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GB2035684B - Subdividing semiconductor wafers - Google Patents

Subdividing semiconductor wafers

Info

Publication number
GB2035684B
GB2035684B GB7935539A GB7935539A GB2035684B GB 2035684 B GB2035684 B GB 2035684B GB 7935539 A GB7935539 A GB 7935539A GB 7935539 A GB7935539 A GB 7935539A GB 2035684 B GB2035684 B GB 2035684B
Authority
GB
United Kingdom
Prior art keywords
subdividing
semiconductor wafers
wafers
semiconductor
subdividing semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7935539A
Other versions
GB2035684A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ExxonMobil Technology and Engineering Co
Original Assignee
Exxon Research and Engineering Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/951,074 external-priority patent/US4236296A/en
Priority claimed from US05/951,064 external-priority patent/US4237601A/en
Application filed by Exxon Research and Engineering Co filed Critical Exxon Research and Engineering Co
Publication of GB2035684A publication Critical patent/GB2035684A/en
Application granted granted Critical
Publication of GB2035684B publication Critical patent/GB2035684B/en
Expired legal-status Critical Current

Links

Classifications

    • H10P95/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/0201Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/811Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/822Materials of the light-emitting regions
    • H10H20/824Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10P50/648
    • H10P54/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/0201Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • H01S5/0202Cleaving

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Dicing (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
GB7935539A 1978-10-13 1979-10-12 Subdividing semiconductor wafers Expired GB2035684B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/951,074 US4236296A (en) 1978-10-13 1978-10-13 Etch method of cleaving semiconductor diode laser wafers
US05/951,064 US4237601A (en) 1978-10-13 1978-10-13 Method of cleaving semiconductor diode laser wafers

Publications (2)

Publication Number Publication Date
GB2035684A GB2035684A (en) 1980-06-18
GB2035684B true GB2035684B (en) 1983-08-03

Family

ID=27130309

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7935539A Expired GB2035684B (en) 1978-10-13 1979-10-12 Subdividing semiconductor wafers

Country Status (8)

Country Link
CA (1) CA1140661A (en)
DE (1) DE2941476A1 (en)
FR (1) FR2438914A1 (en)
GB (1) GB2035684B (en)
IL (1) IL58443A0 (en)
IT (1) IT1123839B (en)
NL (1) NL7907625A (en)
SE (1) SE7908485L (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6041478B2 (en) * 1979-09-10 1985-09-17 富士通株式会社 Manufacturing method of semiconductor laser device
CA1201520A (en) * 1982-09-10 1986-03-04 Charles A. Burrus, Jr. Fabrication of cleaved semiconductor lasers
DE3435306A1 (en) * 1984-09-26 1986-04-03 Siemens AG, 1000 Berlin und 8000 München METHOD FOR PRODUCING LASER DIODES WITH JUTTED INTEGRATED HEAT SINK
JPH01280388A (en) * 1988-05-06 1989-11-10 Sharp Corp Manufacture of semiconductor element
DE3826736A1 (en) * 1988-08-05 1990-02-08 Siemens Ag METHOD FOR SEPARATING LED CHIP ARRANGEMENTS MONOLITHICALLY PRODUCED ON A SEMICONDUCTOR SUB Wafer
JPH07176827A (en) * 1993-08-20 1995-07-14 Mitsubishi Electric Corp Manufacturing method of semiconductor laser device with modulator
US5418190A (en) * 1993-12-30 1995-05-23 At&T Corp. Method of fabrication for electro-optical devices
DE102017117136B4 (en) 2017-07-28 2022-09-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Method of manufacturing a plurality of laser diodes and laser diode
DE102017012441B4 (en) * 2017-07-28 2025-08-07 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Method for producing a plurality of laser diodes and laser diode

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3471923A (en) * 1966-12-09 1969-10-14 Rca Corp Method of making diode arrays

Also Published As

Publication number Publication date
IT7926486A0 (en) 1979-10-12
GB2035684A (en) 1980-06-18
SE7908485L (en) 1980-04-14
IT1123839B (en) 1986-04-30
IL58443A0 (en) 1980-01-31
FR2438914A1 (en) 1980-05-09
NL7907625A (en) 1980-04-15
DE2941476A1 (en) 1980-04-24
CA1140661A (en) 1983-02-01

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee