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GB2277295B - Encapsulation molding equipment and method - Google Patents

Encapsulation molding equipment and method

Info

Publication number
GB2277295B
GB2277295B GB9407839A GB9407839A GB2277295B GB 2277295 B GB2277295 B GB 2277295B GB 9407839 A GB9407839 A GB 9407839A GB 9407839 A GB9407839 A GB 9407839A GB 2277295 B GB2277295 B GB 2277295B
Authority
GB
United Kingdom
Prior art keywords
molding equipment
encapsulation molding
encapsulation
equipment
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9407839A
Other versions
GB9407839D0 (en
GB2277295A (en
Inventor
Horst Karl Neu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Neu Dynamics Corp
Original Assignee
Neu Dynamics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/052,545 external-priority patent/US5405255A/en
Application filed by Neu Dynamics Corp filed Critical Neu Dynamics Corp
Publication of GB9407839D0 publication Critical patent/GB9407839D0/en
Publication of GB2277295A publication Critical patent/GB2277295A/en
Application granted granted Critical
Publication of GB2277295B publication Critical patent/GB2277295B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14098—Positioning or centering articles in the mould fixing or clamping inserts having variable dimensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2673—Moulds with exchangeable mould parts, e.g. cassette moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
GB9407839A 1993-04-23 1994-04-20 Encapsulation molding equipment and method Expired - Fee Related GB2277295B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/052,545 US5405255A (en) 1992-11-24 1993-04-23 Encapsulaton molding equipment
US10833593A 1993-08-18 1993-08-18

Publications (3)

Publication Number Publication Date
GB9407839D0 GB9407839D0 (en) 1994-06-15
GB2277295A GB2277295A (en) 1994-10-26
GB2277295B true GB2277295B (en) 1995-05-03

Family

ID=26730733

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9407839A Expired - Fee Related GB2277295B (en) 1993-04-23 1994-04-20 Encapsulation molding equipment and method

Country Status (3)

Country Link
KR (1) KR100191736B1 (en)
GB (1) GB2277295B (en)
HK (1) HK140395A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5409362A (en) * 1992-11-24 1995-04-25 Neu Dynamics Corp. Encapsulation molding equipment
WO1995019251A1 (en) * 1994-01-13 1995-07-20 Citizen Watch Co., Ltd. Method of resin-sealing semiconductor devices
GB2323555B (en) * 1994-07-06 1999-01-13 Neu Dynamics Corp Encapsulation molding equipment
NL1002939C2 (en) * 1996-04-24 1997-10-28 Boschman Holding Bv The injection moulding of semiconductor circuits on a lead frame
US6319450B1 (en) * 1999-07-12 2001-11-20 Agere Systems Guardian Corp. Encapsulated circuit using vented mold
CN111421761B (en) * 2019-11-15 2022-03-25 上海阿莱德实业股份有限公司 An anti-deformation injection mold for plastic-coated gold products
CN111452305B (en) * 2020-05-29 2022-02-11 江苏华海诚科新材料股份有限公司 Large-particle testing mold for epoxy molding compound and testing method thereof
KR102498076B1 (en) * 2022-08-22 2023-02-10 에스피반도체통신 주식회사 Mold for semicondeutor chip

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1273589A (en) * 1968-08-15 1972-05-10 Texas Instruments Inc Plastics encapsulated semiconductor devices
US4332537A (en) * 1978-07-17 1982-06-01 Dusan Slepcevic Encapsulation mold with removable cavity plates
GB2189182A (en) * 1986-04-11 1987-10-21 Michio Osada Multiple plunger injection moulding apparatus
US4983111A (en) * 1987-07-20 1991-01-08 Mitsubishi Denki Kabushiki Kaisha Device for resin sealing semiconductor devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1273589A (en) * 1968-08-15 1972-05-10 Texas Instruments Inc Plastics encapsulated semiconductor devices
US4332537A (en) * 1978-07-17 1982-06-01 Dusan Slepcevic Encapsulation mold with removable cavity plates
GB2189182A (en) * 1986-04-11 1987-10-21 Michio Osada Multiple plunger injection moulding apparatus
US4983111A (en) * 1987-07-20 1991-01-08 Mitsubishi Denki Kabushiki Kaisha Device for resin sealing semiconductor devices

Also Published As

Publication number Publication date
HK140395A (en) 1995-09-15
KR100191736B1 (en) 1999-06-15
GB9407839D0 (en) 1994-06-15
GB2277295A (en) 1994-10-26

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20000420