GB2141140B - Electrodeposition of copper - Google Patents

Electrodeposition of copper

Info

Publication number: GB2141140B
Authority: GB; United Kingdom
Prior art keywords: electrodeposition; copper
Prior art date: 1983-06-10
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

GB08414862A

Other versions

GB2141140A (en

GB8414862D0 (en

Inventor

Daniel J Combs

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

OMI International Corp

Original Assignee

OMI International Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1983-06-10

Filing date

1984-06-11

Publication date

1986-12-10

1984-06-11 Application filed by OMI International Corp filed Critical OMI International Corp

1984-07-18 Publication of GB8414862D0 publication Critical patent/GB8414862D0/en

1984-12-12 Publication of GB2141140A publication Critical patent/GB2141140A/en

1986-12-10 Application granted granted Critical

1986-12-10 Publication of GB2141140B publication Critical patent/GB2141140B/en

Status Expired legal-status Critical Current

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)
Electrolytic Production Of Metals (AREA)
Chemically Coating (AREA)

GB08414862A 1983-06-10 1984-06-11 Electrodeposition of copper Expired GB2141140B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US50121183A	1983-06-10	1983-06-10

Publications (3)

Publication Number	Publication Date
GB8414862D0 GB8414862D0 (en)	1984-07-18
GB2141140A GB2141140A (en)	1984-12-12
GB2141140B true GB2141140B (en)	1986-12-10

Family

ID=23992559

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB08414862A Expired GB2141140B (en)	1983-06-10	1984-06-11	Electrodeposition of copper

Country Status (10)

Country	Link
JP (1)	JPS6013090A (en)
AU (1)	AU554236B2 (en)
BR (1)	BR8402811A (en)
CA (1)	CA1255621A (en)
DE (1)	DE3420999A1 (en)
ES (1)	ES533252A0 (en)
FR (1)	FR2547318B1 (en)
GB (1)	GB2141140B (en)
IT (1)	IT1177785B (en)
NL (1)	NL8401841A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE4126502C1 (en) *	1991-08-07	1993-02-11	Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
JPH10330983A (en)	1997-05-30	1998-12-15	Fukuda Metal Foil & Powder Co Ltd	Electrolytic copper foil and method for producing the same
DE19758121C2 (en) *	1997-12-17	2000-04-06	Atotech Deutschland Gmbh	Aqueous bath and method for electrolytic deposition of copper layers
RU2215829C1 (en) *	2002-02-21	2003-11-10	Калининградский государственный университет	Bright copper plating electrolyte
DE10261852B3 (en)	2002-12-20	2004-06-03	Atotech Deutschland Gmbh	Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling
DE10337669B4 (en) *	2003-08-08	2006-04-27	Atotech Deutschland Gmbh	Aqueous, acid solution and process for the electrodeposition of copper coatings and use of the solution
JP4644447B2 (en) *	2004-06-25	2011-03-02	株式会社日立製作所	Method for manufacturing printed wiring board
GB0520793D0 (en) *	2005-10-13	2005-11-23	Avecia Inkjet Ltd	Phthalocyanine inks and their use in ink-jet printing

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
NL178453B (en) *	1952-05-26		Mita Industrial Co Ltd	PROCEDURE FOR ELECTROSTATIC COPYING.
NL174178B (en) *	1952-05-26		Chevron Res	PROCEDURE FOR THE RECOVERY OF HYDROCARBONS FROM A PERMEABLE HYDROCARBON FORMATION BY INJECTION WITH STEAM.
US2738318A (en) *	1954-12-28	1956-03-13	Udylite Res Corp	Electrodeposition of copper from an acid bath
US2882209A (en) *	1957-05-20	1959-04-14	Udylite Res Corp	Electrodeposition of copper from an acid bath
NL291575A (en) *	1962-04-16
US3328273A (en) *	1966-08-15	1967-06-27	Udylite Corp	Electro-deposition of copper from acidic baths
US3770598A (en) *	1972-01-21	1973-11-06	Oxy Metal Finishing Corp	Electrodeposition of copper from acid baths
AU496780B2 (en) *	1975-03-11	1978-10-26	Oxy Metal Industries Corporation	Additives in baths forthe electrodeposition of copper
DE2746938C2 (en) *	1977-10-17	1987-04-09	Schering AG, 1000 Berlin und 4709 Bergkamen	Aqueous acid bath for the galvanic deposition of shiny and crack-free copper coatings and use of this bath
US4272335A (en) *	1980-02-19	1981-06-09	Oxy Metal Industries Corporation	Composition and method for electrodeposition of copper
US4336114A (en) *	1981-03-26	1982-06-22	Hooker Chemicals & Plastics Corp.	Electrodeposition of bright copper

1984
- 1984-06-04 AU AU29033/84A patent/AU554236B2/en not_active Ceased
- 1984-06-06 DE DE19843420999 patent/DE3420999A1/en active Granted
- 1984-06-07 JP JP59117435A patent/JPS6013090A/en active Granted
- 1984-06-07 CA CA000456108A patent/CA1255621A/en not_active Expired
- 1984-06-08 IT IT48351/84A patent/IT1177785B/en active
- 1984-06-08 NL NL8401841A patent/NL8401841A/en not_active Application Discontinuation
- 1984-06-08 BR BR8402811A patent/BR8402811A/en unknown
- 1984-06-08 ES ES533252A patent/ES533252A0/en active Granted
- 1984-06-08 FR FR848409048A patent/FR2547318B1/en not_active Expired - Lifetime
- 1984-06-11 GB GB08414862A patent/GB2141140B/en not_active Expired

Also Published As

Publication number	Publication date
GB2141140A (en)	1984-12-12
NL8401841A (en)	1985-01-02
BR8402811A (en)	1985-05-21
JPS6013090A (en)	1985-01-23
CA1255621A (en)	1989-06-13
IT8448351A1 (en)	1985-12-08
DE3420999A1 (en)	1984-12-13
GB8414862D0 (en)	1984-07-18
FR2547318B1 (en)	1990-05-04
DE3420999C2 (en)	1987-10-15
ES8601336A1 (en)	1985-10-16
AU554236B2 (en)	1986-08-14
IT8448351A0 (en)	1984-06-08
IT1177785B (en)	1987-08-26
JPS6112036B2 (en)	1986-04-05
FR2547318A1 (en)	1984-12-14
ES533252A0 (en)	1985-10-16
AU2903384A (en)	1984-12-13

Publication	Publication Date	Title
HK66586A (en)	1986-09-18	Electrodeposition of copper
GB2097020B (en)	1984-06-27	Electrodeposition of bright copper
GB8513501D0 (en)	1985-07-03	Copper electroplating
EP0137981A3 (en)	1986-08-13	Through-hole plating
GB8531356D0 (en)	1986-02-05	Copper plating
GB8426184D0 (en)	1984-11-21	Electrodeposition of mica on coil
GB8402208D0 (en)	1984-02-29	Positioning of equipment
GB8334226D0 (en)	1984-02-01	Electrodeposition of gold alloys
GB8422528D0 (en)	1984-10-10	Continuous electroplating of alloys
GB8313861D0 (en)	1983-06-22	Codeposition of dissolved metal
GB2141140B (en)	1986-12-10	Electrodeposition of copper
GB8303264D0 (en)	1983-03-09	Electrodeposition of polyesters
DE3473303D1 (en)	1988-09-15	Electrolytic copper plating
GB2150145B (en)	1987-04-01	Electrodeposition of mica
GB8517612D0 (en)	1985-08-21	Electrodeposition of metals
GB2141141B (en)	1987-01-07	Electrodepositing copper
GB8529856D0 (en)	1986-01-15	Cyanide-free copper plating process
GB8414871D0 (en)	1984-07-18	Gold plating baths
DE3377068D1 (en)	1988-07-21	Method of electroplating
GB8326110D0 (en)	1983-11-02	Electrolytic refining of copper
ZA834937B (en)	1984-03-28	Edtp-containing electroless copper baths
GB8320821D0 (en)	1983-09-01	Plating
GB8423805D0 (en)	1984-11-14	Pretreatment of ores
GB8432395D0 (en)	1985-02-06	Copper plating
GB8432400D0 (en)	1985-02-06	Copper plating

Legal Events

Date	Code	Title	Description
1989-02-01	PCNP	Patent ceased through non-payment of renewal fee