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GB2285337B - Manufacture of semiconductor device with aluminium wiring - Google Patents

Manufacture of semiconductor device with aluminium wiring

Info

Publication number
GB2285337B
GB2285337B GB9426148A GB9426148A GB2285337B GB 2285337 B GB2285337 B GB 2285337B GB 9426148 A GB9426148 A GB 9426148A GB 9426148 A GB9426148 A GB 9426148A GB 2285337 B GB2285337 B GB 2285337B
Authority
GB
United Kingdom
Prior art keywords
manufacture
semiconductor device
aluminium wiring
aluminium
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9426148A
Other versions
GB2285337A (en
GB9426148D0 (en
Inventor
Yasushige Abe
Fumihiko Akaboshi
Katsunori Shimizu
Tetsuo Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5336321A external-priority patent/JPH07201854A/en
Priority claimed from JP6029666A external-priority patent/JPH07240412A/en
Priority claimed from JP6048848A external-priority patent/JPH07263414A/en
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to GB9513748A priority Critical patent/GB2290907B/en
Publication of GB9426148D0 publication Critical patent/GB9426148D0/en
Publication of GB2285337A publication Critical patent/GB2285337A/en
Application granted granted Critical
Publication of GB2285337B publication Critical patent/GB2285337B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/18—Metallic material, boron or silicon on other inorganic substrates
    • C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
    • H10W20/01—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
GB9426148A 1993-12-28 1994-12-23 Manufacture of semiconductor device with aluminium wiring Expired - Fee Related GB2285337B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9513748A GB2290907B (en) 1993-12-28 1994-12-23 Manufacture of semiconductor device with aluminium wiring

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP5336321A JPH07201854A (en) 1993-12-28 1993-12-28 Method for manufacturing semiconductor device
JP6029666A JPH07240412A (en) 1994-02-28 1994-02-28 Method for manufacturing semiconductor device
JP6048848A JPH07263414A (en) 1994-03-18 1994-03-18 Method for manufacturing semiconductor device

Publications (3)

Publication Number Publication Date
GB9426148D0 GB9426148D0 (en) 1995-02-22
GB2285337A GB2285337A (en) 1995-07-05
GB2285337B true GB2285337B (en) 1997-12-17

Family

ID=27286680

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9426148A Expired - Fee Related GB2285337B (en) 1993-12-28 1994-12-23 Manufacture of semiconductor device with aluminium wiring

Country Status (3)

Country Link
KR (1) KR0168890B1 (en)
FR (1) FR2714527A1 (en)
GB (1) GB2285337B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990059076A (en) * 1997-12-30 1999-07-26 김영환 How to prevent corrosion of metal wiring in semiconductor devices

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0301565A2 (en) * 1987-07-31 1989-02-01 Kabushiki Kaisha Toshiba Semiconductor device comprising a wiring layer
EP0499249A2 (en) * 1991-02-14 1992-08-19 Fujitsu Limited Method of producing a semiconductor device including a barrier layer

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2634317A1 (en) * 1988-07-12 1990-01-19 Philips Nv METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING AT LEAST ONE CONTACT LEVEL THROUGH SMALL DIMENSION CONTACT OPENINGS
US4994162A (en) * 1989-09-29 1991-02-19 Materials Research Corporation Planarization method
JPH03262127A (en) * 1990-03-13 1991-11-21 Oki Electric Ind Co Ltd Manufacture of semiconductor device
US5221403A (en) * 1990-07-20 1993-06-22 Tokyo Electron Limited Support table for plate-like body and processing apparatus using the table
JPH0484425A (en) * 1990-07-27 1992-03-17 Fujitsu Ltd Manufacture of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0301565A2 (en) * 1987-07-31 1989-02-01 Kabushiki Kaisha Toshiba Semiconductor device comprising a wiring layer
EP0499249A2 (en) * 1991-02-14 1992-08-19 Fujitsu Limited Method of producing a semiconductor device including a barrier layer

Also Published As

Publication number Publication date
GB2285337A (en) 1995-07-05
FR2714527A1 (en) 1995-06-30
GB9426148D0 (en) 1995-02-22
KR950021407A (en) 1995-07-26
KR0168890B1 (en) 1999-02-01

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20031223