[go: up one dir, main page]

GB2123035B - Forming ceramic films; fabricating - Google Patents

Forming ceramic films; fabricating

Info

Publication number
GB2123035B
GB2123035B GB08234823A GB8234823A GB2123035B GB 2123035 B GB2123035 B GB 2123035B GB 08234823 A GB08234823 A GB 08234823A GB 8234823 A GB8234823 A GB 8234823A GB 2123035 B GB2123035 B GB 2123035B
Authority
GB
United Kingdom
Prior art keywords
fabricating
forming ceramic
ceramic films
films
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08234823A
Other versions
GB2123035A (en
Inventor
Henley Frank Sterling
Eric Langley Bush
John Henry Alexander
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB08210135A external-priority patent/GB2117795A/en
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB08234823A priority Critical patent/GB2123035B/en
Publication of GB2123035A publication Critical patent/GB2123035A/en
Priority to US06/696,859 priority patent/US4584074A/en
Application granted granted Critical
Publication of GB2123035B publication Critical patent/GB2123035B/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00Electrophoretic coating characterised by the process
    • C25D13/02Electrophoretic coating characterised by the process with inorganic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • H01G4/302Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • H01G4/308Stacked capacitors made by transfer techniques
    • H10W99/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0147Carriers and holders
    • H05K2203/0152Temporary metallic carrier, e.g. for transferring material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333Deposition techniques, e.g. coating
    • H05K2203/135Electrophoretic deposition of insulating material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
GB08234823A 1982-04-06 1982-12-07 Forming ceramic films; fabricating Expired GB2123035B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB08234823A GB2123035B (en) 1982-04-06 1982-12-07 Forming ceramic films; fabricating
US06/696,859 US4584074A (en) 1982-12-07 1985-01-30 Capacitors

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB08210135A GB2117795A (en) 1982-04-06 1982-04-06 Fabricating capacitors; forming ceramic films
GB08234823A GB2123035B (en) 1982-04-06 1982-12-07 Forming ceramic films; fabricating

Publications (2)

Publication Number Publication Date
GB2123035A GB2123035A (en) 1984-01-25
GB2123035B true GB2123035B (en) 1986-11-05

Family

ID=26282480

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08234823A Expired GB2123035B (en) 1982-04-06 1982-12-07 Forming ceramic films; fabricating

Country Status (1)

Country Link
GB (1) GB2123035B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3259686B2 (en) * 1998-07-27 2002-02-25 株式会社村田製作所 Ceramic electronic components

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA918599A (en) * 1969-05-19 1973-01-09 Ford Motor Company Of Canada Electrodeposition of particulate material
US3629086A (en) * 1969-12-12 1971-12-21 Ford Motor Co Anodic deposition of ceramic frit with cationic envelope

Also Published As

Publication number Publication date
GB2123035A (en) 1984-01-25

Similar Documents

Publication Publication Date Title
GB2119168B (en) Forming crystallized semiconductor layers
GB8308510D0 (en) Film die
GB8404092D0 (en) Fabricating semiconductor material
GB8326428D0 (en) Manufacture of multilayer material
DE3371820D1 (en) Process for the preparation of photographic materials
GB2121024B (en) Producing ceramic tapes
GB2112625B (en) Biscuit manufacture
GB8332637D0 (en) Manufacturing whisker preform
GB8431541D0 (en) Fabricating substrate
GB2119303B (en) Mould
GB8304976D0 (en) Making crisscross-wound layers
GB2158463B (en) Forming ceramic films
GB8310609D0 (en) Forming semiconductor structure
GB8311570D0 (en) Fabricating ceramic materials
GB8327200D0 (en) Producing alkylangelicins
JPS57140375A (en) Ceramic manufacture
DE3378683D1 (en) Fabricating shaped laminated transparencies
GB8303688D0 (en) Mould making
GB8332417D0 (en) Manufacturing techniques
GB8325167D0 (en) Oxide films
GB2123035B (en) Forming ceramic films; fabricating
GB2117796B (en) Forming ceramic layers; dielectric structures
ZA834982B (en) Brick manufacture
GB2126158B (en) Producing ceramic articles
GB8308509D0 (en) Wafer-baking mould

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee