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GB2117564B - Mounting one integrated circuit upon another - Google Patents

Mounting one integrated circuit upon another

Info

Publication number
GB2117564B
GB2117564B GB08208967A GB8208967A GB2117564B GB 2117564 B GB2117564 B GB 2117564B GB 08208967 A GB08208967 A GB 08208967A GB 8208967 A GB8208967 A GB 8208967A GB 2117564 B GB2117564 B GB 2117564B
Authority
GB
United Kingdom
Prior art keywords
integrated circuit
contact pads
another
logic chip
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08208967A
Other versions
GB2117564A (en
Inventor
William John Talbot
John William Richer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Priority to GB08208967A priority Critical patent/GB2117564B/en
Publication of GB2117564A publication Critical patent/GB2117564A/en
Application granted granted Critical
Publication of GB2117564B publication Critical patent/GB2117564B/en
Expired legal-status Critical Current

Links

Classifications

    • H10W90/00—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/859—
    • H10W90/28—
    • H10W90/722—
    • H10W90/756—

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

In an integrated circuit assembly a memory chip 3 is mounted on a logic chip 1. A first set of contact pads 2 on the logic chip 1 are electrically joined to corresponding contact pads 4 on the memory chip 3 to secure the chips to one another in face-to-face relationship and to provide interconnections between the chips. A further set of contact pads 5 on the logic chip 1 are provided for external connections to the integrated circuit assembly. The assembly may be contained in a protective package 7, 8 or may be mounted on an etched metal film using a tape assisted bonding technique. <IMAGE>
GB08208967A 1982-03-26 1982-03-26 Mounting one integrated circuit upon another Expired GB2117564B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08208967A GB2117564B (en) 1982-03-26 1982-03-26 Mounting one integrated circuit upon another

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08208967A GB2117564B (en) 1982-03-26 1982-03-26 Mounting one integrated circuit upon another

Publications (2)

Publication Number Publication Date
GB2117564A GB2117564A (en) 1983-10-12
GB2117564B true GB2117564B (en) 1985-11-06

Family

ID=10529311

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08208967A Expired GB2117564B (en) 1982-03-26 1982-03-26 Mounting one integrated circuit upon another

Country Status (1)

Country Link
GB (1) GB2117564B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USH1267H (en) 1990-07-05 1993-12-07 Boyd Melissa D Integrated circuit and lead frame assembly

