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GB2135525B - Heat-dissipating chip carrier substrates - Google Patents

Heat-dissipating chip carrier substrates

Info

Publication number
GB2135525B
GB2135525B GB08404217A GB8404217A GB2135525B GB 2135525 B GB2135525 B GB 2135525B GB 08404217 A GB08404217 A GB 08404217A GB 8404217 A GB8404217 A GB 8404217A GB 2135525 B GB2135525 B GB 2135525B
Authority
GB
United Kingdom
Prior art keywords
heat
chip carrier
carrier substrates
dissipating chip
dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08404217A
Other versions
GB2135525A (en
GB8404217D0 (en
Inventor
Graham John Baldwin
Michael Owen Mccann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Smiths Group PLC
Original Assignee
Smiths Group PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB838304890A external-priority patent/GB8304890D0/en
Application filed by Smiths Group PLC filed Critical Smiths Group PLC
Priority to GB08404217A priority Critical patent/GB2135525B/en
Publication of GB8404217D0 publication Critical patent/GB8404217D0/en
Publication of GB2135525A publication Critical patent/GB2135525A/en
Application granted granted Critical
Publication of GB2135525B publication Critical patent/GB2135525B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H10W70/657—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB08404217A 1983-02-22 1984-02-17 Heat-dissipating chip carrier substrates Expired GB2135525B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08404217A GB2135525B (en) 1983-02-22 1984-02-17 Heat-dissipating chip carrier substrates

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB838304890A GB8304890D0 (en) 1983-02-22 1983-02-22 Chip-carrier substrates
GB08404217A GB2135525B (en) 1983-02-22 1984-02-17 Heat-dissipating chip carrier substrates

Publications (3)

Publication Number Publication Date
GB8404217D0 GB8404217D0 (en) 1984-03-21
GB2135525A GB2135525A (en) 1984-08-30
GB2135525B true GB2135525B (en) 1986-06-18

Family

ID=26285306

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08404217A Expired GB2135525B (en) 1983-02-22 1984-02-17 Heat-dissipating chip carrier substrates

Country Status (1)

Country Link
GB (1) GB2135525B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8727926D0 (en) * 1987-11-28 1987-12-31 British Aerospace Surface mounting leadless components on conductor pattern supporting substrates
GB2247782A (en) * 1990-09-05 1992-03-11 Marconi Gec Ltd A circuit board assembly
GB2335075A (en) * 1998-03-02 1999-09-08 Ericsson Telefon Ab L M Heat transfer from a single electronic device
GB2345576A (en) * 1999-01-05 2000-07-12 Ericsson Telefon Ab L M Heat-sink of ICs and method of mounting to PCBs
US20080158821A1 (en) * 2004-11-30 2008-07-03 Telefonaktiebolaget Lm Ericsson (Publ) Printed Board Assembly with Improved Heat Dissipation
ATE502398T1 (en) 2006-01-24 2011-04-15 Nxp Bv VOLTAGE BUFFERING HOUSING FOR A SEMICONDUCTOR COMPONENT
EP2183775A2 (en) 2007-07-26 2010-05-12 Nxp B.V. Reinforced structure for a stack of layers in a semiconductor component
WO2009016531A2 (en) 2007-07-30 2009-02-05 Nxp B.V. Reduced bottom roughness of stress buffering element of a semiconductor component
CN102668726B (en) * 2009-12-24 2015-07-01 古河电气工业株式会社 Assembly structure for injection molded substrate and for mounting component

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3365620A (en) * 1966-06-13 1968-01-23 Ibm Circuit package with improved modular assembly and cooling apparatus
US3405323A (en) * 1967-03-20 1968-10-08 Ibm Apparatus for cooling electrical components
US3492535A (en) * 1968-01-08 1970-01-27 Ncr Co Ceramic circuit card
US4339260A (en) * 1981-01-12 1982-07-13 Owens-Illinois, Inc. Environmentally protected electronic control for a glassware forming machine

Also Published As

Publication number Publication date
GB2135525A (en) 1984-08-30
GB8404217D0 (en) 1984-03-21

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Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19970217