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GB2280314B - A method of encapsulating a component - Google Patents

A method of encapsulating a component

Info

Publication number
GB2280314B
GB2280314B GB9413175A GB9413175A GB2280314B GB 2280314 B GB2280314 B GB 2280314B GB 9413175 A GB9413175 A GB 9413175A GB 9413175 A GB9413175 A GB 9413175A GB 2280314 B GB2280314 B GB 2280314B
Authority
GB
United Kingdom
Prior art keywords
encapsulating
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9413175A
Other versions
GB2280314A (en
GB9413175D0 (en
Inventor
Charles Richard Jarvis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avery Weigh Tronix Ltd
Original Assignee
GEC Avery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GEC Avery Ltd filed Critical GEC Avery Ltd
Publication of GB9413175D0 publication Critical patent/GB9413175D0/en
Publication of GB2280314A publication Critical patent/GB2280314A/en
Application granted granted Critical
Publication of GB2280314B publication Critical patent/GB2280314B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H10W74/01—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)
GB9413175A 1993-07-02 1994-06-30 A method of encapsulating a component Expired - Fee Related GB2280314B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB939313756A GB9313756D0 (en) 1993-07-02 1993-07-02 A method of encapsulating a component

Publications (3)

Publication Number Publication Date
GB9413175D0 GB9413175D0 (en) 1994-08-24
GB2280314A GB2280314A (en) 1995-01-25
GB2280314B true GB2280314B (en) 1997-04-16

Family

ID=10738221

Family Applications (2)

Application Number Title Priority Date Filing Date
GB939313756A Pending GB9313756D0 (en) 1993-07-02 1993-07-02 A method of encapsulating a component
GB9413175A Expired - Fee Related GB2280314B (en) 1993-07-02 1994-06-30 A method of encapsulating a component

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB939313756A Pending GB9313756D0 (en) 1993-07-02 1993-07-02 A method of encapsulating a component

Country Status (1)

Country Link
GB (2) GB9313756D0 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0187195A2 (en) * 1984-12-28 1986-07-16 Kabushiki Kaisha Toshiba Method of manufacturing a circuit module

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0187195A2 (en) * 1984-12-28 1986-07-16 Kabushiki Kaisha Toshiba Method of manufacturing a circuit module

Also Published As

Publication number Publication date
GB9313756D0 (en) 1993-08-18
GB2280314A (en) 1995-01-25
GB9413175D0 (en) 1994-08-24

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20010630