GB2135123B - Multi-level metallization structure for semiconductor device and method of making same - Google Patents
Multi-level metallization structure for semiconductor device and method of making sameInfo
- Publication number
- GB2135123B GB2135123B GB08402109A GB8402109A GB2135123B GB 2135123 B GB2135123 B GB 2135123B GB 08402109 A GB08402109 A GB 08402109A GB 8402109 A GB8402109 A GB 8402109A GB 2135123 B GB2135123 B GB 2135123B
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconductor device
- making same
- metallization structure
- level metallization
- level
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W20/064—
-
- H10W72/071—
-
- H10W20/056—
-
- H10W20/4405—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US46564083A | 1983-02-10 | 1983-02-10 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8402109D0 GB8402109D0 (en) | 1984-02-29 |
| GB2135123A GB2135123A (en) | 1984-08-22 |
| GB2135123B true GB2135123B (en) | 1987-05-20 |
Family
ID=23848579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08402109A Expired GB2135123B (en) | 1983-02-10 | 1984-01-26 | Multi-level metallization structure for semiconductor device and method of making same |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPH0666313B2 (en) |
| KR (1) | KR910008104B1 (en) |
| CA (1) | CA1209281A (en) |
| GB (1) | GB2135123B (en) |
| IT (1) | IT1213136B (en) |
| SE (1) | SE501466C2 (en) |
| YU (1) | YU18284A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0763064B2 (en) | 1986-03-31 | 1995-07-05 | 株式会社日立製作所 | Wiring connection method for IC element |
| JPH0719841B2 (en) * | 1987-10-02 | 1995-03-06 | 株式会社東芝 | Semiconductor device |
| USRE36475E (en) | 1993-09-15 | 1999-12-28 | Hyundai Electronics Industries Co., Ltd. | Method of forming a via plug in a semiconductor device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51112292A (en) * | 1975-03-28 | 1976-10-04 | Hitachi Ltd | Semiconductor device |
| JPS55156365A (en) * | 1979-05-24 | 1980-12-05 | Toshiba Corp | Semiconductor device |
-
1984
- 1984-01-26 GB GB08402109A patent/GB2135123B/en not_active Expired
- 1984-01-31 CA CA000446407A patent/CA1209281A/en not_active Expired
- 1984-02-02 YU YU00182/84A patent/YU18284A/en unknown
- 1984-02-06 SE SE8400592A patent/SE501466C2/en unknown
- 1984-02-09 IT IT8419546A patent/IT1213136B/en active
- 1984-02-09 JP JP59024197A patent/JPH0666313B2/en not_active Expired - Lifetime
- 1984-02-10 KR KR1019840000622A patent/KR910008104B1/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB8402109D0 (en) | 1984-02-29 |
| SE8400592D0 (en) | 1984-02-06 |
| JPS59205739A (en) | 1984-11-21 |
| KR910008104B1 (en) | 1991-10-07 |
| SE8400592L (en) | 1984-08-11 |
| YU18284A (en) | 1987-12-31 |
| IT8419546A0 (en) | 1984-02-09 |
| GB2135123A (en) | 1984-08-22 |
| IT1213136B (en) | 1989-12-14 |
| KR840008215A (en) | 1984-12-13 |
| SE501466C2 (en) | 1995-02-20 |
| CA1209281A (en) | 1986-08-05 |
| JPH0666313B2 (en) | 1994-08-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19970126 |