GB2240875B - A method for forming a thin film resistor on an ic wafer - Google Patents

A method for forming a thin film resistor on an ic wafer

Info

Publication number: GB2240875B
Authority: GB; United Kingdom
Prior art keywords: wafer; forming; thin film; film resistor; resistor
Prior art date: 1990-02-12
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

GB9022632A

Other versions

GB9022632D0 (en

GB2240875A (en

Inventor

William Allan Lane

Andrew David Bain

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Heenar Research Ltd

Original Assignee

Analog Research and Development Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1990-02-12

Filing date

1990-10-18

Publication date

1993-09-08

1990-02-12 Priority claimed from IE900458A external-priority patent/IE900458L/en

1990-10-18 Application filed by Analog Research and Development Ltd filed Critical Analog Research and Development Ltd

1990-11-28 Publication of GB9022632D0 publication Critical patent/GB9022632D0/en

1991-08-14 Publication of GB2240875A publication Critical patent/GB2240875A/en

1993-09-08 Application granted granted Critical

1993-09-08 Publication of GB2240875B publication Critical patent/GB2240875B/en

2010-10-18 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/2404—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by charged particle impact, e.g. by electron or ion beam milling, sputtering, plasma etching
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/006—Thin film resistors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D88/00—Three-dimensional [3D] integrated devices

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Electromagnetism (AREA)
Plasma & Fusion (AREA)
Manufacturing & Machinery (AREA)
Semiconductor Integrated Circuits (AREA)

GB9022632A 1990-02-12 1990-10-18 A method for forming a thin film resistor on an ic wafer Expired - Lifetime GB2240875B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
IE900458A IE900458L (en)	1989-02-14	1990-02-12	Holder for Respirator

Publications (3)

Publication Number	Publication Date
GB9022632D0 GB9022632D0 (en)	1990-11-28
GB2240875A GB2240875A (en)	1991-08-14
GB2240875B true GB2240875B (en)	1993-09-08

Family

ID=11012916

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB9022632A Expired - Lifetime GB2240875B (en)	1990-02-12	1990-10-18	A method for forming a thin film resistor on an ic wafer

Country Status (1)

Country	Link
GB (1)	GB2240875B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE4136198A1 (en) *	1991-11-02	1993-05-06	Deutsche Aerospace Ag, 8000 Muenchen, De	METHOD FOR PRODUCING A STRUCTURED THIN FILM RESISTANT LAYER SYSTEM AND CIRCUIT ARRANGEMENT WITH A THIN FILM RESISTANT LAYER SYSTEM PRODUCED IN PARTICULAR THIS METHOD

1990
- 1990-10-18 GB GB9022632A patent/GB2240875B/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
GB9022632D0 (en)	1990-11-28
GB2240875A (en)	1991-08-14

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Legal Events

Date	Code	Title	Description
2010-07-21	732E	Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)	Free format text: REGISTERED BETWEEN 20100624 AND 20100630
2010-11-10	PE20	Patent expired after termination of 20 years	Expiry date: 20101017