GB2163755A - Ultraviolet-curing resin composition - Google Patents
Ultraviolet-curing resin composition Download PDFInfo
- Publication number
- GB2163755A GB2163755A GB08516039A GB8516039A GB2163755A GB 2163755 A GB2163755 A GB 2163755A GB 08516039 A GB08516039 A GB 08516039A GB 8516039 A GB8516039 A GB 8516039A GB 2163755 A GB2163755 A GB 2163755A
- Authority
- GB
- United Kingdom
- Prior art keywords
- resin composition
- ultraviolet
- curing resin
- weight
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000011342 resin composition Substances 0.000 title claims abstract description 40
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical group OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims abstract description 26
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000013307 optical fiber Substances 0.000 claims abstract description 18
- -1 polytetramethylene Polymers 0.000 claims abstract description 17
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000872 buffer Substances 0.000 claims abstract description 16
- 239000003085 diluting agent Substances 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 15
- 239000003999 initiator Substances 0.000 claims abstract description 11
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 10
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 claims abstract description 9
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000178 monomer Substances 0.000 claims abstract description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 7
- 238000012719 thermal polymerization Methods 0.000 claims description 5
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 claims description 4
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 4
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical group C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 claims description 4
- 239000003112 inhibitor Substances 0.000 claims description 4
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 claims description 2
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 claims description 2
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 claims description 2
- 208000017983 photosensitivity disease Diseases 0.000 claims description 2
- 231100000434 photosensitization Toxicity 0.000 claims description 2
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 claims 1
- 239000003505 polymerization initiator Substances 0.000 claims 1
- 238000001723 curing Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- APLQXUAECQNQFE-UHFFFAOYSA-N 2-methoxyanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(OC)=CC=C3C(=O)C2=C1 APLQXUAECQNQFE-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- SWFHGTMLYIBPPA-UHFFFAOYSA-N (4-methoxyphenyl)-phenylmethanone Chemical compound C1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 SWFHGTMLYIBPPA-UHFFFAOYSA-N 0.000 description 1
- GJZFGDYLJLCGHT-UHFFFAOYSA-N 1,2-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(CC)C(CC)=CC=C3SC2=C1 GJZFGDYLJLCGHT-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- PBKGYWLWIJLDGZ-UHFFFAOYSA-N 2-(dimethylamino)propan-1-ol Chemical compound OCC(C)N(C)C PBKGYWLWIJLDGZ-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- VZMLJEYQUZKERO-UHFFFAOYSA-N 2-hydroxy-1-(2-methylphenyl)-2-phenylethanone Chemical compound CC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 VZMLJEYQUZKERO-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- 125000004200 2-methoxyethyl group Chemical group [H]C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- PYSGFFTXMUWEOT-UHFFFAOYSA-N 3-(dimethylamino)propan-1-ol Chemical compound CN(C)CCCO PYSGFFTXMUWEOT-UHFFFAOYSA-N 0.000 description 1
- YDIYEOMDOWUDTJ-UHFFFAOYSA-N 4-(dimethylamino)benzoic acid Chemical compound CN(C)C1=CC=C(C(O)=O)C=C1 YDIYEOMDOWUDTJ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- OFSAUHSCHWRZKM-UHFFFAOYSA-N Padimate A Chemical compound CC(C)CCOC(=O)C1=CC=C(N(C)C)C=C1 OFSAUHSCHWRZKM-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- WURBFLDFSFBTLW-UHFFFAOYSA-N benzil Chemical compound C=1C=CC=CC=1C(=O)C(=O)C1=CC=CC=C1 WURBFLDFSFBTLW-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- DBQGARDMYOMOOS-UHFFFAOYSA-N methyl 4-(dimethylamino)benzoate Chemical compound COC(=O)C1=CC=C(N(C)C)C=C1 DBQGARDMYOMOOS-UHFFFAOYSA-N 0.000 description 1
- 229940086559 methyl benzoin Drugs 0.000 description 1
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 1
- 230000002165 photosensitisation Effects 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
- C08F299/06—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyurethanes
- C08F299/065—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyurethanes from polyurethanes with side or terminal unsaturations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/104—Coating to obtain optical fibres
- C03C25/106—Single coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
- Polymerisation Methods In General (AREA)
- Paints Or Removers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
An ultraviolet-curing resin composition comprises an acrylic oligomer, tris(2-hydroxyethyl)isocyanurate triacrylate, a reactive diluent and a photopolymerization initiator, wherein the acrylic oligomer is a urethane acrylate obtained from diphenylmethane diisocyanate, a polytetramethylene glycol having a molecular weight of 650 to 1,300 and a monoacrylate having a hydroxy group, the amount of tris(2-hydroxyethyl) isocyanurate triacrylate is 1 to less than 25 parts by weight for 100 parts by weight of the urethane acrylate, and the reactive diluent is an acrylic monomer. The composition may be used as a buffer material for optical fiber units.
Description
SPECIFICATION
Ultraviolet-curing resin composition
The present invention relates to an ultraviolet-curing resin composition, and more particularly, an ultraviolet-curing resin composition suitable for use as a buffer material for optical fiber units.
Optical fibers are used usually in the form of optical fiber units.
The optical fiber unit comprises an assembly of optical fiber cores arranged around a central member and a buffer material formed around them.
A copper wire is used usually as the central member. The optical fiber core comprises a core/sheath structure composed of two kinds of glass or plastic fibers having different refractive indexes and a cladding layer formed around this core body. These optical fibers halve a property of transmitting light from one end to the other end thereof without scattering. Communication techniques are now being developed practically taking advantage of this property.
Plastic yarns made of a thermoplastic resin have been used as the buffer material. Their low molding rates have inevitably invited a high cost unfavorably.
There has been proposed an idea of using an ultraviolet-curing resin composition as the buffer material so as to increase the molding rate and to improve the workability.
However, the ultraviolet-curing resin composition has only poor moisture resistance, elongation and elasticity, through it has an improved workability. No buffer material comprising an ultraviolet-curing resin composition which satisfies all of these requirements has been found yet.
For example, an epoxy acrylate composition has a defect that its modulus of elasticity is too high and elongation is insufficient.
Urethane acrylate composition have a problem that its resistance to moist heat and its photocuring rate are low.
An object of the present invention is to provide an ultraviolet-curing resin composition having an excellent resistance to moist heat, a modulus of elasticity within a range suitable for the purpose and a high elongation, which composition is suitable for use as a buffer material for optical fiber units.
The photo-curing resin composition of the present invention comprises an acrylic oligomer, tris(2-hydroxyethyl) isocyanurate triacrylate (hereinafter referred to as THEIC-TA), a reactive diluent and a photopolymerization initiator.
The acrylic oligomers are urethane acrylates obtained from diphenylmethane diisocyanate, a polytetramethylene glycol having a molecular weight of 650 to 1,300 and a monoacrylate having a hydroxy group. The urethane acrylate (I) is obtained by reacting a urethane prepolymer (IV) having a terminal NCO group obtained from diphenylmethane diisocyanate (II), a polytetramethylene glycol (Ill) having a molecular weight of 650 to 1,300 with a monoacrylate (V) having a hydroxy group as shown in the following formulae:
The diisocyanate used in the present invention is diphenylmethane diisocyanate (II) as men tioned above which exerts excellent effects on the physical properties of the resulting resin composition.Urethane acrylates obtained from toluene diisocyanate have a modulus of elasticity lower than that of the urethane acrylate used in the present invention.
When a polytetramethylene glycol (III) having a molecular weight of 650 to 1,300 is used in the production of the urethane acrylate (I) according to the present invention, preferred effects are obtained on the physical properties of the buffer material for the optical fiber units.
For example, when a lactonepolyol is used in the production of urethane acrylate, only a poor
U.V.-curability is obtained, while when polypropylene glycol or polyesterpolyol is used, only poor resistance to moist heat and resistance to water are obtained.
When polytetramethylene glycol (III) having a molecular weight in the range of 650 to 1300 is used, the resulting resin composition has high and well-balanced elongation and mpdulus of elasticity.
Polytetramethylene glycol having a molecular weight of lower than 650 cannot be produced easily. When polytetramethylene glycol having a molecular weight of higher than 1.,300 is used, the resulting resin composition has only a low modulus of elasticity and a poor elongation.
The monoacrylates (V) having a hydroxy group used according to the present invention include 2-hydroxyethyl acrylate and 2-hydroxypropyl acrylate.
THEIC-TA used in the present invention is represented by the following formula:
The amount of THEIC-TA is 1 to 25 parts by weight, preferably 2 to 15 parts by weight, for 100 parts by weight of the urethane acrylate (I).
When the amount of THEIC-TA used is less than 1 part by weight, the cured resin composition will have a modulus of elasticity of less than 1 kg/mm2, while when it exeeds 25 parts by weight, the composition will have a modulus of elasticity of higher than 25 kg/mm2 and an elongation of less than 40% and become useless as the buffer material for the optical fiber units.
The acrylic monomers used as the reactive diluents in the present invention are U.V.-curable.
Examples of them include isobutyl, t-butyl, 2-ethylhexyl, lauryl, stearyl, 2-hydroxyethyl, 2-hydroxypropyl, 2-methoxyethyl, 2-butoxyethyl, 2-phenoxyethyl, dicyclopentenyl and dicyclopentenyloxye thyl acrylates. Among them, 2-phenoxy-ethyl and dicyclopentenyl acrylates are preferred.
These acrylic monomers may be used either alone or in the form of a mixture of two or more of them. They are used in an amount of 10 to 100 parts by weight for 100 parts by weight of the urethane acrylate.
When the amount of the acrylic monomer is less than 10 parts by weight, any good workability of the resin composition of the present invention cannot be obtained, while when it exceeds 100 parts by weight, any good workability and high modulus of a elasticity cannot be obtained.
The photopolymerization initiators used in the present invention include benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzophenone, 4-methoxybenzophenone, 1-hydroxycyclohexyl phenyl ketone, benzil dimethyl ketal, benzil fi-methoxyethyl acetal, methylbenzoin, acetophenone, 2,2-diethoxyacetophenone, diethylthioxanthone, 4-isopropyl-2-hydroxy-2-methyl- propiophenone, 2-hydroxy-2-methylpropiophenone and 2-methoxyanthraquinone. Among them, 1hydroxycyclohexyl phenyl ketone and benzil dimethyl ketal are preferred.
The photopolymerization initiators may be used either alone or in the form of a mixture of two or more of them. They are used in an amount of 0.5 to 10 parts by weight for 100 parts by weight of the total of the above-mentioned urethane acrylate, THEIC-TA and reactive diluent.
When the amount of the photopolymerization initiator is less than 0.5 part by weight, the cure rate of the resin composition of the present invention is low while when it exceeds 10 parts by weight, not only the resistance to moist heat is reduced but also the cost of the resin composition is increased.
According to the present invention, a thermal polymerization inhibitor and a photosensitization assistant may be incorporated in the composition, if necessary.
The thermal polymerization inhibitors include hydroquinone, methoquinone, p-benzoquinone and t-butylhydroquinone. They are used in an amount of 0.001 to 1.0% based on the total of urethane acrylate, THEIC-TA and the reactive diluent.
The thermal polymerization inhibitors exhibit an effect of improving the thermal stability of the resin composition of the present invention during the storage.
The photosensitizing assistants act as catalysts for accelerating the curing by U.V. rays.
Examples of them include triethylamine, 2-dimethyl-aminoethanol, N-methyldiethanolamine, triethanolamine, 3-dimethylamino- 1 -propanol, 2-dimethylamino- 1 -propanol, p-dimethylaminobenzoic acid, isoamyl p-dimethylamino-benzoate and methyl p-dimethylaminobenzoate.
As described above, the U.V. curing resin composition of the present invention comprises the acrylic oligomer, THEIC-TA, the reactive diluent and the photopolymerization initiator. In this composition, acrylic oligomer is a urethane acrylate obtained from diphenylmethane diisocyanate, polytetramethylene glycol having a molecular weight of 650 to 1300 and a monoacrylate having a hydroxy group and the amount of THEIC-TA used is 1 to less than 25 parts by weight for 100 parts by weight of the urethane acrylate. Further, the reactive diluent is the acrylic monomer. Accordingly, the following effects can be obtained according to the present invention and the U.V.-cured resin composition is suitable for use as a buffer material for the optical fiber units:
A. The U.V.-cured resin composition has excellent resistance to moist heat and resistance to
water.
B. A modulus of elasticity of 1 to 25 kg/mm2 is obtained. With the modulus of elasticity within
this range, the resin composition of the present invention is useful as a preferred buffer
material for optical fiber units.
C. The elongation is as high as at least 40% and is well-balanced with the value of modulus of
elasticity mentioned in the above item B. This fact indicates that the resin composition of the
present invention is suitable for use as the buffer material for optical fiber units.
