GB2266721A - Radiation curable compounds and compositions - Google Patents
Radiation curable compounds and compositions Download PDFInfo
- Publication number
- GB2266721A GB2266721A GB9206560A GB9206560A GB2266721A GB 2266721 A GB2266721 A GB 2266721A GB 9206560 A GB9206560 A GB 9206560A GB 9206560 A GB9206560 A GB 9206560A GB 2266721 A GB2266721 A GB 2266721A
- Authority
- GB
- United Kingdom
- Prior art keywords
- epoxy
- composition
- amine
- acrylate
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000203 mixture Substances 0.000 title claims description 119
- 230000005855 radiation Effects 0.000 title claims description 14
- 150000001875 compounds Chemical class 0.000 title description 7
- 239000004593 Epoxy Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 21
- 238000000576 coating method Methods 0.000 claims description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- 238000006243 chemical reaction Methods 0.000 claims description 18
- 239000002966 varnish Substances 0.000 claims description 16
- 239000000976 ink Substances 0.000 claims description 15
- 150000001412 amines Chemical class 0.000 claims description 14
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 12
- 125000003700 epoxy group Chemical group 0.000 claims description 10
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 9
- 239000000178 monomer Substances 0.000 claims description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 7
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 6
- 150000003335 secondary amines Chemical class 0.000 claims description 6
- 125000003277 amino group Chemical group 0.000 claims description 5
- 239000003086 colorant Substances 0.000 claims description 5
- 239000000049 pigment Substances 0.000 claims description 5
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 150000003512 tertiary amines Chemical class 0.000 claims description 4
- 239000003999 initiator Substances 0.000 claims description 3
- 238000005956 quaternization reaction Methods 0.000 claims description 3
- 150000003254 radicals Chemical class 0.000 claims description 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000975 dye Substances 0.000 claims description 2
- WPKYZIPODULRBM-UHFFFAOYSA-N azane;prop-2-enoic acid Chemical compound N.OC(=O)C=C WPKYZIPODULRBM-UHFFFAOYSA-N 0.000 claims 3
- 150000002118 epoxides Chemical class 0.000 claims 3
- POYODSZSSBWJPD-UHFFFAOYSA-N 2-methylprop-2-enoyloxy 2-methylprop-2-eneperoxoate Chemical compound CC(=C)C(=O)OOOC(=O)C(C)=C POYODSZSSBWJPD-UHFFFAOYSA-N 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 1
- 229920000554 ionomer Polymers 0.000 description 15
- 238000009472 formulation Methods 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 239000002253 acid Substances 0.000 description 8
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 7
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 5
- 125000005609 naphthenate group Chemical group 0.000 description 5
- 238000007761 roller coating Methods 0.000 description 5
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 4
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 4
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 4
- -1 ethyleneoxy groups Chemical group 0.000 description 4
- RTWNYYOXLSILQN-UHFFFAOYSA-N methanediamine Chemical compound NCN RTWNYYOXLSILQN-UHFFFAOYSA-N 0.000 description 4
- 238000006386 neutralization reaction Methods 0.000 description 4
- 229920001983 poloxamer Polymers 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000011541 reaction mixture Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002609 medium Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000151 polyglycol Polymers 0.000 description 2
- 239000010695 polyglycol Substances 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- 150000004072 triols Chemical class 0.000 description 2
- 239000000080 wetting agent Substances 0.000 description 2
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- ILBBNQMSDGAAPF-UHFFFAOYSA-N 1-(6-hydroxy-6-methylcyclohexa-2,4-dien-1-yl)propan-1-one Chemical compound CCC(=O)C1C=CC=CC1(C)O ILBBNQMSDGAAPF-UHFFFAOYSA-N 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical class C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 description 1
- JWTVQZQPKHXGFM-UHFFFAOYSA-N 2,5-dimethylhexane-2,5-diamine Chemical compound CC(C)(N)CCC(C)(C)N JWTVQZQPKHXGFM-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 description 1
- 229910002016 Aerosil® 200 Inorganic materials 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- XTUVJUMINZSXGF-UHFFFAOYSA-N N-methylcyclohexylamine Chemical compound CNC1CCCCC1 XTUVJUMINZSXGF-UHFFFAOYSA-N 0.000 description 1
- 206010067482 No adverse event Diseases 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000005700 Putrescine Substances 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 229940024874 benzophenone Drugs 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000007376 cm-medium Substances 0.000 description 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- FFXXIVNBXDNOSP-UHFFFAOYSA-N dimethoxymethane propane prop-2-enoic acid Chemical class C(C=C)(=O)O.C(C=C)(=O)O.C(C=C)(=O)O.CCC.COCOC.COCOC.COCOC FFXXIVNBXDNOSP-UHFFFAOYSA-N 0.000 description 1
