GB2291741B - Lightly doped drain field effect transistors - Google Patents
Lightly doped drain field effect transistorsInfo
- Publication number
- GB2291741B GB2291741B GB9515147A GB9515147A GB2291741B GB 2291741 B GB2291741 B GB 2291741B GB 9515147 A GB9515147 A GB 9515147A GB 9515147 A GB9515147 A GB 9515147A GB 2291741 B GB2291741 B GB 2291741B
- Authority
- GB
- United Kingdom
- Prior art keywords
- field effect
- effect transistors
- lightly doped
- doped drain
- drain field
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/023—Manufacture or treatment of FETs having insulated gates [IGFET] having multiple independently-addressable gate electrodes influencing the same channel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0223—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
- H10D30/0227—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate having both lightly-doped source and drain extensions and source and drain regions self-aligned to the sides of the gate, e.g. lightly-doped drain [LDD] MOSFET or double-diffused drain [DDD] MOSFET
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs
- H10D30/605—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs having significant overlap between the lightly-doped extensions and the gate electrode
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/611—Insulated-gate field-effect transistors [IGFET] having multiple independently-addressable gate electrodes influencing the same channel
-
- H10D64/01324—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
- H10D64/518—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their lengths or sectional shapes
-
- H10P50/667—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019940017957A KR960006004A (en) | 1994-07-25 | 1994-07-25 | Semiconductor device and manufacturing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB9515147D0 GB9515147D0 (en) | 1995-09-20 |
| GB2291741A GB2291741A (en) | 1996-01-31 |
| GB2291741B true GB2291741B (en) | 1998-07-22 |
Family
ID=19388729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9515147A Expired - Fee Related GB2291741B (en) | 1994-07-25 | 1995-07-24 | Lightly doped drain field effect transistors |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5559049A (en) |
| JP (1) | JP2774952B2 (en) |
| KR (1) | KR960006004A (en) |
| CN (1) | CN1041471C (en) |
| DE (1) | DE19527131B4 (en) |
| GB (1) | GB2291741B (en) |
Families Citing this family (61)
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| KR100274555B1 (en) * | 1991-06-26 | 2000-12-15 | 윌리엄 비. 켐플러 | Insulated gate field effect transistor and manufacturing the same |
| DE19548058C2 (en) * | 1995-12-21 | 1997-11-20 | Siemens Ag | Method of manufacturing a MOS transistor |
| US6376330B1 (en) | 1996-06-05 | 2002-04-23 | Advanced Micro Devices, Inc. | Dielectric having an air gap formed between closely spaced interconnect lines |
| US5814555A (en) | 1996-06-05 | 1998-09-29 | Advanced Micro Devices, Inc. | Interlevel dielectric with air gaps to lessen capacitive coupling |
| US5953626A (en) * | 1996-06-05 | 1999-09-14 | Advanced Micro Devices, Inc. | Dissolvable dielectric method |
| US5710054A (en) * | 1996-08-26 | 1998-01-20 | Advanced Micro Devices, Inc. | Method of forming a shallow junction by diffusion from a silicon-based spacer |
| US5994209A (en) * | 1996-11-13 | 1999-11-30 | Applied Materials, Inc. | Methods and apparatus for forming ultra-shallow doped regions using doped silicon oxide films |
