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GB202401389D0 - Apparatus for processing a wafer-shaped article and gripping pin - Google Patents

Apparatus for processing a wafer-shaped article and gripping pin

Info

Publication number
GB202401389D0
GB202401389D0 GBGB2401389.8A GB202401389A GB202401389D0 GB 202401389 D0 GB202401389 D0 GB 202401389D0 GB 202401389 A GB202401389 A GB 202401389A GB 202401389 D0 GB202401389 D0 GB 202401389D0
Authority
GB
United Kingdom
Prior art keywords
wafer
processing
shaped article
gripping pin
gripping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB2401389.8A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research AG
Original Assignee
Lam Research AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research AG filed Critical Lam Research AG
Priority to GBGB2401389.8A priority Critical patent/GB202401389D0/en
Publication of GB202401389D0 publication Critical patent/GB202401389D0/en
Priority to PCT/EP2025/050346 priority patent/WO2025162688A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H10P72/7608—
GBGB2401389.8A 2024-02-02 2024-02-02 Apparatus for processing a wafer-shaped article and gripping pin Ceased GB202401389D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GBGB2401389.8A GB202401389D0 (en) 2024-02-02 2024-02-02 Apparatus for processing a wafer-shaped article and gripping pin
PCT/EP2025/050346 WO2025162688A1 (en) 2024-02-02 2025-01-08 Apparatus for processing a wafer-shaped article and gripping pin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB2401389.8A GB202401389D0 (en) 2024-02-02 2024-02-02 Apparatus for processing a wafer-shaped article and gripping pin

Publications (1)

Publication Number Publication Date
GB202401389D0 true GB202401389D0 (en) 2024-03-20

Family

ID=90236389

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB2401389.8A Ceased GB202401389D0 (en) 2024-02-02 2024-02-02 Apparatus for processing a wafer-shaped article and gripping pin

Country Status (2)

Country Link
GB (1) GB202401389D0 (en)
WO (1) WO2025162688A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100200163A1 (en) 2007-07-13 2010-08-12 Lam Research Ag Apparatus and method for wet treatment of disc-like articles
US20100206481A1 (en) 2007-08-30 2010-08-19 Sez Ag Apparatus for wet treatment of plate-like articles
US20120298149A1 (en) 2011-05-27 2012-11-29 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
US20140097580A1 (en) 2012-10-10 2014-04-10 Lam Research Ag Apparatus for liquid treatment of wafer shaped articles
US20170323823A1 (en) 2016-05-06 2017-11-09 Lam Research Ag Method and apparatus for processing wafer-shaped articles

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100809594B1 (en) * 2006-09-12 2008-03-04 세메스 주식회사 Chucking member and spin head including same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100200163A1 (en) 2007-07-13 2010-08-12 Lam Research Ag Apparatus and method for wet treatment of disc-like articles
US20100206481A1 (en) 2007-08-30 2010-08-19 Sez Ag Apparatus for wet treatment of plate-like articles
US20120298149A1 (en) 2011-05-27 2012-11-29 Lam Research Ag Method and apparatus for liquid treatment of wafer shaped articles
US20140097580A1 (en) 2012-10-10 2014-04-10 Lam Research Ag Apparatus for liquid treatment of wafer shaped articles
US20170323823A1 (en) 2016-05-06 2017-11-09 Lam Research Ag Method and apparatus for processing wafer-shaped articles

Also Published As

Publication number Publication date
WO2025162688A1 (en) 2025-08-07

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)