Toyota Motor Corp Fuel feeder for internal combustion engine
JPS5521148A (en) * 1978-07-31 1980-02-15 Nichicon Capacitor Ltd Method of impregnating electrolytic capacitor
ZA826825B (en) * 1981-10-02 1983-07-27 Int Computers Ltd Devices for mounting integrated circuit packages on a printed circuit board
DE3328736A1 (en) * 1982-09-17 1984-03-22 Control Data Corp., 55440 Minneapolis, Minn. CIRCUIT BOARD
JPS603141A (en) * 1983-06-20 1985-01-09 Toshiba Corp Circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1252883A (en) * 1967-11-10 1971-11-10
US4225900A (en) * 1978-10-25 1980-09-30 Raytheon Company Integrated circuit device package interconnect means
US4320438A (en) * 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
US4423468A (en) * 1980-10-01 1983-12-27 Motorola, Inc. Dual electronic component assembly

Also Published As

Publication number Publication date
JPH01501990A (en) 1989-07-06
WO1988005428A1 (en) 1988-07-28
GB2208569A (en) 1989-04-05
GB8821709D0 (en) 1988-11-16
AU1184388A (en) 1988-08-10
JPH0719952B2 (en) 1995-03-06
AU611127B2 (en) 1991-06-06
ES2006054A6 (en) 1989-04-01
IL85008A0 (en) 1988-06-30

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19960121