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GB2130383B - Test board for semiconductor packages - Google Patents

Test board for semiconductor packages

Info

Publication number
GB2130383B
GB2130383B GB08322587A GB8322587A GB2130383B GB 2130383 B GB2130383 B GB 2130383B GB 08322587 A GB08322587 A GB 08322587A GB 8322587 A GB8322587 A GB 8322587A GB 2130383 B GB2130383 B GB 2130383B
Authority
GB
United Kingdom
Prior art keywords
test board
semiconductor packages
packages
semiconductor
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08322587A
Other versions
GB2130383A (en
GB8322587D0 (en
Inventor
Tadashi Moriya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Risho Kogyo Co Ltd
Original Assignee
Risho Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP14093282U external-priority patent/JPS5942982U/en
Priority claimed from JP14554782U external-priority patent/JPS5949976U/en
Priority claimed from JP14928282U external-priority patent/JPS5952485U/en
Application filed by Risho Kogyo Co Ltd filed Critical Risho Kogyo Co Ltd
Publication of GB8322587D0 publication Critical patent/GB8322587D0/en
Publication of GB2130383A publication Critical patent/GB2130383A/en
Application granted granted Critical
Publication of GB2130383B publication Critical patent/GB2130383B/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2817—Environmental-, stress-, or burn-in tests
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
GB08322587A 1982-09-14 1983-08-23 Test board for semiconductor packages Expired GB2130383B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP14093282U JPS5942982U (en) 1982-09-14 1982-09-14 Semiconductor package test substrate
JP14554782U JPS5949976U (en) 1982-09-24 1982-09-24 Semiconductor test board
JP14928282U JPS5952485U (en) 1982-09-29 1982-09-29 Semiconductor test board

Publications (3)

Publication Number Publication Date
GB8322587D0 GB8322587D0 (en) 1983-09-28
GB2130383A GB2130383A (en) 1984-05-31
GB2130383B true GB2130383B (en) 1986-06-04

Family

ID=27318156

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08322587A Expired GB2130383B (en) 1982-09-14 1983-08-23 Test board for semiconductor packages

Country Status (1)

Country Link
GB (1) GB2130383B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4760335A (en) * 1985-07-30 1988-07-26 Westinghouse Electric Corp. Large scale integrated circuit test system
JPH0752664B2 (en) * 1992-12-28 1995-06-05 山一電機株式会社 IC socket

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3319166A (en) * 1964-07-21 1967-05-09 Westinghouse Electric Corp Fixture for securing and electrically testing an electronic component in flat package with coplanar leads
GB1299241A (en) * 1969-02-28 1972-12-13 Licentia Gmbh Contact device for enabling the dynamic measurement of semiconductor parameters
GB1284742A (en) * 1969-03-21 1972-08-09 Lucas Industries Ltd Transporting and testing device for use with semi-conductor wafers
GB1521614A (en) * 1977-02-17 1978-08-16 Int Computers Ltd Apparatus for testing circuit elements
US4329642A (en) * 1979-03-09 1982-05-11 Siliconix, Incorporated Carrier and test socket for leadless integrated circuit
GB2070256B (en) * 1980-02-22 1983-09-21 Marconi Co Ltd Fault finding in electronic circuits
GB2104669A (en) * 1981-08-06 1983-03-09 Int Computers Ltd Apparatus for testing electronic devices

Also Published As

Publication number Publication date
GB2130383A (en) 1984-05-31
GB8322587D0 (en) 1983-09-28

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years