GB2032462B - Electroless copper depositon at faster rates - Google Patents

Electroless copper depositon at faster rates

Info

Publication number: GB2032462B
Authority: GB; United Kingdom
Prior art keywords: depositon; electroless copper; faster rates; faster; rates
Prior art date: 1978-09-13
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

GB7930740A

Other versions

GB2032462A (en

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Kollmorgen Technologies Corp

Original Assignee

Kollmorgen Technologies Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1978-09-13

Filing date

1979-09-05

Publication date

1983-05-18

1979-09-05 Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp

1980-05-08 Publication of GB2032462A publication Critical patent/GB2032462A/en

1983-05-18 Application granted granted Critical

1983-05-18 Publication of GB2032462B publication Critical patent/GB2032462B/en

Status Expired legal-status Critical Current

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)
Manufacturing Of Printed Wiring (AREA)
Electroplating And Plating Baths Therefor (AREA)

GB7930740A 1978-09-13 1979-09-05 Electroless copper depositon at faster rates Expired GB2032462B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US94191278A	1978-09-13	1978-09-13

Publications (2)

Publication Number	Publication Date
GB2032462A GB2032462A (en)	1980-05-08
GB2032462B true GB2032462B (en)	1983-05-18

Family

ID=25477278

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB7930740A Expired GB2032462B (en)	1978-09-13	1979-09-05	Electroless copper depositon at faster rates

Country Status (17)

Country	Link
JP (2)	JPS5927379B2 (en)
AT (1)	AT366105B (en)
AU (1)	AU532144B2 (en)
BR (1)	BR7905066A (en)
CA (1)	CA1135903A (en)
CH (1)	CH646200A5 (en)
DE (1)	DE2937297C2 (en)
DK (1)	DK148920C (en)
ES (1)	ES484158A1 (en)
FR (1)	FR2436192A1 (en)
GB (1)	GB2032462B (en)
IL (1)	IL58202A (en)
IT (1)	IT1162420B (en)
MX (1)	MX152657A (en)
NL (1)	NL189523C (en)
SE (1)	SE7907531L (en)
ZA (1)	ZA793786B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7905994B2 (en)	2007-10-03	2011-03-15	Moses Lake Industries, Inc.	Substrate holder and electroplating system
US8262894B2 (en)	2009-04-30	2012-09-11	Moses Lake Industries, Inc.	High speed copper plating bath
CN110607519A (en) *	2018-06-15	2019-12-24	罗门哈斯电子材料有限责任公司	Electroless copper plating composition and method for electroless copper plating on a substrate

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
NL8005024A (en) *	1980-09-05	1982-04-01	Philips Nv	METHOD FOR MANUFACTURING COPPER ALLOY LAYERS AND PATTERNS ON SUBSTRATES AND PRODUCTS MADE THEREFORE
EP0179212B1 (en) *	1984-09-27	1991-12-27	Kabushiki Kaisha Toshiba	Chemical copper plating solution
ES2039403T3 (en) *	1986-10-31	1993-10-01	Amp-Akzo Corporation (A Delaware Corp.)	METHOD FOR DEPOSITING WITHOUT ELECTRICITY HIGH QUALITY COPPER.
JPH0723539B2 (en) *	1986-11-06	1995-03-15	日本電装株式会社	Chemical copper plating solution and method for forming copper plating film using the same
JP2615682B2 (en) *	1986-11-14	1997-06-04	株式会社デンソー	Chemical copper plating solution
US4814009A (en) *	1986-11-14	1989-03-21	Nippondenso Co., Ltd.	Electroless copper plating solution
AU3304389A (en) *	1988-04-29	1989-11-02	Kollmorgen Corporation	Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
JP2595319B2 (en) *	1988-07-20	1997-04-02	日本電装株式会社	Chemical copper plating solution and method for forming copper plating film using the same
JPH036383A (en) *	1989-06-02	1991-01-11	Nippondenso Co Ltd	Chemical copper plating solution
JPH0448100A (en) *	1990-06-15	1992-02-18	Nkk Corp	cleaning equipment
JP5255015B2 (en) *	2010-04-28	2013-08-07	名古屋メッキ工業株式会社	Electroless copper plating method for polymer fiber
JP5780920B2 (en) *	2011-10-31	2015-09-16	新光電気工業株式会社	Electroless copper plating bath
US20190382901A1 (en) *	2018-06-15	2019-12-19	Rohm And Haas Electronic Materials Llc	Electroless copper plating compositions and methods for electroless plating copper on substrates
WO2022043417A1 (en) *	2020-08-27	2022-03-03	Atotech Deutschland GmbH & Co. KG	A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization
CN113881984B (en) *	2021-10-21	2022-09-16	深圳市励高表面处理材料有限公司	Pulse electroplating leveling agent, preparation method and electroplating solution applying leveling solution
CN117385348A (en) *	2023-09-11	2024-01-12	广东利尔化学有限公司	A kind of copper precipitation liquid and stabilizer

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3222195A (en) *	1962-02-23	1965-12-07	Pearlstein Fred	Stabilized electroless copper solution
US3361580A (en) *	1963-06-18	1968-01-02	Day Company	Electroless copper plating
US3377174A (en) *	1963-10-24	1968-04-09	Torigai Eiichi	Method and bath for chemically plating copper
CH491206A (en) *	1966-02-01	1970-05-31	Photocircuits Corp	Bath solution for electroless deposition of metal layers
US3720525A (en) *	1971-08-16	1973-03-13	Rca Corp	Electroless copper plating solutions with accelerated plating rates
US3708329A (en) *	1971-09-10	1973-01-02	Bell Telephone Labor Inc	Electroless copper plating
US3915718A (en) *	1972-10-04	1975-10-28	Schering Ag	Chemical silver bath
US3793038A (en) *	1973-01-02	1974-02-19	Crown City Plating Co	Process for electroless plating
JPS5173933A (en) *	1974-12-25	1976-06-26	Mitsubishi Rayon Co	MUDENKAIDOMETSUKYOKU
JPS5746448B2 (en) *	1975-03-14	1982-10-04
JPS5217335A (en) *	1975-08-01	1977-02-09	Hitachi Ltd	Chemical copper plating solution
JPS5288227A (en) *	1976-01-19	1977-07-23	Hitachi Ltd	Chemical copper plating solution
IT1059950B (en) *	1976-04-30	1982-06-21	Alfachimici Spa	COMPOSITION FOR AUTOCATALYTIC ANELECTRIC COPPERING
JPS56156749A (en) *	1980-05-08	1981-12-03	Toshiba Corp	Chemical copper plating solution

1979
- 1979-07-12 CA CA000331706A patent/CA1135903A/en not_active Expired
- 1979-07-24 ZA ZA00793786A patent/ZA793786B/en unknown
- 1979-08-01 MX MX178747A patent/MX152657A/en unknown
- 1979-08-03 AU AU49567/79A patent/AU532144B2/en not_active Ceased
- 1979-08-07 BR BR7905066A patent/BR7905066A/en not_active IP Right Cessation
- 1979-09-05 GB GB7930740A patent/GB2032462B/en not_active Expired
- 1979-09-07 IL IL58202A patent/IL58202A/en unknown
- 1979-09-11 SE SE7907531A patent/SE7907531L/en unknown
- 1979-09-11 IT IT50227/79A patent/IT1162420B/en active
- 1979-09-12 CH CH826779A patent/CH646200A5/en not_active IP Right Cessation
- 1979-09-12 DK DK381979A patent/DK148920C/en not_active IP Right Cessation
- 1979-09-12 AT AT0600879A patent/AT366105B/en not_active IP Right Cessation
- 1979-09-12 DE DE2937297A patent/DE2937297C2/en not_active Expired
- 1979-09-13 ES ES484158A patent/ES484158A1/en not_active Expired
- 1979-09-13 NL NLAANVRAGE7906856,A patent/NL189523C/en not_active IP Right Cessation
- 1979-09-13 JP JP54118651A patent/JPS5927379B2/en not_active Expired
- 1979-09-13 FR FR7922867A patent/FR2436192A1/en active Granted
1983
- 1983-06-21 JP JP58112590A patent/JPS5915981B2/en not_active Expired

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7905994B2 (en)	2007-10-03	2011-03-15	Moses Lake Industries, Inc.	Substrate holder and electroplating system
US8262894B2 (en)	2009-04-30	2012-09-11	Moses Lake Industries, Inc.	High speed copper plating bath
CN110607519A (en) *	2018-06-15	2019-12-24	罗门哈斯电子材料有限责任公司	Electroless copper plating composition and method for electroless copper plating on a substrate
CN110607519B (en) *	2018-06-15	2021-07-23	罗门哈斯电子材料有限责任公司	Electroless copper plating compositions and methods for electroless copper plating on substrates

Also Published As

Publication number	Publication date
BR7905066A (en)	1980-04-29
JPS5915981B2 (en)	1984-04-12
ATA600879A (en)	1981-07-15
IT7950227A0 (en)	1979-09-11
DE2937297C2 (en)	1982-04-08
IL58202A0 (en)	1979-12-30
JPS5925965A (en)	1984-02-10
FR2436192B1 (en)	1983-08-26
DK381979A (en)	1980-03-14
NL189523C (en)	1993-05-03
MX152657A (en)	1985-10-07
NL7906856A (en)	1980-03-17
IT1162420B (en)	1987-04-01
JPS5927379B2 (en)	1984-07-05
ZA793786B (en)	1980-07-30
DK148920B (en)	1985-11-18
DE2937297A1 (en)	1980-03-20
CH646200A5 (en)	1984-11-15
AT366105B (en)	1982-03-10
CA1135903A (en)	1982-11-23
ES484158A1 (en)	1980-09-01
FR2436192A1 (en)	1980-04-11
IL58202A (en)	1982-08-31
AU4956779A (en)	1980-03-20
JPS5565355A (en)	1980-05-16
AU532144B2 (en)	1983-09-22
DK148920C (en)	1986-05-05
GB2032462A (en)	1980-05-08
SE7907531L (en)	1980-03-14

Publication	Publication Date	Title
GB2037327B (en)	1983-11-09	Electroless copper deposition
DE2964079D1 (en)	1982-12-30	An electroless copper plating process
GB2021648B (en)	1983-03-30	Electroless deposition of copper
GB2032462B (en)	1983-05-18	Electroless copper depositon at faster rates
GB2039534B (en)	1983-04-13	Electroless tin-plating solutions
DE3367940D1 (en)	1987-01-15	Electroless copper deposition solution
DE3066952D1 (en)	1984-04-19	Electroless copper plating solution
GB2034146B (en)	1983-05-05	Delay circuit
JPS5496422A (en)	1979-07-30	Copper based alloy
GB2025591B (en)	1982-08-18	Meltingfunace for copper
JPS5534699A (en)	1980-03-11	Silver plating
AU509685B2 (en)	1980-05-22	Electroless Copper Plating
JPS5370931A (en)	1978-06-23	Nonnelectrolytic copper plating method
AU544591B2 (en)	1985-06-06	Electroless copper plating
JPS54117329A (en)	1979-09-12	Electroless plating method
JPS5741363A (en)	1982-03-08	Electroless plating device
GB2015690B (en)	1982-06-03	Pipes incorporating electrical conductors
AU1663376A (en)	1978-02-09	Electroless plating
JPS54124834A (en)	1979-09-28	Partly electroless plating method
JPS5285935A (en)	1977-07-16	Peeling solution for copper plating
GB2031022B (en)	1982-12-01	Copper foilplastic compsites
GB1555434A (en)	1979-11-07	Electroless copper plating solutions
JPS5687659A (en)	1981-07-16	Electroless plating device
ZA77431B (en)	1977-12-28	Electroless copper plating
JPS54112340A (en)	1979-09-03	Electroless plating method

Legal Events

Date	Code	Title	Description
1987-04-23	PCNP	Patent ceased through non-payment of renewal fee
1988-02-24	PE20	Patent expired after termination of 20 years	Free format text: 5120,PAGE 977
1992-02-12	732	Registration of transactions, instruments or events in the register (sect. 32/1977)
1994-05-04	PCNP	Patent ceased through non-payment of renewal fee	Effective date: 19930905