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DE3516954A1 (en) * 1984-05-14 1985-11-14 Gigabit Logic, Inc., Newbury Park, Calif. MOUNTED INTEGRATED CIRCUIT
GB8506714D0 (en) * 1985-03-15 1985-04-17 Smiths Industries Plc Electronic circuit assemblies
US4974057A (en) * 1986-10-31 1990-11-27 Texas Instruments Incorporated Semiconductor device package with circuit board and resin
EP0304263A3 (en) * 1987-08-17 1990-09-12 Lsi Logic Corporation Semiconductor chip assembly
US6097098A (en) * 1997-02-14 2000-08-01 Micron Technology, Inc. Die interconnections using intermediate connection elements secured to the die face
US6096576A (en) 1997-09-02 2000-08-01 Silicon Light Machines Method of producing an electrical interface to an integrated circuit device having high density I/O count
US6872984B1 (en) 1998-07-29 2005-03-29 Silicon Light Machines Corporation Method of sealing a hermetic lid to a semiconductor die at an angle
US7177081B2 (en) 2001-03-08 2007-02-13 Silicon Light Machines Corporation High contrast grating light valve type device
US6782205B2 (en) 2001-06-25 2004-08-24 Silicon Light Machines Method and apparatus for dynamic equalization in wavelength division multiplexing
US6829092B2 (en) 2001-08-15 2004-12-07 Silicon Light Machines, Inc. Blazed grating light valve
US6785001B2 (en) 2001-08-21 2004-08-31 Silicon Light Machines, Inc. Method and apparatus for measuring wavelength jitter of light signal
US6930364B2 (en) 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
US6956995B1 (en) 2001-11-09 2005-10-18 Silicon Light Machines Corporation Optical communication arrangement
US6800238B1 (en) 2002-01-15 2004-10-05 Silicon Light Machines, Inc. Method for domain patterning in low coercive field ferroelectrics
US6767751B2 (en) 2002-05-28 2004-07-27 Silicon Light Machines, Inc. Integrated driver process flow
US6839479B2 (en) 2002-05-29 2005-01-04 Silicon Light Machines Corporation Optical switch
US7054515B1 (en) 2002-05-30 2006-05-30 Silicon Light Machines Corporation Diffractive light modulator-based dynamic equalizer with integrated spectral monitor
US6822797B1 (en) 2002-05-31 2004-11-23 Silicon Light Machines, Inc. Light modulator structure for producing high-contrast operation using zero-order light
US6813059B2 (en) 2002-06-28 2004-11-02 Silicon Light Machines, Inc. Reduced formation of asperities in contact micro-structures
US6908201B2 (en) 2002-06-28 2005-06-21 Silicon Light Machines Corporation Micro-support structures
US7057795B2 (en) 2002-08-20 2006-06-06 Silicon Light Machines Corporation Micro-structures with individually addressable ribbon pairs
US6801354B1 (en) 2002-08-20 2004-10-05 Silicon Light Machines, Inc. 2-D diffraction grating for substantially eliminating polarization dependent losses
US6712480B1 (en) 2002-09-27 2004-03-30 Silicon Light Machines Controlled curvature of stressed micro-structures
US6928207B1 (en) 2002-12-12 2005-08-09 Silicon Light Machines Corporation Apparatus for selectively blocking WDM channels
US6987600B1 (en) 2002-12-17 2006-01-17 Silicon Light Machines Corporation Arbitrary phase profile for better equalization in dynamic gain equalizer
US7057819B1 (en) 2002-12-17 2006-06-06 Silicon Light Machines Corporation High contrast tilting ribbon blazed grating
US6934070B1 (en) 2002-12-18 2005-08-23 Silicon Light Machines Corporation Chirped optical MEM device
US6927891B1 (en) 2002-12-23 2005-08-09 Silicon Light Machines Corporation Tilt-able grating plane for improved crosstalk in 1×N blaze switches
US7068372B1 (en) 2003-01-28 2006-06-27 Silicon Light Machines Corporation MEMS interferometer-based reconfigurable optical add-and-drop multiplexor
US7286764B1 (en) 2003-02-03 2007-10-23 Silicon Light Machines Corporation Reconfigurable modulator-based optical add-and-drop multiplexer
US6947613B1 (en) 2003-02-11 2005-09-20 Silicon Light Machines Corporation Wavelength selective switch and equalizer
US6922272B1 (en) 2003-02-14 2005-07-26 Silicon Light Machines Corporation Method and apparatus for leveling thermal stress variations in multi-layer MEMS devices
US7391973B1 (en) 2003-02-28 2008-06-24 Silicon Light Machines Corporation Two-stage gain equalizer
US7027202B1 (en) 2003-02-28 2006-04-11 Silicon Light Machines Corp Silicon substrate as a light modulator sacrificial layer
US7046420B1 (en) 2003-02-28 2006-05-16 Silicon Light Machines Corporation MEM micro-structures and methods of making the same
US6922273B1 (en) 2003-02-28 2005-07-26 Silicon Light Machines Corporation PDL mitigation structure for diffractive MEMS and gratings
US6829077B1 (en) 2003-02-28 2004-12-07 Silicon Light Machines, Inc. Diffractive light modulator with dynamically rotatable diffraction plane
US6806997B1 (en) 2003-02-28 2004-10-19 Silicon Light Machines, Inc. Patterned diffractive light modulator ribbon for PDL reduction
US7042611B1 (en) 2003-03-03 2006-05-09 Silicon Light Machines Corporation Pre-deflected bias ribbons

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3879839A (en) * 1973-06-04 1975-04-29 Ibm Method of manufacturing multi-function LSI wafers
FR2471048A1 (en) * 1979-12-07 1981-06-12 Silicium Semiconducteur Ssc STRUCTURE AND METHOD FOR MOUNTING A MAIN SEMICONDUCTOR COMPONENT AND AN AUXILIARY CIRCUIT

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USH1267H (en) 1990-07-05 1993-12-07 Boyd Melissa D Integrated circuit and lead frame assembly

Also Published As

Publication number Publication date
GB2117564A (en) 1983-10-12

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Effective date: 20020325