GB2156742B - Etching plastics encapsulated electronic packages - Google Patents

Etching plastics encapsulated electronic packages

Info

Publication number: GB2156742B
Authority: GB; United Kingdom
Prior art keywords: electronic packages; encapsulated electronic; etching; plastics encapsulated; etching plastics
Prior art date: 1984-04-06
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

GB08408993A

Other versions

GB2156742A (en

GB8408993D0 (en

Inventor

Kenneth George Snowdon

Stephen Rolt

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

STC PLC

Original Assignee

Standard Telephone and Cables PLC

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1984-04-06

Filing date

1984-04-06

Publication date

1987-01-28

1984-04-06 Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC

1984-04-06 Priority to GB08408993A priority Critical patent/GB2156742B/en

1984-05-16 Publication of GB8408993D0 publication Critical patent/GB8408993D0/en

1985-10-16 Publication of GB2156742A publication Critical patent/GB2156742A/en

1987-01-28 Application granted granted Critical

1987-01-28 Publication of GB2156742B publication Critical patent/GB2156742B/en

Status Expired legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
- H10W74/01—
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
General Chemical & Material Sciences (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Laser Beam Processing (AREA)

GB08408993A 1984-04-06 1984-04-06 Etching plastics encapsulated electronic packages Expired GB2156742B (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
GB08408993A GB2156742B (en)	1984-04-06	1984-04-06	Etching plastics encapsulated electronic packages

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
GB08408993A GB2156742B (en)	1984-04-06	1984-04-06	Etching plastics encapsulated electronic packages

Publications (3)

Publication Number	Publication Date
GB8408993D0 GB8408993D0 (en)	1984-05-16
GB2156742A GB2156742A (en)	1985-10-16
GB2156742B true GB2156742B (en)	1987-01-28

Family

ID=10559314

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB08408993A Expired GB2156742B (en)	1984-04-06	1984-04-06	Etching plastics encapsulated electronic packages

Country Status (1)

Country	Link
GB (1)	GB2156742B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
SG111023A1 (en) *	2001-07-11	2005-05-30	Inst Data Storage	Method and apparatus for decapping integrated circuit packages
CN114486439B (en) *	2022-01-27	2023-08-29	上海季丰电子股份有限公司	Method for taking crystal grains in back-illuminated CMOS sensor and application

1984
- 1984-04-06 GB GB08408993A patent/GB2156742B/en not_active Expired

Also Published As

Publication number	Publication date
GB2156742A (en)	1985-10-16
GB8408993D0 (en)	1984-05-16

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Legal Events

Date	Code	Title	Description
1991-12-04	PCNP	Patent ceased through non-payment of renewal fee