GB2030781B - Multilayer printed circuit - Google Patents

Multilayer printed circuit

Info

Publication number: GB2030781B
Authority: GB; United Kingdom
Prior art keywords: printed circuit; multilayer printed; multilayer; circuit; printed
Prior art date: 1978-09-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

GB7929756A

Other versions

GB2030781A (en

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

STC PLC

Original Assignee

Standard Telephone and Cables PLC

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1978-09-07

Filing date

1979-08-28

Publication date

1982-10-13

1979-08-28 Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC

1980-04-10 Publication of GB2030781A publication Critical patent/GB2030781A/en

1982-10-13 Application granted granted Critical

1982-10-13 Publication of GB2030781B publication Critical patent/GB2030781B/en

Status Expired legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Manufacturing Of Printed Wiring (AREA)

GB7929756A 1978-09-07 1979-08-28 Multilayer printed circuit Expired GB2030781B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE19782838982 DE2838982B2 (en)	1978-09-07	1978-09-07	Method of manufacturing multilevel printed circuit boards

Publications (2)

Publication Number	Publication Date
GB2030781A GB2030781A (en)	1980-04-10
GB2030781B true GB2030781B (en)	1982-10-13

Family

ID=6048893

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB7929756A Expired GB2030781B (en)	1978-09-07	1979-08-28	Multilayer printed circuit

Country Status (7)

Country	Link
BE (1)	BE878645A (en)
DE (1)	DE2838982B2 (en)
ES (1)	ES483975A1 (en)
FR (1)	FR2447131A1 (en)
GB (1)	GB2030781B (en)
NL (1)	NL7906603A (en)
SE (1)	SE7907298L (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4715894A (en) *	1985-08-29	1987-12-29	Techno Instruments Investments 1983 Ltd.	Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
US4816070A (en) *	1985-08-29	1989-03-28	Techo Instruments Investments Ltd.	Use of immersion tin and alloys as a bonding medium for multilayer circuits
JPS6276600A (en) *	1985-09-29	1987-04-08	株式会社　アサヒ化学研究所	Forming method for conductive circuit on substrate
SE455148B (en) *	1985-11-15	1988-06-20	Leeb Karl Erik	DEVICE CONTAINING A SUBSTRATE AND DERPA APPLICATED CONDUCTING SAMPLES FOR THE PREPARATION OF SAMPLE CARDS AND PROCEDURE FOR PREPARING THE DEVICE
GB8630392D0 (en) *	1986-12-19	1987-01-28	Prestwick Circuits Ltd	Producing printed circuit boards
US4804575A (en) *	1987-01-14	1989-02-14	Kollmorgen Corporation	Multilayer printed wiring boards
JPH03196691A (en) *	1989-12-26	1991-08-28	Cmk Corp	Method of forming an insulating layer on a printed wiring board
DE4237611A1 (en) *	1992-11-09	1994-05-11	Lueberg Elektronik Gmbh & Co R	Circuit board prodn. and circuit board - uses further layer of resin-impregnated fabric to cover conductive paths formed on composite baseboard

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB892451A (en) *	1957-12-03	1962-03-28	Radio And Allied Ind Ltd	Improvements in and relating to the manufacture of printed circuits
US3349162A (en) *	1965-08-23	1967-10-24	Automatic Elect Lab	Intra-connection techniques for multilayer printed wiring boards
DE1924775B2 (en) *	1969-05-14	1971-06-09		METHOD OF MANUFACTURING A CIRCUIT BOARD
GB1310880A (en) *	1969-06-13	1973-03-21	Microponent Dev Ltd	Multi-layer printed circuit board assemblies

1978
- 1978-09-07 DE DE19782838982 patent/DE2838982B2/en not_active Ceased
1979
- 1979-08-28 GB GB7929756A patent/GB2030781B/en not_active Expired
- 1979-09-03 SE SE7907298A patent/SE7907298L/en not_active Application Discontinuation
- 1979-09-04 NL NL7906603A patent/NL7906603A/en not_active Application Discontinuation
- 1979-09-07 ES ES483975A patent/ES483975A1/en not_active Expired
- 1979-09-07 BE BE2/58053A patent/BE878645A/en not_active IP Right Cessation
- 1979-09-07 FR FR7922427A patent/FR2447131A1/en not_active Withdrawn

Also Published As

Publication number	Publication date
DE2838982A1 (en)	1980-03-20
DE2838982B2 (en)	1980-09-18
GB2030781A (en)	1980-04-10
NL7906603A (en)	1980-03-11
FR2447131A1 (en)	1980-08-14
ES483975A1 (en)	1980-04-01
SE7907298L (en)	1980-03-08
BE878645A (en)	1980-03-07

Publication	Publication Date	Title
JPS57132399A (en)	1982-08-16	Multilayer circuit board
GB2032190B (en)	1983-03-23	Printed circuit boards
JPS5544776A (en)	1980-03-29	Printed circuit board
JPS54158661A (en)	1979-12-14	Printed circuit board
GB2026250B (en)	1982-04-07	Printed circuit boards
GB2030781B (en)	1982-10-13	Multilayer printed circuit
JPS5550684A (en)	1980-04-12	Printed circuit board
JPS5559796A (en)	1980-05-06	Multilayer printed circuit board
GB2025146B (en)	1982-08-04	Printed circuit board
JPS54158669A (en)	1979-12-14	Printed circuit board
JPS54161066A (en)	1979-12-20	Printed circuit board
JPS5548995A (en)	1980-04-08	Printed circuit board
GB2026918B (en)	1982-11-03	Componentcarring printed circuit board
JPS54135368A (en)	1979-10-20	Printed circuit board
JPS5513977A (en)	1980-01-31	Printed circuit board
JPS5513976A (en)	1980-01-31	Printed circuit board
JPS54129361A (en)	1979-10-06	Printed circuit board
JPS54135364A (en)	1979-10-20	Printed circuit board
JPS5571091A (en)	1980-05-28	Multilayer circuit board
JPS5513974A (en)	1980-01-31	Printed circuit board
JPS5574197A (en)	1980-06-04	Moistureerpoof printed circuit board
JPS5513920A (en)	1980-01-31	Printed circuit board
JPS5497779A (en)	1979-08-02	Printed circuit board
JPS54135366A (en)	1979-10-20	Printed circuit board
JPS5565491A (en)	1980-05-16	Printed circuit board

Legal Events

Date	Code	Title	Description
1989-04-19	PCNP	Patent ceased through non-payment of renewal fee