| US5756384A (en) * | 1997-05-20 | 1998-05-26 | Vanguard International Semiconductor Corporation | Method of fabricating an EPROM cell with a high coupling ratio |
| US5869379A (en) * | 1997-12-08 | 1999-02-09 | Advanced Micro Devices, Inc. | Method of forming air gap spacer for high performance MOSFETS' |
| US6160316A (en) * | 1998-03-04 | 2000-12-12 | Advanced Micro Devices, Inc. | Integrated circuit utilizing an air gap to reduce capacitance between adjacent metal linewidths |
| KR100540477B1 (en) * | 1998-06-30 | 2006-03-17 | 주식회사 하이닉스반도체 | Gate electrode formation method of semiconductor device |
| US6107667A (en) * | 1998-09-10 | 2000-08-22 | Advanced Micro Devices, Inc. | MOS transistor with low-k spacer to suppress capacitive coupling between gate and source/drain extensions |
| IT1302282B1 (en) * | 1998-09-29 | 2000-09-05 | St Microelectronics Srl | MEMORY CELL INCLUDING EEPROM SELECTION TRANSISTOR THRESHOLD CONTENT REGULATED BY SYSTEM, AND RELATED PROCESS |
| US6037228A (en) * | 1999-02-12 | 2000-03-14 | United Microelectronics Corp. | Method of fabricating self-aligned contact window which includes forming a undoped polysilicon spacer that extends into a recess of the gate structure |
| US6274446B1 (en) | 1999-09-28 | 2001-08-14 | International Business Machines Corporation | Method for fabricating abrupt source/drain extensions with controllable gate electrode overlap |
| TW543102B (en) * | 2000-01-04 | 2003-07-21 | Taiwan Semiconductor Mfg | Manufacturing method of metal-oxide-semiconductor device |
| US6596598B1 (en) * | 2000-02-23 | 2003-07-22 | Advanced Micro Devices, Inc. | T-shaped gate device and method for making |
| US6326290B1 (en) * | 2000-03-21 | 2001-12-04 | Taiwan Semiconductor Manufacturing Company | Low resistance self aligned extended gate structure utilizing A T or Y shaped gate structure for high performance deep submicron FET |
| US6309933B1 (en) * | 2000-06-05 | 2001-10-30 | Chartered Semiconductor Manufacturing Ltd. | Method of fabricating T-shaped recessed polysilicon gate transistors |
| US6399469B1 (en) * | 2000-07-10 | 2002-06-04 | Advanced Micro Devices, Inc. | Fabrication of a notched gate structure for a field effect transistor using a single patterning and etch process |
| US6255202B1 (en) * | 2000-07-20 | 2001-07-03 | Advanced Micro Devices, Inc. | Damascene T-gate using a spacer flow |
| US7008832B1 (en) | 2000-07-20 | 2006-03-07 | Advanced Micro Devices, Inc. | Damascene process for a T-shaped gate electrode |
| US6319802B1 (en) * | 2000-07-20 | 2001-11-20 | Advanced Micro Devices, Inc. | T-gate formation using modified damascene processing with two masks |
| US6580136B2 (en) * | 2001-01-30 | 2003-06-17 | International Business Machines Corporation | Method for delineation of eDRAM support device notched gate |
| US6734510B2 (en) * | 2001-03-15 | 2004-05-11 | Micron Technology, Ing. | Technique to mitigate short channel effects with vertical gate transistor with different gate materials |
| US6482688B2 (en) * | 2001-03-30 | 2002-11-19 | Texas Instruments Incorporated | Utilizing amorphorization of polycrystalline structures to achieve T-shaped MOSFET gate |
| DE10247529A1 (en) | 2001-10-15 | 2003-06-05 | I2 Technologies Inc | Status machine implemented in computer for processing business objects involves generating graphs, which correspond to given co-operation business entity, using text files |
| DE10230696B4 (en) * | 2002-07-08 | 2005-09-22 | Infineon Technologies Ag | Method for producing a short channel field effect transistor |
| KR100454132B1 (en) * | 2002-09-09 | 2004-10-26 | 삼성전자주식회사 | Non-volatile memory device and method of forming the same |
| US6780694B2 (en) * | 2003-01-08 | 2004-08-24 | International Business Machines Corporation | MOS transistor |
| US6841826B2 (en) * | 2003-01-15 | 2005-01-11 | International Business Machines Corporation | Low-GIDL MOSFET structure and method for fabrication |
| US6806517B2 (en) * | 2003-03-17 | 2004-10-19 | Samsung Electronics Co., Ltd. | Flash memory having local SONOS structure using notched gate and manufacturing method thereof |
| US6710416B1 (en) * | 2003-05-16 | 2004-03-23 | Agere Systems Inc. | Split-gate metal-oxide-semiconductor device |
| US6846740B2 (en) * | 2003-06-14 | 2005-01-25 | Intel Corporation | Wafer-level quasi-planarization and passivation for multi-height structures |
| US7176041B2 (en) | 2003-07-01 | 2007-02-13 | Samsung Electronics Co., Ltd. | PAA-based etchant, methods of using same, and resultant structures |
| KR100686338B1 (en) * | 2003-11-25 | 2007-02-22 | 삼성에스디아이 주식회사 | Thin film transistor, manufacturing method thereof and flat panel display device using same |
| KR100557531B1 (en) * | 2004-03-11 | 2006-03-03 | 주식회사 하이닉스반도체 | Semiconductor device and manufacturing method thereof |
| KR100629646B1 (en) | 2004-08-12 | 2006-09-29 | 삼성전자주식회사 | Gate Structure and Method of manufacturing the same |
| JP4836427B2 (en) * | 2004-09-28 | 2011-12-14 | ルネサスエレクトロニクス株式会社 | Semiconductor device and manufacturing method thereof |
| WO2006054148A1 (en) * | 2004-11-16 | 2006-05-26 | Acco | An integrated ultra-wideband (uwb) pulse generator |
| US20060223293A1 (en) * | 2005-04-01 | 2006-10-05 | Raytheon Company | Semiconductor devices having improved field plates |
| KR100590821B1 (en) * | 2005-05-13 | 2006-06-19 | 금호석유화학 주식회사 | Styrene-based synthetic resin composition for environment-friendly window and door materials |
| KR100699843B1 (en) * | 2005-06-09 | 2007-03-27 | 삼성전자주식회사 | Morse field effect transistor with trench isolation region and manufacturing method |
| US8008731B2 (en) * | 2005-10-12 | 2011-08-30 | Acco | IGFET device having a RF capability |
| US7534706B2 (en) * | 2006-02-06 | 2009-05-19 | Freescale Semiconductor, Inc. | Recessed poly extension T-gate |
| KR100788362B1 (en) * | 2006-12-19 | 2008-01-02 | 동부일렉트로닉스 주식회사 | MOSFET device and method of forming the same |
| US7981745B2 (en) * | 2007-08-30 | 2011-07-19 | Spansion Llc | Sacrificial nitride and gate replacement |
| US8928410B2 (en) | 2008-02-13 | 2015-01-06 | Acco Semiconductor, Inc. | Electronic circuits including a MOSFET and a dual-gate JFET |
| US7863645B2 (en) * | 2008-02-13 | 2011-01-04 | ACCO Semiconductor Inc. | High breakdown voltage double-gate semiconductor device |
| US9240402B2 (en) | 2008-02-13 | 2016-01-19 | Acco Semiconductor, Inc. | Electronic circuits including a MOSFET and a dual-gate JFET |
| US7969243B2 (en) | 2009-04-22 | 2011-06-28 | Acco Semiconductor, Inc. | Electronic circuits including a MOSFET and a dual-gate JFET |
| US8264048B2 (en) * | 2008-02-15 | 2012-09-11 | Intel Corporation | Multi-gate device having a T-shaped gate structure |
| KR101458957B1 (en) * | 2008-06-17 | 2014-11-10 | 삼성전자주식회사 | Select transistor and method of manufacturing the same |
| US7808415B1 (en) * | 2009-03-25 | 2010-10-05 | Acco Semiconductor, Inc. | Sigma-delta modulator including truncation and applications thereof |
| US7952431B2 (en) * | 2009-08-28 | 2011-05-31 | Acco Semiconductor, Inc. | Linearization circuits and methods for power amplification |
| US8532584B2 (en) | 2010-04-30 | 2013-09-10 | Acco Semiconductor, Inc. | RF switches |