- LAWOZCWGWDVVSG-UHFFFAOYSA-N dioctylamine Chemical compound CCCCCCCCNCCCCCCCC LAWOZCWGWDVVSG-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000012769 display material Substances 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 229940117927 ethylene oxide Drugs 0.000 description 1
- 238000007647 flexography Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 1
- KKIHZFRVYUJTHN-UHFFFAOYSA-N hexane-1,6-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OCCCCCCO KKIHZFRVYUJTHN-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- PXSXRABJBXYMFT-UHFFFAOYSA-N n-hexylhexan-1-amine Chemical compound CCCCCCNCCCCCC PXSXRABJBXYMFT-UHFFFAOYSA-N 0.000 description 1
- MFHKEJIIHDNPQE-UHFFFAOYSA-N n-nonylnonan-1-amine Chemical compound CCCCCCCCCNCCCCCCCCC MFHKEJIIHDNPQE-UHFFFAOYSA-N 0.000 description 1
- FSAJWMJJORKPKS-UHFFFAOYSA-N octadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C=C FSAJWMJJORKPKS-UHFFFAOYSA-N 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- JCRIVQIOJSSCQD-UHFFFAOYSA-N propylhexedrine Chemical compound CNC(C)CC1CCCCC1 JCRIVQIOJSSCQD-UHFFFAOYSA-N 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- WPPDXAHGCGPUPK-UHFFFAOYSA-N red 2 Chemical compound C1=CC=CC=C1C(C1=CC=CC=C11)=C(C=2C=3C4=CC=C5C6=CC=C7C8=C(C=9C=CC=CC=9)C9=CC=CC=C9C(C=9C=CC=CC=9)=C8C8=CC=C(C6=C87)C(C=35)=CC=2)C4=C1C1=CC=CC=C1 WPPDXAHGCGPUPK-UHFFFAOYSA-N 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
- C08F290/144—Polymers containing more than one epoxy group per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
- C08G59/1461—Unsaturated monoacids
- C08G59/1466—Acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1494—Polycondensates modified by chemical after-treatment followed by a further chemical treatment thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/10—Epoxy resins modified by unsaturated compounds
Landscapes
- Chemical & Material Sciences (AREA)
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- Health & Medical Sciences (AREA)
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Description
2266721 1 - RADIATION CURABLE COMPOUNDS AND COMPOSITIONS This invention
relates to radiation curable acrylates and methacrylates, and to compositions containing them.
It is well known to coat compositions containing oligomeric epoxy resins esterified with acrylate or methacrylate groups onto substrates and thereafter to Photocure the compositions. Various techniques have been used to apply the coatings, for example using roller coating or by lithographic or screen printing processes. However, since such coatings are essentially non-ionic, these compositions are usually difficult to remove from the coating equipment, it often being necessary to use strong and/or flammable solvents to remove them, for example cyclohexanone or methyl ethyl ketone. In addition, the weight of these hitherto proposed compositions applied in the coating process is usually adjusted by diluting the compositions with a monomer, but often at the expense of the gloss of the resultant photocured coatings.
According to the present invention there are provided water soluble, radiation curable epoxy acrylate and methacrylate 2-- oligomers.
The invention further provides radiation curable compositions comprising a water soluble oligomer in accordance with the invention, a mono and/or multifunctional monomer, and a photoinitiator.
Water soluble oligomers in accordance with the invention are preferably ionomeric, and they preferably include quaternary amino groups, these groups generally serving to impart solubility to the oligomer. Water soluble oligomers in accordance with the present invention are preferably produced by quaternizing the corresponding amine-cured epoxy acrylate or methacrylate, for example by reacting the amine-cured epoxy acrylate or methacrylate with an acid or a Lewis acid. The quaternization is preferably substantially complete, but some unquaternized amino groups can be present.
Particularly preferred water soluble, radiation curable oligomers in accordance with the present invention can be prepared by initially reacting a difunctional epoxy compound with acrylic or methacrylic acid, preferably reacting about 22 to 27 percent of the epoxy groups present in the difunctional epoxy compound. There-after the partially reacted epoxy acrylate or methacrylate is reacted with insufficient of a secondary amine to effect complete reaction of the remaining epoxy groups, and preferably to react about a further 22 to 27 percent of the epoxy groups present in the original difuncti onal epoxy compound. The product is then reacted with sufficient of a primary diamine to effect reaction of a further 22 to 27 percent of the epoxy groups originally present in the difunctional epoxy compound. The resulting product is then finally reacted with a secondary amine to quench unreacted epoxy groups and to prevent such unreacted epoxy groups from undergoing further reaction which would increase the molecular weight of the resulting oligomer. Finally, the substantially esterified epoxy oligomer is quaternized by reacting the resin with an acid, preferably acrylic or methacrylic acid.
Preferred difunctional epoxy compounds include reaction products of Bisphenol A, Bisphenol F or Bisphenol S with epichlorhydrin, in particular having a molecular weight in the range of from 350 to 700 (n=0 to 2), and polyglycol diepoxides with molecular weights in the same range.
Examples of secondary amines which can be used in either reaction step involving the use of such an amine include N,N-diethylamine, N,Ndipropylamine, N,N-di-UsopropyMamine, N,N-dibutylamine, N-(n-butyl)-N(tert-butyl)amine, N-ethylN-(n-butyMamine, N,N-di-(n-hexyl)amine, N,N-di(n-octyl)amine, N,N-di-(n-nonyl)amine, N-methyl-N-(n-octadecyMamine, N,Ndi-(n-dodecyMamine, 1-(cyclohexylmethyl)-N-methylN-ethylamine, N,Ndicyclohexylamine, N-methyl-N-cyclohexylamine, and mixtures thereof.
Examples of primary diamines which can be used include 1,2-diaminoethane, 1,3-diaminopropane, 1,4-diaminobutane, 1,6-diaminohexane, 2,5-dimethyl-2, 5-di-aminohexane, 1,7-diaminoheptane, 1,8-diaminooctane, 1,10-diaminodecane and poly-ethyleneoxide primary diamines, for example having a molecular weight of from 600 to 6000.
Quaternization can be effected by known methods, for example by reaction with an organic and/or an inorganic acid. In general the reaction will be effected to neutralize substantially all of the amino groups present in the epoxy resin following reaction with the various amines. Examples of acids which can be used include, orthophosphoric acid, methanesulfonic acid, p-toluene sulfonic acid, acetic acid, acrylic acid, methacrylic acid, maleic acid, and mixtures thereof.
If desired, a hydrophillic ultraviolet curable monomer and/or a watermiscible organic solvent can be present in addition to the secondary amine and the epoxy acrylate or methacrylate during the second reaction step.
Water soluble, radiation curable oligomers in accordance with the invention can be used as the sole binder in radiation curable varnish or lacquer formulations, or they can be used in compositions containing a colorant, e.g. a dry pigment or a dye, for example to form an ink.
Compositions of the present invention can be used to overcoat virgin or pre-printed paper or card stock, and they can be applied by a variety of techniques, for example by flexography, offset varnishing, rollercoating or screen printing. Furthermore, since the oligomers of the present invention are usually completely water-soluble, the equipment used can usually be cleaned using water alone, thereby avoiding or at least reducing the u;e of organic solvents.
The formulation used in any particular coating process will, in general, be adjusted to the particular process. Examples of coating processes which can be used include flexographic, offset varnish, rollercoating or screen processes.
In addition to the ability to clean up coating apparatus using water, compositions of the present invention have also shown good coatability, gloss and durability.
Compositions in accordance with the present invention preferably contain from 10 to 70 percent by weight of a water soluble, radiation curable oligomer in accordance with the present invention.
Examples of monomers which can be included in compositions of the present invention include straight and branched chain alkyl acrylates, e.g. isobornyl acrylate, iso-decyl acrylate, octadecyl acrylate, lauryl acrylate, stearyl acrylate or 1,6-hexanediol diacrylate; polyether diacrylates, e.g. polyethylene glycol diacrylates with four ethyleneoxy groups, alkyleneoxy diacrylates, e.g. triethylene glycol diacrylate, tripropylene glycol diacrlyate or propoxylated neopently glycol diacrylate; and acrylates of triols and alkoxy extended triols, e.g. trimethylol propane triacrylate. The mono- and multifunctional acrylate monomer is preferably present in an amount of from 20 to 80 percent based on the composition.
The photoinitiator should be capable of producing free radicals, preferably on irradiation with ultraviolet light. Examples of photoinitiators which can be used include diphenyl ketone, benzophenone, benzoin, benzoin ethyl ether, benzoin methyl ether, acyl phosphide oxides, thioxanthone, acyl ketones, and derivatives thereof. It is particularly preferred to use a mixture of diphenyl ketone and mixed acyl ketones in a ratio of about 2:1 as the photoinitiator in the Presence of a monofunctional tertiary amine, with the ratio of initiator to amine being about 2:1.
Compositions in accordance with the present invention preferably include a tertiary amine, such amines generally serving to increase the response time of the compositions to radiation curing, and in the case of clear varnish formulations surface bloom can be reduced or even avoided by their use.
compositions in accordance with the present invention in the form of varnishes can be used to produce a good gloss finish, for example to display cards, record sleeves, book jackets and other display and promotional materials. Compositions in the form of inks have been found of particular use in producing decorative and display materials, and these may in turn be over-varnished, preferably using a composition in accordance with the invention in the form of a varnish. When a colorant is present, it will usually represent from 1 to 30 percent by weight of the composition.
Compositions in accordance with the invention can include other materials, for example as are conventionally used in varnish and ink compositions. Such materials include, for example, flow controllers, e.g. poly-(butyl acrylates), silicone fluids, wetting agents and fumed silica.
Compositions in accordance with the present invention can be applied and cured using known methods, for example they can be applied by roller coating or screen printing. The compositions are preferably photocu'rable, especially by exposure to ultraviolet light.
The following Examples are given by way of illustration only. All parts are percentages by weight of the total compositions unless stated otherwise.
Example 1
180g of ethoxylated trimethylol propane triacrylate, 380g of polyglycol diepoxide (DER 736 - Dow Chemicals), 380g of - 7 '- Bisphenol A type diglycidyl ether (Araldite GY250 - Ciba Geigy), 6.6g of 2,6-di-(tert-butyl)-4-methylphenol and 1.32g of a 5% solution of chromium metal as the naphthenate in white spirit were charged to a 1 liter reaction flask. The mixture was sparged with dry air for 10 minutes and then heated to a temperature of 95-100'C. 72g of acrylic acid were then added to the mixture in six equal portions over a period of 30 minutes, and the mixture was then heated to 110'C and held at that temperature until the acid value of the mixture was less than 2mg KOH/g.
The mixture was cooled to a temperature of from 50 to 6CC, following which 129.4g of N,N-di-(n-butyl)amine were added in six equal portions over a period of 30 minutes.
After a further period of one hour at 6CC, 58g of 1,6-di-aminohexane were added in six equal portions over a period of 30 minutes. The mixture was then maintained at 6CC for a period of one hour.
120g of N,N-di-(n-butyl)amine were added, and the temperature of the mixture was increased to 80-C. This temperature was maintained until the epoxy value of the mixture remained constant, the amine value of the mixture at that stage being 112.7mg KOH/g. 190g of acrylic acid were added dropwise to effect neutralisation of 90% of the basic sites on the oligomer, 133g of nonylphenyl ethoxylate (surfactant Synperonic NP13) also being added to assist the aqueous solubility of the oligomer.
Example 2
178.2g of ethoxylated trimethylal propane triacrylate, 429.1g of Bisphenol A type diglycidyl ether (Araldite GY250 - Ciba 8 - Geigy), 4.45g of 2,6-di-(tert-butyl)-4-methylphenol and 0.89g of a 5% solution of chromium metal as the naphthenate in white spirit were charged to a 2 liter reaction flask. The mixture was agitated and sparged with dry air for 10 minuted before being heated to 95-100C. 40.6g of acrylic acid were then added in six equal portions over a period of 30 minutes, and the temperature of the mixture was raised to 110'C. These reaction conditions were maintained until the acid value of the mixture had fallen to less than 2mg KOH/g.
The reaction mixture was cooled to 50-60'C and 73.1g of N,N-di-(nbutyMamine were added in six equal portions over a period of 30 minutes. After a further hour at 60'C, 170g of a polyethylene oxide primary diamine (Jeffamine ED600 Texaco) were added in six equal portions over a period of 30 minutes. The temperature of the mixture was maintained at 600C for a further hour, following which 89.1g of N,N-di-(n-butyl)amine were added in six equal portions over a period of 30 minutes.
The mixture was then heated to 800C and maintained at that temperature until the epoxy value remained constant. The theoretical amine value of the oligomer was 94.45mg KOH/g. 118.1g of acrylic acid were added dropwise to effect neutralisation, 96.3g of surfactant (Synperonic NP13) having been added to aid dispersability.
Example 3
273g of ethoxylated glycerol triacrylate, 550g of Bisphenol A type diglycidyl ether (Araldite GY250 - Ciba Geigy), 5.9g of 2,6-di-(tertbutyl)4-methylphenol) and 1.18g of a 5% solution of chromium metal as the naphthenate in white spirit were charged to a 2 liter reaction flask. The mixture was 9 agitated and sparged with dry air for 10 minutes before being heated to 95-100'C. 52.1g of acrylic acid were then added in six equal portions over a period of 30 minutes, and the temperature of the mixture was raised to 1100C. These reaction conditions were maintained until the acid value of the mixture had fallen to less than 2mg KOH/g.
The reaction mixture was cooled.to 50-60'C and 73.1g of N,N-di-Usopropyl)amine were added in six equal portions over a period of 30 minutes. After a further hour at 6CC, 326g of a polyethylene oxide primary diamine (Jeffamine ED600 - Texaco) were added in six equal portions over a period of 30 minutes. The temperature of the mixture was maintained a 600C for a further hour, following which 89.2g of N,N-di-Uso-propyl)amine were added in six equal portions over a period of 30 minutes.
The mixture was then heated to 8CC and maintained at that temperature until the epoxy value remained constant. The theoretical amine value of the oligomer was 87.2mg KOH/g. 180.4g of acrylic acid were added dropwise to effect neutralisation, 136g of surfactant (Synperonic NP13) having been added to aid dispersability.
Example 4
178.2g of ethoxylated trimethylol propane triacrylate, 429.1g of Bisphenol A type diglycidyl ether (Araldite GY250 - Ciba Geigy) and 0.89g of a 5% solution of chromium metal as the naphthenate in white spirit were charged to a 2 liter reaction flask. The mixture was agitated and sparged with dry air for 10 minuted before being heated to 95-100C. 40.6g of acrylic acid were then added in six equal portions over a period of 30 minutes, and the temperature of the - 10 mixture was raised to 110C. These reaction conditions were maintained until the acid value of the mixture had fallen to less than 2mg KOH1g.
The reaction mixture was cooled to 55-60C and 73.1g of N,N-di-(nbutyMamine were added in six equal portions over a period of 30 minutes. After a further hour at 60'C, 170g of a polyethylene oxide primary diamine (Jeffamine ED600 Texaco) were added in six equal portions over a period of 30 minutes. The temperature of the mixture was maintained at 6CC for a further hour, following which 89.1g of N,N-di-(n-butyMamine were added in six equal portions over a period of 30 minutes.
The mixture was then heated to 80C and maintained at that temperature until the epoxy value remained constant. The theoretical amine value of the oligomer was 94.45mg KOH/g. The solubility of the oligomer in water was zero to negligible.
Example 5
424.7g of polyglycal diepoxide (DER 736 - Dow Chemicals), 252-2g of Bisphenol A type diglycidyl ether (Araldite GY250 Ciba Geigy), 208.7g of ethoxylated trimethylol propane triacrylate, 4.91g of 2,6-di-(tert-butyl)4-methylphenol) and 0.98g of a 5% solution of chromium metal as the naphthenate in white spirit were charged to a 2 liter reaction flask. The mixture was agitated and sparged with dry air for 10 minutes before being heated to 95-1000C. 95-6g of acrylic acid were then added in six equal portions over a period of 30 minutes, and the temperature of the mixture was raised to 110-C. These reaction conditions were maintained until the acid value of the mixture had fallen to less than 2mg KOH/g.
The reaction mixture was cooled to 50-60'C and 62.4g of 1,6-diaminohexane were added in six equal portions over a period of 30 minutes. After a further hour at 600C, the mixture was heated to 80C and maintained at that temperature until the epoxy value remained constant. The theoretical amine value of the oligomer was 44.6mg KOH/g. 52g of methacrylic acid were added dropwise to effect neutralisation, 104g of surfactant (Synperonic NP13) having previously been added. The solubility of the oligomer in water was zero to negligible.
Example 6
A varnish composition was prepared by mixing the following ingredients using a high speed mechanical stirrer:- Epoxy ionomer from Example 1 30 parts Tripropylene glycol diacrylate 61 parts Benzophenone (Blagdon Chemicals) 4 parts Tertiary amine (Photomer 4182 - Harcros Chemicals) 2 parts Wetting agent (Pentrone A4D - ABM Chemicals) 0.5 part Silicone fluid (F11111000 - ICI Chemicals) 2.5 parts This composition had a viscosity of 39 seconds as measured using a Ford No.4 cup.
Using a laboratory roller coating machine having a 35.6cm long and 10. 16cm diameter neoprene coating roller, this composition was applied to a preprinted medium weight card. The wet coating thickness was between 4 and 6 microns.
The coating on the card was cured using a conveyorized ultraviolet curing unit having two medium pressure mercury vapor lamps with a predominant output at a wavelength of 350nm and with a conveyer speed of 20m/min which e 5 uated with an energy level at the coating surface of 28OmJ/cm.
The card following curing of the coating exhibitdd a high level of gloss with excellent surface wetting and coatability without degradation of the original surface of the printed card, i.e. without discoloration, rewetting or smearing.
No adverse effects were noted during the._ coating process, for example in the form of spray, misting, fly.or droplet formation.
The coating equipment and accessories were easily cleaned of unused composition, and they were washed fully clean using ordinary tap water without the use of non-aqueous solvents or other agents.
Example 7
A varnish composition was prepared using the method of Example 6, the formulation being identical to that of Example 6 except that the epoxy ionomer was the product of Example 2. The composition had a viscosity of 35 seconds as measured using a Ford No.4 cup.
The composition was applied to printed card as described in Example 6, the results being comparable to those for the composition of Example 6.
Example 8
A varnish composition was prepared using the method of Example 6, the formulation being identical to that of Example 6 except that the epoxy ionomer was the product of Example 3. The composition had a viscosity of 44 seconds as measured using a Ford No.4 cup.
The composition was applied to printed card as described in Example 6, the results being comparable to those for the composition of Example 6.
Example 9
A varnish composition was prepared using the method of Example 6, the formulation being identical to that of Example 6 except that the tripropylene glycol diacrylate was replaced by a difunctional acrylate monomer (Photomer 4193 - Harcros Chemicals). The composition had a viscosity of 35 seconds as measured using a Ford No.4 cup.
The composition was applied to printed card as described in Example 6, the results being comparable to those for the composition of Example 6.
Example 10
A varnish composition was prepared using the method of Example 6, the formulation being identical to that of Example 6 except that the epoxy ionomer was the product of Example 2 and the tripropylene glycol diacrylate was replaced by a difunctional acrylate monomer (Photomer 4193 - Harcros Chemicals).
The composition was applied to printed card as described in Example 6, the results being comparable to those for the composition of Example 6.
- 14 Example 11
A varnish composition was prepared using the method of Example 6, the formulation being identical to that of Example 6 except that the epoxy ionomer was the product of Example 3 and the tripropylene glycol diacrylate was replaced by a difunctional acrylate monomer (Photomer 4193 - Harcros Chemicals). The composition had a viscosity of 38 seconds as measured by a Ford No.4 cup.
The composition was applied to printed card as described in Example 6, the results being comparable to those for the composition of Example 6.
Example 12
A varnish composition was prepared using the method of Example 6, the formulation being identical to that of Example 6 except that the epoxy ionomer was the product of Example 4. The composition had a viscosity of 38 seconds as measured by a Ford No.4 cup.
The composition was applied to printed card as described in Example 6. However, attempts to remove the composition from the coating apparatus with water or water/detergent mixtures were unsuccessful, milky deposits of the varnish being formed. Nonaqueous solvents had to be used to remove the composition.
Example 13
A varnish composition was prepared using the method of Example 6, the formulation being identical to that of Example 6 except that the epoxy ionomer was the product of Example 5.
- 15" - The composition had a viscosity of 38 seconds as measured by a Ford No.4 cup.
The composition was applied to printed card as described in Example 6. The results were comparable to those observed with the composition of Example 12.
Example 14
An ink composition was prepared by mixing the following ingredients, except the pigment, using a high speed disperser, and thereafter dispersing the pigment in the resulting mixture using a roller mill:Epoxy ionomer from Example 1 60 parts 1,6-di-Hydroxyhexane diacrylate 20 parts iso-Propyl thioxanthone (ex - IBIS) 10 parts Pigment Red 2 4 parts Fumed silica (Aerosil 200 - Degussa) 2 parts Flow controller (Multiflow Monsanto) 2 parts Silicone fluid (F11111000 - ICI Chemicals) 2 parts The resulting ink was printed by screen printing on to a medium weight art paper using a polyurethane squeegee and a 150 mesh screen in a Svecia semiautomatic flat bed printer. The resulting prints were cured by exposure to ultraviolet light from a pair of 8OW/cm medium pressure mercury vapor lamps having a s ectral output predominantly at 284 and 365nm to give 25OmJ/cm at the ink surface.
Adhesion, bleed and curl were assessed, as was the ease of wash-up, and the results are given in the accompanying Table.
- 16' - Example 15
An ink composition was prepared as described in Example 14, but with the epoxy ionomer of Example 1 being replaced by the epoxy ionomer of Example 2. The ink was used for printing and was cured as described in Example 14. The results achieved are given in the accompanying Table.
Example 16
An ink composition was prepared as described in Example 14, but with the epoxy ionomer of Example 1 being replaced by the epoxy ionomer of Example 3. The ink was used for printing and was cured as described in Example 14. The results achieved are given in the accompanying Table.
Example 17
An ink composition was prepared as described in Example 14, but with the epoxy ionomer of Example 1 being replaced by the epoxy ionomer of Example 4. The ink was used for printing and was cured as described in Example 14. The results achieved are given in the accompanying Table.
Example 18
An ink composition was prepared as described in Example 14, but with the epoxy ionomer of Example 1 being replaced by the product of Example 5. The ink was used for printing and was cured as described in Example 14. The results achieved are given in the accompanying Table.
17-- TABLE
Ex. Gloss Adhesion Bleed Curl Coatability Water Wash-up 6 5 5 5 5 5 5 7 5 5 5 5 5 5 8 5 5 5 5 5 5 9 5 5 5 5 5 5 5 5 5 5 5 5 11 5 5 5 5 5 5 12 5 5 5 5 5 0 13 5 5 5 5 5 0 14 5 5 5 5 5 5 is 5 5 5 5 5 5 16 5 5 5 5 5 5 17 5 5 5 5 5 0 18 5 5 5 5 5 0 In the Table, on a scale of 0-5, 5 represents excellent and 0 represents very poor.
The data in the Table show that water wash up was very poor when the epoxy oligomer itself had poor solubility.
