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GB2140039B - Solution suitable for polishing copper and its alloys - Google Patents

Solution suitable for polishing copper and its alloys

Info

Publication number
GB2140039B
GB2140039B GB08412497A GB8412497A GB2140039B GB 2140039 B GB2140039 B GB 2140039B GB 08412497 A GB08412497 A GB 08412497A GB 8412497 A GB8412497 A GB 8412497A GB 2140039 B GB2140039 B GB 2140039B
Authority
GB
United Kingdom
Prior art keywords
alloys
solution suitable
polishing copper
polishing
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08412497A
Other versions
GB2140039A (en
GB8412497D0 (en
Inventor
Edward Zacny
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Akademia Gomiczo Hutnicza
Original Assignee
Akademia Gomiczo Hutnicza
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akademia Gomiczo Hutnicza filed Critical Akademia Gomiczo Hutnicza
Publication of GB8412497D0 publication Critical patent/GB8412497D0/en
Publication of GB2140039A publication Critical patent/GB2140039A/en
Application granted granted Critical
Publication of GB2140039B publication Critical patent/GB2140039B/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Surface Treatment Of Glass (AREA)
GB08412497A 1983-05-19 1984-05-16 Solution suitable for polishing copper and its alloys Expired GB2140039B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL24204883A PL137972B1 (en) 1983-05-19 1983-05-19 Agent for polishing copper and its alloys

Publications (3)

Publication Number Publication Date
GB8412497D0 GB8412497D0 (en) 1984-06-20
GB2140039A GB2140039A (en) 1984-11-21
GB2140039B true GB2140039B (en) 1986-09-03

Family

ID=20017100

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08412497A Expired GB2140039B (en) 1983-05-19 1984-05-16 Solution suitable for polishing copper and its alloys

Country Status (3)

Country Link
DE (1) DE3418574C2 (en)
GB (1) GB2140039B (en)
PL (1) PL137972B1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6530824B2 (en) 2001-03-09 2003-03-11 Rodel Holdings, Inc. Method and composition for polishing by CMP
KR100762424B1 (en) * 2001-03-12 2007-10-02 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 Polishing method by CPM and composition for same
PL246166B1 (en) 2023-03-01 2024-12-09 Akademia Gorniczo Hutnicza Im Stanislawa Staszica W Krakowie Polishing solution for copper and its alloys and polishing method

Also Published As

Publication number Publication date
GB2140039A (en) 1984-11-21
GB8412497D0 (en) 1984-06-20
DE3418574C2 (en) 1986-06-19
PL137972B1 (en) 1986-08-30
PL242048A1 (en) 1984-12-03
DE3418574A1 (en) 1984-11-22

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee