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GB2128768A - Connecting optical fibre to a light emitting device - Google Patents

Connecting optical fibre to a light emitting device Download PDF

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Publication number
GB2128768A
GB2128768A GB08323243A GB8323243A GB2128768A GB 2128768 A GB2128768 A GB 2128768A GB 08323243 A GB08323243 A GB 08323243A GB 8323243 A GB8323243 A GB 8323243A GB 2128768 A GB2128768 A GB 2128768A
Authority
GB
United Kingdom
Prior art keywords
light emitting
optical fibre
emitting device
hole
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB08323243A
Other versions
GB8323243D0 (en
GB2128768B (en
Inventor
Satoru Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB8323243D0 publication Critical patent/GB8323243D0/en
Publication of GB2128768A publication Critical patent/GB2128768A/en
Application granted granted Critical
Publication of GB2128768B publication Critical patent/GB2128768B/en
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4202Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236Fixing or mounting methods of the aligned elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236Fixing or mounting methods of the aligned elements
    • G02B6/4238Soldering
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236Fixing or mounting methods of the aligned elements
    • G02B6/4239Adhesive bonding; Encapsulation with polymer material
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4248Feed-through connections for the hermetical passage of fibres through a package wall

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electrostatic Charge, Transfer And Separation In Electrography (AREA)
  • Road Signs Or Road Markings (AREA)

Abstract

A light emitting device e.g. a laser diode chip (5) is connected to an optical fibre (8) in a sealed case. The laser diode chip (5) may be mounted on a pedestal portion (3) or a stem (1) by means of a submount (4). A support (19) has a through hole (20) for supporting the optical fibre chip (8), in a state in which its whole periphery is surrounded with a fixing material (11) e.g. a resin or solder. <IMAGE>

Description

SPECIFICATION A light emitting device The present invention relates to a light emitted ing device, and more particularly to a laser diode device with optical fibre which is used for light propagation.
As one of light propagation devices such as optical communication devices, there has been known a semiconductor laser element combined with optical fibre. For example, a laser module unit which employs a singlemode optical fibre and a semiconductor laser chip is disclosed in Japanese Laid-open Patent Application No. 2589/82. This laser module unit uses a condensing lens for the photocoupling between the laser chip and the optical fibre, and is complicated in arrangement.
As an optical communication device, we have previously developed a laser diode device with optical fibre having a structure as shown in Figs. 1 to 3 of the accompanying drawings. This laser diode device does not include a condensing lens between a laser chip and optical fibre, and has a simple arrangement as well as being small in size. It is assembled on a stem 1 in the form of an oblong plate. The stem 1 is such that one surface of the oblong metal plate is cut to form a ring-shaped sealing wall 2 in the central part thereof, and that the inner side of the ring-shaped sealing wall 2 is hollowed out still deeper, whereupon a pedestal portion 3 is formed centrally of the bottom of the hollow.
A submount 4 is fixed on the pedestal portion 3 by means of solder, and a laser diode chip 5 is fixed on the submount 4 by means of solder. At both the ends of the stem 1, there are respectively provided guide holes 6 and 7 extending toward those exit faces of the chip 5 from which laser radiation emerges. A fibre guide 9, in which optical fibre 8 is centrally and snugly inserted and fixed, is fitted in one guide hole 6 and is fixed to the stem 1 by means of a silver paste 10. The front end of the optical fibre 8 faces one exit face of the laser diode chip 5 so as to receive the laser radiation emitted therefrom.
Referring to Fig. 3, which shows in exaggerated form the fixed tip portion of the optical fibre, the tip portion of the optical fibre 8 is fixed to the pedestal portion 3 of the stem 1 with a fixing material 11 such as resin or solder, in order to prevent the efficiency of receiving the light into the optical fibre 8 (photocoupling efficiency) from fluctuating due to vibrations. Regarding a single-mode fibre which has a core diameter of approximately 8 jum, the precision of the alignment of the optical axis of the optical fibre 8 at the front end thereof relative to the chip 5 must be rendered within, e.g. + 0.2 to 0.3 llm in order to attain the desired photocoupling efficiency necessary for satisfactory operation.
A monitor fibre 1 2 is snugly inserted and fixed in the other guide hole 7. The front end of this monitor fibre 1 2 faces the other exit face of the laser diode chip 5 so as to monitor the light intensity of the laser radiation. Two terminals 1 3 and 1 4 are provided in the stem 1. One terminal 1 3 is an earth terminal which is welded to the stem 1 and which is electri cally connected to the lower electrode of the laser diode chip 5 through the stem 1 as well as the submount 4. The other lead 14 is fixed to the stem 1 through a glass (insulator) not shown, and its inner end protrudes from one end face of the stem 1 into the space inside the ring-shaped sealing wall 2.The protruding inner end and the upper electrode of the laser diode chip 5 are electrically connected by a conductor 1 5 made of gold. A flat cap 1 6 is mounted in airtight manner on the top of the ring-shaped sealing wall 2 by seam welding so as to hermetically encapsulate the laser diode chip 5.
The alignment of the optical axes of the fibre and the laser diode chip is effected in such a way that a position is reached where the greatest proportion of the laser radiation emitted from the fixed laser diode chip 5 is received into the optical fibre 8, this position being accurately determined by means of a photodetector whilst the optical fibre is being moved. The optical fibre 8 is fixed at the point where the detected received radiation is a maximum. However, we have found by exper iment that however accurately the optical axes of the optical fibre and the chip are aligned, the optical axis of the optical fibre shifts after it has been fixed, so the photocoupling effici ency is reduced.
We have found that the cause of this is due to the front end (photocoupled end) of the optical fibre 8 being drawn downwards due to the curing shrinkage of the fixing material 11, so that it is shifted from its original position.
This situation is illustrated in Fig. 4 of the accompanying drawings. The figure illustrates a partial section taken along line I-I in Fig. 1.
The fixing material such as resin 11 spreads out downwardly from the optical fibre 8, and pulls it down as it cures. In Fig. 4, the direction of the pulling-down forces are indi cated by arrows. Since magnitude of the pulling-down forces is as great as 0.3-0.4 ym at the maximum, the photocoupling efficiency is reduced, with the result that the available percentage transmission of radiation from the laser diode device is substantially reduced. In the case of single-mode fibre whose core 21 has a diameter of several gm, it has been found that there is hardly any transmission of radiation.
It is an object of the present invention to provide a laser diode device with optical fibre which can maintain a high photocoupling effi ciency.
According to the present invention there is provided a light emitting device in which a light emitting element and a photocoupled end of an optical fibre for receiving light emitted from the light emitting element are held within a sealed case; wherein the optical fibre is held in a through hole provided in a support, in a state in which the whole periphery of the optical fibre is surrounded with a fixing material.
The present invention will now be described in greater detail by way of example with reference to the remaining figures of the accompanying drawings, wherein: Figure 5 is a plan view, partly broken away, of a preferred form of a laser diode device with optical fibre; Figure 6 is a sectional view taken along line V-V in Fig. 5; Figure 7 is an enlarged sectional view showing a part of the laser diode shown in Fig. 5; Figure 8 is an enlarged sectional view taken along line Ill-Ill in Fig. 5, showing the optical fibre supporting portion; Figure 9 is an enlarged sectional view showing the optical fibre supporting portion in a second form of a laser diode device provided with an optical fibre; Figure 10 is an enlarged sectional view showing the optical fibre supporting portion in a third form of a laser diode device provided with an optical fibre;; Figure 11 is a perspective view of the optical fibre supporting portion shown in Fig.