D. A sufficient U.V.-cure rate can be obtained and a high workability is kept.
E. The resin composition of the present invention is closely adhered to the optical fiber core to
exhibit an excellent waterstopping property.
The measurement methods employed in the present invention are as follows:
Modulus of elasticity (kg/mm2): The modulus in torsion was determined by free damping method with TBA (torsional braid analyzer).
Elongation (%): The tests were conducted according to JIS K-7113. A dumbbell with indicators of 40 mm intervals was tensioned and the distances between the indicators were measured. The elongation at break was employed as the value of elongation. The tension rate was 50 mm/min and the measurement temperature was 25+0.5 C.
Elongation retention after leaving to stand at 800C and 95% RH for 2 weeks (%): A sample in the form of dumbbells was placed in an air-conditioned oven at 80"C and 95% RH for 2 weeks.
The sample was then taken out and its elongation was measured by the above-mentioned elongation-measuring method.
The following examples will further illustrate the present invention.
Example 1: Preparation of urethane acrylate (I)
2 mol of diphenylmethane diisocyanate (Il) was placed in a 3 1 four-necked flask provided with a stirrer, thermometer and dropping funnel. 1 mol of polytetramethylene glycol (III) having a molecular weight of 850 was added dropwise thereto under heating to 60"C and under stirring for 4 h while N2 gas was introduced therein to carry out the reaction.
A urethane prepolymer (IV) was thus obtained.
The completion of the reaction was confirmed from NCO %.
Then, 2 mol of 2-hydroxyethyl acrylate (V) was added dropwise therein and the reaction carried out for 6 h to obtain a urethane acrylate (I).
The reaction product was analyzed according to an infrared spectrophotometry. No peak of
NCO was observed.
Examples 2, 3 and 4 and Comparative Examples 1, 2 and 3:
A resin composition comprising the urethane acrylate prepared in Example 1 and various amounts of THEIC-TA, a reactive diluent and a photopolymerization initiator was cured by irradiation with U.V. rays and its modulus of elasticity, elongation and resistance to moist heat were examined.
The relationship between a change of the resin composition and physical properties thereof is shown in the following Table 1.
In Comparative Example 1, THEIC-TA was not used. In Comparative Example 2, the amount of
THEIC-TA exceeded the range of the present invention. In Comparative Examples 3, another urethane acrylate was used. The results of Comparative Examples 1, 2 and 3 are also shown in the following table:
Table
- - - Comp. Ex. Ex. Ex. Ex. Comp. Ex. Comp. Ex.
1 234 2 3 Urethane acrylate 100 100 100 100 100 Xoo4) FA-731A ) - 1.5 16 25 30 1.5 PoA2) 40 40 50 42 45 40 Irgacure 184 ) 7 7 8 8 9 7 Modulus. of elasticity 0.8 1.S 15 25 30 1.2 (kg/mm2) Elongation (%) 60 - 59 48 41 36 56 Elongation retention (%) after leaving to stand at 80" C at 95% RH for 80 82 85 90 90 30 2 weeks Notes: 1) FA-731A: THEIC-TA [tris(2-hydroxyethyl) isocyanurate triacrylate]; a product of Hitachi Chemical Co., Ltd.
2) POA: 2-phenoxyethyl acrylate (reactive diluent); a product of Kyoeisha Yushi Co., Ltd.
3) Irgacure 184: 1-hydroxycyclohexyl phenyl ketone (photopolymerization initiator); a product of
Ciba-Geigy.
4) a urethane acrylate synthesized from 1 mol of polypropylene glycol (molecular weight: 1000), 2 mol of diphenylmethane diisocyanate and 2 mol of 2-hydroxyethyl acrylate.
It is apparent from Table 1 that the resin compositions of the present invention have a modulus of elasticity of 1 to 25 kg/mm2 after the U.V. curing, an elongation of at least 40% and an excellent resistance to moist heat. They are, therefore, suitable for use as buffer materials for optical fiber units.
On the other hand, the resin composition in Comparative Example 1 had inferior modulus of elasticity and resistance to moist heat, that in Comparative Example 2 had an excessively high modulus of elasticity and only a low elongation and that in Comparative Example 3 had a poor resistance to moist heat. They are unsuitable for use as the buffer material for optical fiber units.
Claims (13)
1. An ultraviolet-curing resin composition comprising an acrylic oligomer, tris(2-hydroxyethyl) isocyanurate triacrylate, a reactive diluent and a photopolymerization initiator, wherein said acrylic oligomer is a urethane acrylate obtained from diphenyl-methane diisocyanate, a polytetramethylene glycol having a molecular weight of 650 to 1,300 and a monoacrylate having a hydroxy group and the amount of said tris(2-hydroxyethyl) isocyanurate triacrylate is 1 to 25 parts by weight for 100 parts by weight of said urethane acrylate and said reactive diluent is an acrylic monomer.
2. An ultraviolet-curing resin composition according to claim 1, wherein the monoacrylate having a hydroxy group is selected from the group consisting of 2-hydroxyethyl acrylate and 2hydroxypropyl acrylate.
3. An ultraviolet-curing resin composition according to claim 1, wherein the amount of said tris(2-hydroxyethyl) isocyanurate triacrylate is 1 to 15 parts by weight for 100 parts by weight of the urethane acrylate.
4. An ultraviolet-curing resin composition according to claim 1, wherein the acrylic monomer used as the reactive diluent is selected from the group consisting of 2-phenoxyethyl acrylate and dicyclopentenyl acrylate.
5. An ultraviolet-curing composition according to claim 1, wherein the amount of the acrylic monomer used as the reactive diluent is 10 to 100 parts by weight for 100 parts by weight of the urethane acrylate.
6. An ultraviolet-curing resin composition according to claim 1, wherein the photopolymeriza tion initiator is selected from the group consisting of 1-hydroxycyclohexyl phenyl ketone and benzyldimethylketal.
7. An ultraviolet-curing resin composition according to claim 1, wherein the amount of the photopolymerization initiator used is 0.5 to 10 parts by weight for 100 parts by weight of the total of said urethane acrylate, tris(2-hydroxyethyl) isocyanurate triacrylate and reactive diluent.
8. An ultraviolet-curing resin composition according to claim 1, which contains a thermal polymerization inhibitor selected from the group consisting of hydroquinone, methoquinone, pbenzoquinone and t-butylhydroquinone.
9. An ultraviolet-curing resin composition according to claim 8, wherein the amount of the thermal polymerization initiator used is 0.001 to 1.0% based on the total of said urethane acrylate, tris(2-hydroxyethyl) isocyanurate triacrylate and reactive diluent.
10. An ultraviolet-curing resin composition according to claim 1, which further contains a photosensitization assistant.
11. An ultraviolet-curing resin composition according to Claim 1, which is also according to any two or more of Claims 2 to 10.
12. An ultraviolet-curing resin composition according to Claim 1, substantially as described in any one of the foregoing Examples 1 to 4.
13. A buffer material for an optical fibre unit, which buffer is formed of an ultraviolet-curing resin composition according to any preceding claim.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59135863A JPS6114210A (en) | 1984-06-30 | 1984-06-30 | Ultraviolet-curable resin composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8516039D0 GB8516039D0 (en) | 1985-07-31 |
| GB2163755A true GB2163755A (en) | 1986-03-05 |
| GB2163755B GB2163755B (en) | 1987-10-28 |
Family
ID=15161520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08516039A Expired GB2163755B (en) | 1984-06-30 | 1985-06-25 | Ultraviolet-curing resin composition |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS6114210A (en) |
| KR (1) | KR920000014B1 (en) |
| GB (1) | GB2163755B (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0168226A3 (en) * | 1984-07-10 | 1987-05-27 | Minnesota Mining And Manufacturing Company | Ultra-violet light curable compositions for abrasion resistant articles |
| GB2195643A (en) * | 1986-07-21 | 1988-04-13 | Yokohama Rubber Co Ltd | Uv curable urethane acrylate composition |
| EP0336653A3 (en) * | 1988-04-04 | 1990-11-07 | Uvexs Incorporated | Optical fiber buffer coating with low tg |
| WO1990013579A1 (en) * | 1989-05-12 | 1990-11-15 | Desoto, Inc. | Photocurable pigmented secondary optical fiber coatings |
| DE4007519A1 (en) * | 1990-03-09 | 1991-09-12 | Rheydt Kabelwerk Ag | UV-cured resin mixts. for coating optical fibres - contain acrylic] oligomers, acrylate] monomers, initiator, dye, water-repellent components, lubricants, stabilisers, coupling agents, etc. |
| GB2270917A (en) * | 1992-09-23 | 1994-03-30 | Sericol Ltd | Urethane(meth)acrylates |
| WO1994019185A1 (en) * | 1991-12-16 | 1994-09-01 | Dsm N.V. | Liquid curable resin composition |
| WO1999008975A1 (en) * | 1997-08-15 | 1999-02-25 | Dsm N.V. | Radiation-curable resin composition |
| WO2000075211A1 (en) * | 1999-06-03 | 2000-12-14 | Dsm N.V. | Photocurable resin composition and optical parts |
| US6579618B1 (en) | 1997-08-15 | 2003-06-17 | Dsm N.V. | Coated optical fiber and radiation curable resin composition |
| CN100335930C (en) * | 1997-02-28 | 2007-09-05 | 古河电气工业株式会社 | Fiber optic core binder and fiber optic components |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2615180B2 (en) * | 1987-05-01 | 1997-05-28 | 三菱レイヨン株式会社 | Actinic ray curable composition for cast polymerization |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5887117A (en) * | 1981-11-20 | 1983-05-24 | Dainippon Ink & Chem Inc | Curable resin composition |
| JPS5941366A (en) * | 1982-08-31 | 1984-03-07 | Mitsui Petrochem Ind Ltd | Curable coating resin composition |
-
1984
- 1984-06-30 JP JP59135863A patent/JPS6114210A/en active Granted
-
1985
- 1985-06-25 GB GB08516039A patent/GB2163755B/en not_active Expired
- 1985-06-27 KR KR1019850004601A patent/KR920000014B1/en not_active Expired
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU583829B2 (en) * | 1984-07-10 | 1989-05-11 | Minnesota Mining And Manufacturing Company | Ultra-violet light curable compositions for abrasion resistant articles |
| EP0168226A3 (en) * | 1984-07-10 | 1987-05-27 | Minnesota Mining And Manufacturing Company | Ultra-violet light curable compositions for abrasion resistant articles |
| GB2195643A (en) * | 1986-07-21 | 1988-04-13 | Yokohama Rubber Co Ltd | Uv curable urethane acrylate composition |
| US4902440A (en) * | 1986-07-21 | 1990-02-20 | The Yokohama Rubber Co., Ltd. | UV-curable resin compositions |
| GB2195643B (en) * | 1986-07-21 | 1990-08-15 | Yokohama Rubber Co Ltd | Uv-curable resin compositions |
| EP0336653A3 (en) * | 1988-04-04 | 1990-11-07 | Uvexs Incorporated | Optical fiber buffer coating with low tg |
| WO1990013579A1 (en) * | 1989-05-12 | 1990-11-15 | Desoto, Inc. | Photocurable pigmented secondary optical fiber coatings |
| DE4007519A1 (en) * | 1990-03-09 | 1991-09-12 | Rheydt Kabelwerk Ag | UV-cured resin mixts. for coating optical fibres - contain acrylic] oligomers, acrylate] monomers, initiator, dye, water-repellent components, lubricants, stabilisers, coupling agents, etc. |
| US5787218A (en) * | 1991-12-16 | 1998-07-28 | Dsm Nv | Liquid curable urethane (meth)acrylate containing resin composition |
| WO1994019185A1 (en) * | 1991-12-16 | 1994-09-01 | Dsm N.V. | Liquid curable resin composition |
| GB2270917A (en) * | 1992-09-23 | 1994-03-30 | Sericol Ltd | Urethane(meth)acrylates |
| CN100335930C (en) * | 1997-02-28 | 2007-09-05 | 古河电气工业株式会社 | Fiber optic core binder and fiber optic components |
| WO1999008975A1 (en) * | 1997-08-15 | 1999-02-25 | Dsm N.V. | Radiation-curable resin composition |
| US6579618B1 (en) | 1997-08-15 | 2003-06-17 | Dsm N.V. | Coated optical fiber and radiation curable resin composition |
| WO2000075211A1 (en) * | 1999-06-03 | 2000-12-14 | Dsm N.V. | Photocurable resin composition and optical parts |
| US6710097B2 (en) | 1999-06-03 | 2004-03-23 | Dsm N.V. | Photocurable resin composition and optical parts |
Also Published As
| Publication number | Publication date |
|---|---|
| KR920000014B1 (en) | 1992-01-06 |
| GB2163755B (en) | 1987-10-28 |
| KR860000336A (en) | 1986-01-28 |
| JPH0449867B2 (en) | 1992-08-12 |
| GB8516039D0 (en) | 1985-07-31 |
| JPS6114210A (en) | 1986-01-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19960625 |