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GB2267338A - Thermoelectric air conditioning - Google Patents

Thermoelectric air conditioning Download PDF

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Publication number
GB2267338A
GB2267338A GB9210868A GB9210868A GB2267338A GB 2267338 A GB2267338 A GB 2267338A GB 9210868 A GB9210868 A GB 9210868A GB 9210868 A GB9210868 A GB 9210868A GB 2267338 A GB2267338 A GB 2267338A
Authority
GB
United Kingdom
Prior art keywords
heat
fin assembly
cooler
air chamber
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9210868A
Other versions
GB9210868D0 (en
Inventor
Pen-Yen Chang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB9210868A priority Critical patent/GB2267338A/en
Publication of GB9210868D0 publication Critical patent/GB9210868D0/en
Publication of GB2267338A publication Critical patent/GB2267338A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0251—Removal of heat by a gas

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)

Abstract

A cooler fan comprising a semiconductor Peltier effect thermoelectric cooler 1 fastened in a hole on a partition wall 40 inside a housing 4 with a heat absorbing interface 10 thereof disposed in a cold air chamber 41 and a heat releasing interface 11 thereof disposed in a hot air chamber 41' a heat absorbing fin assembly 2 fastened in the cold air chamber and connected to the heat absorbing interface, a heat releasing fin assembly 3 fastened in the hot air chamber, a first fan means 5 to draw a current of air through the cold air chamber for cooling a closed outside space, a second fan 5' means to draw a current of air in cooling the hot air chamber. Gaps are sealed by asphalt thermal insulation. Filters 45 are provided. <IMAGE>