10; and Figure 12 is a perspective view showing a modified embodiment of the optical fibre supporting portion.
Referring to Figs. 5 to 8, the laser diode device is assembled on the oblong metal stem 1 in similar manner to the prior-art laser diode device shown in Figs. 1 to 3. The stem 1 is such that one surface of the oblong metal plate is cut to form a ring-shaped sealing wall 2 in the central part thereof, and that the inner side of the ring-shaped sealing wall 2 is hollowed out still deeper, in order to form a pedestal portion 3 centrally of the bottom of the hollow. A submount 4 is fixed on the pedestal portion 3 by means of solder, and a laser diode chip 5 is fixed on the submount 4 by means of solder. At both the ends of the stem 1, there are respectively provided guide holes 6 and 7 extending toward the exit faces of the laser diode chip 5 from which laser radiation is emitted.A fibre guide 9, in which the optical fibre 8 is centrally and snugly inserted and fixed, is fitted in one guide hole 6 and is fixed to the stem 1 with a silver paste 10. The front end of the optical fibre 8 faces one exit face of the laser diode chip 5 so as to receive the laser radiation from the chip 5.
As shown in Fig. 7, the front end (photocoupled end) of the optical fibre 8 penetrates through a hole 20 provided in a support 19 which projects from the pedestal portion 3 of the stem 1 and is fixed to the support 1 9 with a fixing material 11 such as resin or solder, in order to prevent the efficiency of receiving the light into the optical fibre 8 (photocoupling efficiency) from fluctuating due to vibrations.
The core 21 of the optical fibre 8 has a diameter of 5-10 ,um. The upper part of the support 1 9 has an inclined surface 22, so that the fixing material 11 which consists of a resin or a brazing material can be easily supplied into the hole 20 which has a diameter of about 0.5 ,um. That part of the pedestal portion which is inside the support 19 is provided with an outflow recess 23 which is 0.5 mm wide and which receives and drains away the excess fixing material 11 which has overflowed through the circular hole 20. Therefore, the end faces of the submount 4 and the laser diode chip 5 are prevented from being covered with the excess fixing material 11 which has overflowed through the hole 20, and the reception of the laser radiation 1 8 is not impeded.
A monitor fibre 1 2 is snugly inserted and fixed in the other guide hole 7. The front end of this monitor fibre 1 2 faces the other exit face of the laser diode chip 5 so as to monitor the light intensity of the laser radiation. Two terminals 1 3 and 14 are provided in the stem 1. The terminal 1 3 is an earth terminal, which is welded to the stem 1 and which is eiectri- cally connected to the lower electrode of the laser diode chip 5 through the stem 1 as well as the submount 4. The other terminal 14 is fixed to the stem 1 through a glass insulator (not shown) and its inner end protrudes from one end face of the stem 1 into the space inside the ring-shaped sealing wall 2.The inner end and the upper electrode of the laser diode chip 5 are electrically connected by a conductor 1 5 made of gold. A flat cap 1 6 is mounted in air-tight manner on the top of the ring-shaped sealing wall 2 by seam welding so as to hermetically encapsulate the laser diode chip 5.
In assembling the above described laser diode device, after the optical axes of the laser diode chip 5 and the optical fibre 8 have been aligned, the fixing material 11 is supplied into the hole 20 which the optical fibre 8 penetrates, and it is cured. As shown in Fig. 8, the optical fibre 8 passes along the axis of the hole 20 and has its whole outer periphery supported uniformly by the fixing material 11.
In consequence, even when the curing shrin kage of the fixing material 11 has begun, the optical fibre 8 has its whole outer periphery drawn uniformly in the radial directions and is fixed without changing its position at the alignment of the optical axes, so that the photocoupling efficiency of the optical fibre 8 with the laser diode chip 5 is not substantially reduced. Accordingly, a laser diode device of good photocoupling efficiency can be manufactured at high available percentage transmission of the radiation from the laser diode device.
Referring now to the second embodiment shown in Fig. 9, the support 1 9 for supporting the optical fibre 8 is provided with a groove 24, the optical fibre 8 passing along the axis of this groove 24 and having its whole outer periphery supported by the fixing material 11 packed therein. Thus in similar manner to the first embodiment, the optical fibre 8 is fixed while maintaining the state at the optical axis alignment.
Referring now to the third embodiment shown in Fig. 10, a notch or fine slot 25 and a hole 26 continuous therewith is provided in the support 1 9 for supporting the optical fibre 8. The optical fibre 8 passes along the axis of the hole 26 so as to have its whole outer periphery supported by the fixing material 11 packed in this hole.
The width W of the slot 25 is smaller than the diameter of the hole 26. Accordingly, as in the case of the first embodiment, the optical fibre 8 has its whole outer periphery drawn uniformly in the radial directions and can be fixed without changing the position at the optical axis alignment.
This third embodiment has the advantage that the fixing material 11 for fixing the optical fibre 8 can be efficiently injected into the hole 26 through the slot 25.
The external appearance of the support 1 9 shown in Fig. 10 is such that the notch 25 which is contiguous with the hole 26 is formed as shown in Fig. 11.
In a modified form, as shown in Fig. 12, the support 1 9 may well be a structure which has a port 27 for injecting the fixing material into the hole 26.
When the width W of the slot 25 is greater than the diameter of the optical fibre 8, the optical fibre can be fed into the hole 26 through the slot 25 in the assembling operation of the laser diode device. In a further modified form, the slot 25 may be provided in the lateral part of the support 19, and not in the upper part as shown in Fig. 11.
The present invention is applicable to light propagation devices employing fibre for audio and communication uses, and is most effective when applied to laser diode devices having a single-mode optical fibre of small core diameter.

Claims (10)

1. A light emitting device in which a light emitting element and a photocoupled end of an optical fibre for receiving light emitted from the light emitting element are held within a sealed case; wherein the optical fibre is held in a through hole provided in a support, in a state in which the whole periphery of the optical fibre is surrounded with a fixing material.
2. A light emitting device according to claim 1, wherein said light emitting element is a laser diode chip, the photocoupled end of the optical fibre receiving laser radiation em itted from an exit face.
3. A light emitting device according to claim 1 or 2, wherein said fixing material comprises a resin or a -brazing material.
4. A light emitting device according to any one of the preceding claims, wherein a slot which is contiguously formed in said support with said through hole, said slot serv ing to inject said fixing material along said through hole.
5. A light emitting diode according to claim 4, wherein said slot is formed on the upper surface of said support.
6. A light emitting device according to claim 4 or 5, wherein the width of said slot is smaller than the diameter of said through hole.
7. A light emitting device according to any one of the preceding claims 1 to 3, wherein a port which is contiguously formed in said support with said through hole and which serves to inject said fixing material into said through hole.
8. A light emitting device according to claim 7, wherein said port is formed on the upper surface of said support.
9. A light emitting device according to claim 4, wherein the upper part of the support is provided with an inclined surface to assist I in the application of the fixing material.
10. A light emitting device constructed substantially as herein described with refer ence to and as illustrated in Figs. 5 to 8, or Fig. 9 or Figs. 10 and 11, or Fig. 12 of the accompanying drawings.
GB08323243A 1982-10-12 1983-08-30 Connecting optical fibre to a light emitting device Expired GB2128768B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57177654A JPS5967678A (en) 1982-10-12 1982-10-12 Laser diode device with optical fiber

Publications (3)

Publication Number Publication Date
GB8323243D0 GB8323243D0 (en) 1983-09-28
GB2128768A true GB2128768A (en) 1984-05-02
GB2128768B GB2128768B (en) 1986-07-30

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Family Applications (1)

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GB08323243A Expired GB2128768B (en) 1982-10-12 1983-08-30 Connecting optical fibre to a light emitting device

Country Status (9)

Country Link
JP (1) JPS5967678A (en)
KR (1) KR840006577A (en)
DE (1) DE3336759A1 (en)
FR (1) FR2534430B1 (en)
GB (1) GB2128768B (en)
HK (1) HK69687A (en)
IT (1) IT1172418B (en)
MY (1) MY8700638A (en)
SG (1) SG41687G (en)