| US9812449B2 (en) | 2015-11-20 | 2017-11-07 | Samsung Electronics Co., Ltd. | Multi-VT gate stack for III-V nanosheet devices with reduced parasitic capacitance |
| WO2017163356A1 (en) * | 2016-03-24 | 2017-09-28 | 国立大学法人九州大学 | Laser doping device and semiconductor device manufacturing method |
| CN110379851B (en) * | 2019-06-17 | 2023-01-10 | 宁波大学 | A Three-Input Majority Logic Device Based on TFET |
| CN110534563B (en) * | 2019-07-16 | 2020-09-18 | 北京大学 | A kind of transistor with self-aligned feedback gate and preparation method thereof |
| CN112666728B (en) * | 2019-10-15 | 2023-06-20 | 苏州旭创科技有限公司 | an electro-optic modulator |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993009567A1 (en) * | 1991-10-31 | 1993-05-13 | Vlsi Technology, Inc. | Auxiliary gate lightly doped drain (agldd) structure with dielectric sidewalls |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8527062D0 (en) * | 1985-11-02 | 1985-12-04 | Plessey Co Plc | Mos transistor manufacture |
| JPS6344770A (en) * | 1986-08-12 | 1988-02-25 | Mitsubishi Electric Corp | Field effect transistor and manufacture of the same |
| KR970003903B1 (en) * | 1987-04-24 | 1997-03-22 | Hitachi Mfg Kk | Semiconductor device and fabricating method thereof |
| JPS6481268A (en) * | 1987-09-22 | 1989-03-27 | Yokogawa Electric Corp | Manufacture of semiconductor device |
| JP2667857B2 (en) * | 1988-02-12 | 1997-10-27 | 株式会社日立製作所 | Semiconductor device and manufacturing method thereof |
| JPH07120721B2 (en) * | 1988-02-19 | 1995-12-20 | 三菱電機株式会社 | Nonvolatile semiconductor memory device |
| US5272100A (en) * | 1988-09-08 | 1993-12-21 | Mitsubishi Denki Kabushiki Kaisha | Field effect transistor with T-shaped gate electrode and manufacturing method therefor |
| US5024959A (en) * | 1989-09-25 | 1991-06-18 | Motorola, Inc. | CMOS process using doped glass layer |
| US5172200A (en) * | 1990-01-12 | 1992-12-15 | Mitsubishi Denki Kabushiki Kaisha | MOS memory device having a LDD structure and a visor-like insulating layer |
| JP3131436B2 (en) * | 1990-02-26 | 2001-01-31 | 株式会社東芝 | Method for manufacturing semiconductor device |
| JP2548994B2 (en) * | 1990-03-19 | 1996-10-30 | 富士通株式会社 | Field effect transistor and method of manufacturing the same |
| US5210435A (en) * | 1990-10-12 | 1993-05-11 | Motorola, Inc. | ITLDD transistor having a variable work function |
| JPH04313238A (en) * | 1991-04-10 | 1992-11-05 | Oki Electric Ind Co Ltd | Semiconductor device |
-
1994
- 1994-07-25 KR KR1019940017957A patent/KR960006004A/en not_active Ceased
-
1995
- 1995-07-24 JP JP7186755A patent/JP2774952B2/en not_active Expired - Fee Related
- 1995-07-24 GB GB9515147A patent/GB2291741B/en not_active Expired - Fee Related
- 1995-07-25 US US08/507,668 patent/US5559049A/en not_active Expired - Fee Related
- 1995-07-25 CN CN95115080A patent/CN1041471C/en not_active Expired - Fee Related
- 1995-07-25 DE DE19527131A patent/DE19527131B4/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993009567A1 (en) * | 1991-10-31 | 1993-05-13 | Vlsi Technology, Inc. | Auxiliary gate lightly doped drain (agldd) structure with dielectric sidewalls |
Also Published As
| Publication number | Publication date |
|---|---|
| DE19527131A1 (en) | 1996-02-01 |
| US5559049A (en) | 1996-09-24 |
| DE19527131B4 (en) | 2007-04-12 |
| CN1123957A (en) | 1996-06-05 |
| JPH0846201A (en) | 1996-02-16 |
| GB2291741A (en) | 1996-01-31 |
| KR960006004A (en) | 1996-02-23 |
| CN1041471C (en) | 1998-12-30 |
| JP2774952B2 (en) | 1998-07-09 |
| GB9515147D0 (en) | 1995-09-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20070724 |