Description

COOLER FAN The present invention relates to a cooler fan which uses a semiconductor cooler to provide a cool current of air.
In hot days. electric fans and air conditioners are commonly used for coolin. However. an electric fan gives little help in cooling people when air temperature is very high. Although air conditioners are practical in function, they are commonly expensive. When in operation an air conditioner consumes much electric power supply and produces high noises. In recent years, there is known a cooler fan which produces a current of air blowing through a water container which contains cold water. When a current of air passes through the surface of the cold water in the water container, it is simultaneously cooled down by the cold water. However, this structure cooler fan is not satisfactory in use because the water contained in the water container may be warmed up to ambient temperature quickly.
The present invention has been accomplished under the aforesaid circumstances. It is therefore an object of the present invention to provide a cooler fan which is practical in use. It is another object of the present invention to provide a cooler fan which produces less noise and does not causes environmental pollution problem. It is still another object of the present invention to provide a cooler fan which is compact and light.
To achieve the above objects, a semiconductor cooler is used for transferring heat from one current of air to another without allowing them to mix. Two metal fin assemblies are respectively connected to the two opposite interfaces of the semiconductor cooler to accelerate the process of heat exchanging. Two electric fans are used to draw currents of air through the metal fin assemblies respectively. A transformer is provided to convert AC power supply into a 12V DC power supply for operating the electric fans and the semiconductor cooler.
An embodiment of the present invention will now be described by way of example with reference to the accompanying drawings in which: Fig. I is a sectional side view showing the internal arrangement of the preferred embodiment of the cooler fan of the present invention: Fig. 2 is an elevational view of the partition wall, the heat absorbing fin assembly and the heat releasing fin assembly: Fig. 3 is a cross section of the semiconductor cooler: and Fig. 4 is a cross section of the preferred embodiment of the cooler fan of the present invention showing that flows of air are drawn to pass through the heat absorbing fin assembly and the heat releasing fin assembly respectively.
Referring to the various drawings attached herewith, a detailed description of the structural features of "Cooler Fan" of the present invention is as follows: Referring to Fig. 1, the preferred embodiment of the present invention is generally comprised of a housing 4 divided into a cold air chamber 41 and a hot air chamber 41' by a partition wall 40. The partition wall 40 is preferably made of bakelite having a square hole (not shown) at the center. which receives a semiconductor cooler 1.
The semiconductor cooler 1. as shown in Fig. 3. is consisted of a plurality of n-type semiconductors and a plurality of ptype semiconductors alternatively connected together. When electrically connected, a phenomenon of temperature difference occurs in each semiconductor p-n junction. causing one interface (heat absorbing interface) 10 thereof to absorb heat and the other interface (heat releasing interface )11 thereof to release heat. This heat exchanging concept was disclosed in 1834 and employed for practical use in 1900.
When installed. the two opposite interfaces 10.11 are disposed in the cold and hot chambers 41.41' respectively.
Referring to Fig. 2 and seeing Fig. 1 again. there is a heat absorbing fin assembly 2 and a heat releasing fin assembly 3 fastened in the cold air chamber 41 and the hot air chamber 41' respectively. The heat absorbing and releasing fin assemblies 2,3, which are fastened to the partition wall 40 at two opposite sides by screw bolts 21.
have each at least one heat conductive contact wall 20 or 30 closely connected to the heat absorbing interface 10 or heat releasing interface 11 of the semiconductor cooler 1. The thickness of the partition wall 40 is thinner than the semiconductor cooler 1. and therefore the heat absorbing and releasing interfaces 10.11 of the semiconductor cooler 1 project out of the two opposite large faces of the partition wall 40 and closely contact the heat conductive contact walls 20,30 of the heat absorbing and releasing fin assemblies 2.3 respectively. As indicated. the heat absorbing and releasing interfaces 10.11 of the semiconductor 1 are extended out of the two opposite large faces of the partition wall 40 and connected to the heat conductive contact walls 20.30 of the heat absorbing and releasing fin assemblies 2.3 respectively, gaps (not shown) are maintained between the partition wall 40 and the heat absorbing and releasing interfaces 10,11. These gaps are sealed with heat insulating materials (for example, asphalt) 7,7'. By means of the arrangement of the heat insulating materials 7.7'.
heat in the hot air chamber 41' is prohibited from transmitting to the cold air chamber 41.
Referring to Fig. 2 again, the heat absorbing fin assembly 2 is comprised of a plurality of corrugated metal fins 22 welded together and vertically arranged in parallel with one another. These corrugated metal fins 22 greatly increases the total surface area of the heat absorbing fin assembly 2 and the retarding time of the flow of air passing therethrough for making heat exchange. The heat releasing fin assembly 3 is comprised of a plurality of flat metal fins 32 welded together and vertically arranged in parallel with one another. These flat metal fins 32 permit heat to be quickly carried away. In order to let heat to be transferred from the heat absorbing fin assembly 2 to the heat releasing fin assembly 3 and carried away from the heat releasing fin assembly 3 by a current of air efficiently, the size of the corrugated metal fins 22 is relatively smaller than the flat metal fins 32. Furthermore. the corrugated and flat metal fins 22.32 made be made of an aluminum allov.
so that the total weight of the cooler fan can be greatly reduced without affecting the performance of heat exchanging process.
Referring to Fig. 4 and seeing Fig. 1 again, a first electric fan 5 is fastened inside the cold air chamber 41 above the heat absorbing fin assembly 2 and controlled to draw a cold draft of air from an air intake port 42 into the cold air chamber 41 permitting it to be delivered out of the housing 4 through an outlet port 43. A second electric fan 5' is fastened inside the hot air chamber 41' below the heat releasing fin assembly 3 and controlled to draw a current of air from an air intake port 42' into the hot air chamber 41' permitting it to be delivered out of the housing 4 through an outlet port 43'. Wire gauze filters 45,45',45".45"' are respectively covered on the air intake and outlet ports 42.42',43. 43' to separate out impurities in air. A transformer 6 is fastened inside the hot air chamber 41' a the bottom and connected to AC power supply.
The transformer 6 turns AC power supply into a 12 DC power supply for the first and second electric fans 5,5'. Inside the hot air chamber 41', there are provided two curved guide boards 47,47' respectively connected between the heat releasing fin assembly 3 and the air intake and outlet ports 42',43' for guiding air through the heat releasing fin assembly 3. Inside the cold air chamber 41, there are fastened two foamed polyurethane lining boards 44,44' connected between the heat absorbing fin assembly 2 and the air intake and outlet ports 42,43 for guiding air through the heat absorbing fin assembly 2.
When in use, the semiconductor cooler 1 requires a starting current about 4.6 amperes to start. When started, the semiconductor cooler 1 consumes about 0.2 ampere for normal operation. Therefore, the cooler fan is very economic in power consumption. Because no compressor has been used in the cooler fan, the problem of noisy operation is eliminated.

Claims (10)

CLAIMS:
1. A cooler fan comprising a semiconductor cooler fastened in a hole on a partition wall inside a housing with a heat absorbing interface thereof disposed in a cold air chamber and a heat releasing interface thereof disposed in a hot air chamber, a heat absorbing fin assembly fastened in the cold air chamber and connected to the heat absorbing interface. a heat releasing fin assembly fastened in the hot air chamber, a fist fan means to draw a current of air through the cold air chamber for cooling a closed outside space, a second fan means to draw a current of air in cooling the hot air chamber.
2. The cooler fan according to claim 1. wherein said first and second air intake ports and said first and second air outlet ports are each covered with a wire gauze filter,
3. The cooler fan according to claim 1. wherein said semiconductor cooler is separated from said partition wall by a heat insulating material.
4. The cooler fan according to claim 1. wherein each heat conductive contact wall of said heat absorbing fin assembly or said heat releasing fin assembly is isolated from said partition wall by a heat insulating material.
5. The cooler fan according to claim 4. wherein said heat insulating material is covered over the outside surface of said partition wall.
6. The cooler fan according to claim 3 or 4.
wherein said heat insulating material is asphalt.
7. The cooler fan according to claim 1, wherein the total surface area of the metal fins of said heat releasing fin assembly is larger than the total surface area of the metal fins of said heat absorbing fin assembly.
8. The cooler fan according to claim 1, wherein said metal fins are respectively made from an aluminum alloy.
9. The cooler fan according to claim 1. wherein said power supply means is to provide a 12V DC power supply.
10.. A cooler fan comprising: a housin. said housing comprising a hot air chamber and a cold air chamber divided bv a partition wall. a first air intake port and a first air outlet port for guiding outside air through said cold air chamber. second air intake port and a second air outlet port for guiding outside air through said hot air chamber. said partition wall having a square opening through the center; a semiconductor cooler fastened in said square opening, said semiconductor cooler having a heat absorbing interface disposed in said cold air chamber and a heat releasing interface disposed in said hot air chamber: a heat absorbing fin assembly mounted on said partition wall and disposed inside said cold chamber, said heat absorbing fin assembly comprising at least one heat conductive contact wall respectively connected to said heat absorbing interface of said semiconductor cooler. and a plurality of parallel metal fins welded together and disposed in vertical direction: a heat releasing fin assembly mounted on said partition wall and disposed inside said hot chamber, said heat releasing fin assembly comprising at least one heat conductive wall respectively connected to said heat releasing interface of said semiconductor cooler. and a plurality of parallel metal fins welded together and disposed in vertical direction; a first fan means fastened inside said cold chamber above said heat absorbing fin assembly. said first fan means being to draw a current of air from said first air intake port toward said first air outlet port through said heat absorbing fin assembly; a second fan means fastened inside said hot chamber below said heat releasing fin assembly, said second fan means being to draw a current of air from said second air intake port toward said second air outlet port through said heat releasing fin assembly; and a power supply means to provide said first and second fan means with the necessary working voltage.
1t. A cooler fan substantially as hereinbefore described with reference to. and as illustrated in, the accompanying drawings.
GB9210868A 1992-05-21 1992-05-21 Thermoelectric air conditioning Withdrawn GB2267338A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9210868A GB2267338A (en) 1992-05-21 1992-05-21 Thermoelectric air conditioning

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9210868A GB2267338A (en) 1992-05-21 1992-05-21 Thermoelectric air conditioning

Publications (2)

Publication Number Publication Date
GB9210868D0 GB9210868D0 (en) 1992-07-08
GB2267338A true GB2267338A (en) 1993-12-01

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Family Applications (1)

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GB (1) GB2267338A (en)