18 -
Claims (19)
1. Water soluble, radiation curable, esterified epoxy oligomers including acrylate or methacrylate groups.
2. Epoxy oligomers according to claim 1, wherein the epoxy groups have been at least partially reacted with an amine.
3. Epoxy oligomers according to claim 2, wherein at least some of the amino groups derived from the said amine have been quaternized.
4. Epoxy oligomers according to claim 3, wherein the quaternization has been effected by acrylic or methacrylic acid.
5. Epoxy oligomers according to claim 1 or claim 2, wherein the amino groups form linkages between residues of an epoxide.
6. A process for producing a water soluble, radiation curable esterified epoxy oligomers including acrylate or methacrylate groups, the method comprising reacting an epoxy acrylate or an epoxy methacrylate with a secondary amine to leave unreacted epoxy groups, reacting unreacted epoxy groups in the product with a primary di-amine, thereafter reacting the product with a secondary amine to effect substantially complete reaction of the epoxy groups, and then quaternizing the product.
7. A process according to claim 6, wherein the epoxy acrylate or epoxy methacrylate has been formed by reacting a difunctional epoxide with acrylic or methacrylic acid.
- 19 A process according to claim 7, wherein the difunctional epoxide comprises a Bisphenol A, Bisphenol F or Bisphenol
S type polymer.
9. A radiation curable composition comprising:- (a) a water soluble, radiation curable, esterified epoxy oligomer including acrylate or methacrylate groups; (b) a'mono- and/or a multi-functional monomer; (c) a free radical initiator; (d) an optional pigment or dyestuff colorant; and (e) an optional amine acrylate photo accelerator.
10. A composition according to to claim 9, wherein the composition contains from 10 to 70 percent by weight of a water soluble, radiation curable esterified epoxy oligomer.
11. A composition according to claim 9 or claim 10, wherein the free radical initiator is present in an amount of up to 10 percent by weight of the composition.
12. A composition according to any of claims 9 to 11, including an amine acrylate, preferably a tertiary amine acrylate.
13. A composition according to claim 12, wherein the weight ratio of photoinitiator to amine acrylate is about 2:1.
14. A composition according to any of claims 9 to 13, in the form of a varnish.
15. A Composition according to any of the preceding claims, including a colorant.
- 2W-
16. A composition according to claim 15, wherein the colorant is present in an amount of from 1 to 30 percent by weight of the composition.
17. A composition according to claim 15 or claim 16, in the form of an ink.
18. A method of forming a photocured coating on a substrate, the method comprising applying a coating of a composition according to any of claims 8 to 16 on the substrate, and exposing the coating to ultraviolet light.
19. A method according to claim 18, wherein the substrate comprises paper or card.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB9206560A GB2266721A (en) | 1992-03-26 | 1992-03-26 | Radiation curable compounds and compositions |
| EP93302313A EP0562860A1 (en) | 1992-03-26 | 1993-03-25 | Radiation curable compounds and compositions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB9206560A GB2266721A (en) | 1992-03-26 | 1992-03-26 | Radiation curable compounds and compositions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB9206560D0 GB9206560D0 (en) | 1992-05-06 |
| GB2266721A true GB2266721A (en) | 1993-11-10 |
Family
ID=10712861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9206560A Withdrawn GB2266721A (en) | 1992-03-26 | 1992-03-26 | Radiation curable compounds and compositions |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0562860A1 (en) |
| GB (1) | GB2266721A (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4343885A1 (en) * | 1993-12-22 | 1995-06-29 | Hoechst Ag | Aqueous, radiation-curable binder dispersions |
| DE19504528A1 (en) * | 1994-02-17 | 1995-08-24 | Sandoz Ag | Compositions curable with amines |
| US5536775A (en) * | 1994-02-28 | 1996-07-16 | Sandoz Ltd. | Amine curable compositions |
| DE4413242A1 (en) * | 1994-04-16 | 1995-10-19 | Basf Lacke & Farben | Process for the production of objects with a three-dimensional surface structure and objects produced by this process |
| DE4416624A1 (en) * | 1994-05-11 | 1995-11-16 | Bayer Ag | Prepn. of amino modified epoxy acrylate or (meth)acrylate(s) |
