GB2297648B - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- GB2297648B GB2297648B GB9601877A GB9601877A GB2297648B GB 2297648 B GB2297648 B GB 2297648B GB 9601877 A GB9601877 A GB 9601877A GB 9601877 A GB9601877 A GB 9601877A GB 2297648 B GB2297648 B GB 2297648B
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
- H10B12/318—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor the storage electrode having multiple segments
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019910015250A KR940009611B1 (en) | 1991-08-31 | 1991-08-31 | Capacitor Fabrication of Highly Integrated Semiconductor Devices Patterned Using Oxide Etch Masks (POEM Cells) |
| KR910021974 | 1991-11-30 | ||
| KR920003339 | 1992-02-29 | ||
| GB9218177A GB2259187B (en) | 1991-08-31 | 1992-08-26 | Semiconductor device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB9601877D0 GB9601877D0 (en) | 1996-04-03 |
| GB2297648A GB2297648A (en) | 1996-08-07 |
| GB2297648B true GB2297648B (en) | 1996-10-23 |
Family
ID=27450924
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9601877A Expired - Fee Related GB2297648B (en) | 1991-08-31 | 1992-08-26 | Semiconductor device |
| GB9521179A Expired - Fee Related GB2293690B (en) | 1991-08-31 | 1992-08-26 | Manufacturing method for a semiconductor device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9521179A Expired - Fee Related GB2293690B (en) | 1991-08-31 | 1992-08-26 | Manufacturing method for a semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| GB (2) | GB2297648B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5739060A (en) * | 1996-08-16 | 1998-04-14 | United Microelecrtronics Corporation | Method of fabricating a capacitor structure for a semiconductor memory device |
| DE19637389C1 (en) * | 1996-09-13 | 1997-10-16 | Siemens Ag | High packing density DRAM cell array production |
| JPH10229172A (en) * | 1997-01-06 | 1998-08-25 | Texas Instr Inc <Ti> | Method of forming lower electrode of dram-cell-stacked capacitor |
| NL1006113C2 (en) * | 1997-05-22 | 1998-11-25 | United Microelectronics Corp | Forming DRAM cell containing data storage capacitor, used for computer memory chips |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0443439A2 (en) * | 1990-02-23 | 1991-08-28 | INSTITUT FÜR HALBLEITERPHYSIK FRANKFURT (ODER) GmbH | One-transistor-storage cell device and method for making the same |
| GB2250377A (en) * | 1990-11-29 | 1992-06-03 | Samsung Electronics Co Ltd | Method for manufacturing a semiconductor device with villus type capacitor |
| GB2252447A (en) * | 1991-01-30 | 1992-08-05 | Samsung Electronics Co Ltd | Highly integrated semiconductor DRAM |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR910010043B1 (en) * | 1988-07-28 | 1991-12-10 | 한국전기통신공사 | Fine Line Width Formation Method Using Spacer |
| JPH0338061A (en) * | 1989-07-05 | 1991-02-19 | Fujitsu Ltd | Semiconductor memory |
| US5084405A (en) * | 1991-06-07 | 1992-01-28 | Micron Technology, Inc. | Process to fabricate a double ring stacked cell structure |
-
1992
- 1992-08-26 GB GB9601877A patent/GB2297648B/en not_active Expired - Fee Related
- 1992-08-26 GB GB9521179A patent/GB2293690B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0443439A2 (en) * | 1990-02-23 | 1991-08-28 | INSTITUT FÜR HALBLEITERPHYSIK FRANKFURT (ODER) GmbH | One-transistor-storage cell device and method for making the same |
| GB2250377A (en) * | 1990-11-29 | 1992-06-03 | Samsung Electronics Co Ltd | Method for manufacturing a semiconductor device with villus type capacitor |
| GB2252447A (en) * | 1991-01-30 | 1992-08-05 | Samsung Electronics Co Ltd | Highly integrated semiconductor DRAM |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2293690B (en) | 1996-06-19 |
| GB9601877D0 (en) | 1996-04-03 |
| GB2293690A (en) | 1996-04-03 |
| GB9521179D0 (en) | 1995-12-20 |
| GB2297648A (en) | 1996-08-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20100826 |