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WO1997022486A1 (en) * 1995-12-15 1997-06-26 Climcon A/S A heat exchanger device for an air conditioning system
RU2167370C2 (en) * 1998-12-30 2001-05-20 АОЗТ НПП "Конверсмаш" Air-conditioning plant
RU2171955C1 (en) * 1999-12-28 2001-08-10 Панин Александр Андреевич Vehicle air conditioned
RU2177587C1 (en) * 2000-11-08 2001-12-27 Курносов Николай Ефимович Air-conditioner
EP0952017A3 (en) * 1998-04-22 2002-01-23 Climcon A/S A heat exchanger device for an air conditioning system
RU2190165C2 (en) * 2000-12-29 2002-09-27 Федеральное государственное унитарное предприятие Конструкторское бюро общего машиностроения им. В.П.Бармина Space object air thermostatting system
RU2202075C1 (en) * 2002-02-12 2003-04-10 Закрытое акционерное общество "Обитель" Ejection air conditioner
RU2208743C1 (en) * 2002-06-18 2003-07-20 Никитин Юрий Филиппович Device for breathing with atmospheric air present in human room
RU2213910C1 (en) * 2002-01-03 2003-10-10 Открытое акционерное общество "Пензенский завод коммунального машиностроения" Conditioner
RU2219441C2 (en) * 2001-12-21 2003-12-20 Канюков Владимир Николаевич Air conditioner
RU2227254C1 (en) * 2002-09-09 2004-04-20 Латыпов Салават Адегамович Air conditioner
RU2231717C2 (en) * 2002-09-24 2004-06-27 Открытое акционерное общество "Ракетно-космическая корпорация "Энергия" им. С.П.Королева" Method and device for ambient air cooling by closed cooling cycle
RU2235948C1 (en) * 2002-12-10 2004-09-10 Лебедев Дмитрий Пантелеймонович Decentralized combined microclimate system for livestock farming rooms
RU2247901C2 (en) * 2003-01-04 2005-03-10 Чепилко Степан Сергеевич Air conditioner
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US7231772B2 (en) 2001-02-09 2007-06-19 Bsst Llc. Compact, high-efficiency thermoelectric systems
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CN100378412C (en) * 2006-03-28 2008-04-02 王钦兵 Energy-saving green heating and cooling air conditioner
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US7847179B2 (en) 2005-06-06 2010-12-07 Board Of Trustees Of Michigan State University Thermoelectric compositions and process
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US7870745B2 (en) 2006-03-16 2011-01-18 Bsst Llc Thermoelectric device efficiency enhancement using dynamic feedback
US7870892B2 (en) 2004-05-10 2011-01-18 Bsst Llc Climate control method for hybrid vehicles using thermoelectric devices
US7926293B2 (en) 2001-02-09 2011-04-19 Bsst, Llc Thermoelectrics utilizing convective heat flow
US7932460B2 (en) 2001-10-24 2011-04-26 Zt Plus Thermoelectric heterostructure assemblies element
US7942010B2 (en) 2001-02-09 2011-05-17 Bsst, Llc Thermoelectric power generating systems utilizing segmented thermoelectric elements
US7946120B2 (en) 2001-02-09 2011-05-24 Bsst, Llc High capacity thermoelectric temperature control system
US7952015B2 (en) 2006-03-30 2011-05-31 Board Of Trustees Of Michigan State University Pb-Te-compounds doped with tin-antimony-tellurides for thermoelectric generators or peltier arrangements
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US8408012B2 (en) 2005-04-08 2013-04-02 Bsst Llc Thermoelectric-based heating and cooling system
US8490412B2 (en) 2001-08-07 2013-07-23 Bsst, Llc Thermoelectric personal environment appliance
US8613200B2 (en) 2008-10-23 2013-12-24 Bsst Llc Heater-cooler with bithermal thermoelectric device
US8631659B2 (en) 2006-08-02 2014-01-21 Bsst Llc Hybrid vehicle temperature control systems and methods
US8640466B2 (en) 2008-06-03 2014-02-04 Bsst Llc Thermoelectric heat pump
US8722222B2 (en) 2011-07-11 2014-05-13 Gentherm Incorporated Thermoelectric-based thermal management of electrical devices
US8795545B2 (en) 2011-04-01 2014-08-05 Zt Plus Thermoelectric materials having porosity
CN104251527A (en) * 2014-09-11 2014-12-31 青岛海尔空调器有限总公司 Heat exchanger and desktop air conditioner with same
CN104266286A (en) * 2014-09-11 2015-01-07 青岛海尔空调器有限总公司 Table top air conditioner
CN104266280A (en) * 2014-02-28 2015-01-07 海尔集团公司 Air blowing device
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Cited By (112)

* Cited by examiner, † Cited by third party
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