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FR2574566A1 (en) * 1984-12-11 1986-06-13 Thomson Csf LIGHT EMITTING / RECEIVING DIODEES AND INTEGRATED NON-RECIPROCAL OPTICAL TRANSMITTING ELEMENTS, AND METHOD FOR MANUFACTURING SAME
US4623220A (en) * 1984-07-02 1986-11-18 Amp Incorporated Laser to fiber connection
EP0204224A1 (en) * 1985-05-29 1986-12-10 Siemens Aktiengesellschaft Method and apparatus for adjusting and fixing a clamping body, and the resulting manufactured component
FR2584827A1 (en) * 1985-07-09 1987-01-16 Comp Generale Electricite Device for coupling an optical fibre to an optoelectronic component
US4702556A (en) * 1983-08-22 1987-10-27 Hitachi, Ltd. Method of assembling a light emitting device with an optical fiber
US4756592A (en) * 1984-07-11 1988-07-12 Hitachi, Ltd Luminescent package device for coupling an optical fiber with a luminescent element
US4803361A (en) * 1986-05-26 1989-02-07 Hitachi, Ltd. Photoelectric device with optical fiber and laser emitting chip
US4875750A (en) * 1987-02-25 1989-10-24 Siemens Aktiengesellschaft Optoelectronic coupling element and method for its manufacture
EP0309885A3 (en) * 1987-09-26 1990-01-17 Standard Elektrik Lorenz Aktiengesellschaft Laser module and method for coupling of an optical fiber
US5553182A (en) * 1995-02-14 1996-09-03 Mcdonnell Douglas Corporation Alignment fixture and associated method for controllably positioning on optical fiber
US5602955A (en) * 1995-06-07 1997-02-11 Mcdonnell Douglas Corporation Microactuator for precisely aligning an optical fiber and an associated fabrication method
US5606635A (en) * 1995-06-07 1997-02-25 Mcdonnell Douglas Corporation Fiber optic connector having at least one microactuator for precisely aligning an optical fiber and an associated fabrication method
US5881198A (en) * 1995-06-07 1999-03-09 Mcdonnell Douglas Corporation Microactuator for precisely positioning an optical fiber and an associated method
EP0939328A3 (en) * 1998-02-27 2002-02-13 Nec Corporation Optical module
EP2878980A1 (en) * 2013-11-27 2015-06-03 Alcatel Lucent Device for aligning and fastening an optical fiber coupled to an opto-electronic component
EP3043198A1 (en) * 2015-01-06 2016-07-13 Alcatel Lucent Device for aligning and fastening an optical element coupled to an optoelectronic component

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JP2791401B2 (en) * 1988-09-16 1998-08-27 日本電信電話株式会社 Optical waveguide with optical fiber fixing groove and method for connecting optical waveguide and optical fiber
DE19623479C2 (en) * 1996-06-12 2002-07-11 Infineon Technologies Ag Optoelectronic transmitter
DE19748989A1 (en) * 1997-11-06 1999-07-15 Daimler Chrysler Ag Optical transmit / receive module

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EP0014961A1 (en) * 1979-02-17 1980-09-03 HARTING ELEKTRONIK GmbH Method and device for coupling electro-optical converters to light guides
GB2064862A (en) * 1979-11-23 1981-06-17 Philips Nv Envelope for a photodiode
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Cited By (21)

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Publication number Priority date Publication date Assignee Title
US4702556A (en) * 1983-08-22 1987-10-27 Hitachi, Ltd. Method of assembling a light emitting device with an optical fiber
US4834492A (en) * 1983-08-22 1989-05-30 Hitachi, Ltd. Light emitting device with an optical fiber and a deformable support member for supporting the optical fiber
US4883342A (en) * 1983-08-22 1989-11-28 Hitachi, Ltd. Method of assembling a light emitting device with an optical fiber
US4623220A (en) * 1984-07-02 1986-11-18 Amp Incorporated Laser to fiber connection
US4756592A (en) * 1984-07-11 1988-07-12 Hitachi, Ltd Luminescent package device for coupling an optical fiber with a luminescent element
EP0187581A1 (en) * 1984-12-11 1986-07-16 Thomson-Csf Integrated light emitting/receiving diodes and unidirectional optical transmission elements, and process for their production
FR2574566A1 (en) * 1984-12-11 1986-06-13 Thomson Csf LIGHT EMITTING / RECEIVING DIODEES AND INTEGRATED NON-RECIPROCAL OPTICAL TRANSMITTING ELEMENTS, AND METHOD FOR MANUFACTURING SAME
US4888081A (en) * 1985-05-29 1989-12-19 Siemens Aktiengesellschaft Device for positioning and fastening a lightwave guide to a base
EP0204224A1 (en) * 1985-05-29 1986-12-10 Siemens Aktiengesellschaft Method and apparatus for adjusting and fixing a clamping body, and the resulting manufactured component
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Also Published As

Publication number Publication date
GB8323243D0 (en) 1983-09-28
FR2534430B1 (en) 1988-01-15
DE3336759A1 (en) 1984-07-26
IT8323254A1 (en) 1985-04-11
FR2534430A1 (en) 1984-04-13
JPS5967678A (en) 1984-04-17
GB2128768B (en) 1986-07-30
KR840006577A (en) 1984-11-30
IT1172418B (en) 1987-06-18
IT8323254A0 (en) 1983-10-11
SG41687G (en) 1987-07-17
MY8700638A (en) 1987-12-31
HK69687A (en) 1987-10-02

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