| AT500395A1 (en) * | 1996-06-20 | 2005-12-15 | Teich Ag | LOW-PRESSURE PROCESSING USING A WATER-DILUTABLE PRINTING COLOR SYSTEM |
| US5938826A (en) * | 1997-05-16 | 1999-08-17 | Markem Corporation | Hot melt ink |
| JP3576862B2 (en) * | 1998-04-28 | 2004-10-13 | キヤノン株式会社 | Ink, image forming method and photopolymerization initiator |
| US6156816A (en) * | 1998-08-20 | 2000-12-05 | Henkel Corporation | Screen coating composition and method for applying same |
| GB2357514A (en) * | 1999-12-23 | 2001-06-27 | Sericol Ltd | An ink for decoration of paper substrates for poster displays |
| DK174906B1 (en) * | 2001-02-07 | 2004-02-16 | Joergin Bech | Fish scavenging apparatus and method. |
| GB0203106D0 (en) * | 2002-02-09 | 2002-03-27 | W & J Leigh & Co | Ultra-violet curable intumescent coatings |
| FR2878251A1 (en) * | 2004-11-22 | 2006-05-26 | Cognis Deutschland Gmbh | IRRADIATION CURABLE COMPOSITIONS AND THEIR USE |
| ITMI20082305A1 (en) * | 2008-12-23 | 2010-06-24 | Mondial Color S R L | COMPOSITION FOR CUTTING TOOLS COATING |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1391928A (en) * | 1971-11-29 | 1975-04-23 | Montedison Spa | Water-soluble resins |
| GB1456486A (en) * | 1974-06-20 | 1976-11-24 | Bayer Ag | Air drying coating compositions |
| EP0003483A2 (en) * | 1978-01-05 | 1979-08-22 | Bayer Ag | Photocurable resins with photoinitiator and accelerator incorporated therein and their use in UV-hardenable film forming compositions |
| EP0039425A2 (en) * | 1980-04-15 | 1981-11-11 | Lackwerke Wülfing GmbH + Co. | Water-dilutable binders, method of making them and their use |
| JPS5811545A (en) * | 1981-07-14 | 1983-01-22 | Nippon Shokubai Kagaku Kogyo Co Ltd | Method for making epoxidized poly(meth)acrylate resin thixotropic |
| GB2131026A (en) * | 1982-09-22 | 1984-06-13 | Daicel Chem | Modified epoxy (meth) acrylate resin and hardenable resin composition containing the same |
| EP0240752A1 (en) * | 1986-03-07 | 1987-10-14 | Matsushita Electric Industrial Co., Ltd. | Erasable optical disk having an improved optically transparent substrate |
| GB2235925A (en) * | 1989-09-12 | 1991-03-20 | Sericol Group Ltd | Photocurable compositions suitable for use in solder mask inks |
| GB2253629A (en) * | 1991-03-11 | 1992-09-16 | Asahi Chem Res Lab | One component type liquid photo solder-resist ink composition |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE759021A (en) * | 1969-11-17 | 1971-04-30 | Reichhold Albert Chemie Ag | PROCESS FOR PREPARING SYNTHETIC RESINS BASED ON WATER-DILUABLE POLYE-THERESTERS AND MODIFIED WITH VINYL |
| US4245031A (en) * | 1979-09-18 | 1981-01-13 | E. I. Du Pont De Nemours And Company | Photopolymerizable compositions based on salt-forming polymers and polyhydroxy polyethers |
| EP0516365B1 (en) * | 1991-05-27 | 1995-11-08 | Mitsubishi Chemical Corporation | Adhesive resin composition |
-
1992
- 1992-03-26 GB GB9206560A patent/GB2266721A/en not_active Withdrawn
-
1993
- 1993-03-25 EP EP93302313A patent/EP0562860A1/en not_active Withdrawn
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1391928A (en) * | 1971-11-29 | 1975-04-23 | Montedison Spa | Water-soluble resins |
| GB1456486A (en) * | 1974-06-20 | 1976-11-24 | Bayer Ag | Air drying coating compositions |
| EP0003483A2 (en) * | 1978-01-05 | 1979-08-22 | Bayer Ag | Photocurable resins with photoinitiator and accelerator incorporated therein and their use in UV-hardenable film forming compositions |
| EP0039425A2 (en) * | 1980-04-15 | 1981-11-11 | Lackwerke Wülfing GmbH + Co. | Water-dilutable binders, method of making them and their use |
| JPS5811545A (en) * | 1981-07-14 | 1983-01-22 | Nippon Shokubai Kagaku Kogyo Co Ltd | Method for making epoxidized poly(meth)acrylate resin thixotropic |
| GB2131026A (en) * | 1982-09-22 | 1984-06-13 | Daicel Chem | Modified epoxy (meth) acrylate resin and hardenable resin composition containing the same |
| EP0240752A1 (en) * | 1986-03-07 | 1987-10-14 | Matsushita Electric Industrial Co., Ltd. | Erasable optical disk having an improved optically transparent substrate |
| GB2235925A (en) * | 1989-09-12 | 1991-03-20 | Sericol Group Ltd | Photocurable compositions suitable for use in solder mask inks |
| GB2253629A (en) * | 1991-03-11 | 1992-09-16 | Asahi Chem Res Lab | One component type liquid photo solder-resist ink composition |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0562860A1 (en) | 1993-09-29 |
| GB9206560D0 (en) | 1992-05-06 |
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| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |